TWI304758B - - Google Patents

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Publication number
TWI304758B
TWI304758B TW95129132A TW95129132A TWI304758B TW I304758 B TWI304758 B TW I304758B TW 95129132 A TW95129132 A TW 95129132A TW 95129132 A TW95129132 A TW 95129132A TW I304758 B TWI304758 B TW I304758B
Authority
TW
Taiwan
Prior art keywords
cutting
laser
wafer
sub
light
Prior art date
Application number
TW95129132A
Other languages
English (en)
Chinese (zh)
Other versions
TW200808479A (en
Inventor
Hung-Lung Chen
yu-lin Xu
Ji-Zhan Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW95129132A priority Critical patent/TW200808479A/zh
Publication of TW200808479A publication Critical patent/TW200808479A/zh
Application granted granted Critical
Publication of TWI304758B publication Critical patent/TWI304758B/zh

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  • Laser Beam Processing (AREA)
TW95129132A 2006-08-09 2006-08-09 laser beam splitting wafer system TW200808479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95129132A TW200808479A (en) 2006-08-09 2006-08-09 laser beam splitting wafer system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95129132A TW200808479A (en) 2006-08-09 2006-08-09 laser beam splitting wafer system

Publications (2)

Publication Number Publication Date
TW200808479A TW200808479A (en) 2008-02-16
TWI304758B true TWI304758B (https=) 2009-01-01

Family

ID=44766919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95129132A TW200808479A (en) 2006-08-09 2006-08-09 laser beam splitting wafer system

Country Status (1)

Country Link
TW (1) TW200808479A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5495511B2 (ja) * 2008-05-27 2014-05-21 株式会社ディスコ ウエーハの分割方法
US9852997B2 (en) * 2016-03-25 2017-12-26 Applied Materials, Inc. Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
CN114654109B (zh) * 2022-04-09 2023-03-28 法特迪精密科技（苏州）有限公司 Mems探针硅片切割方法

Also Published As

Publication number Publication date
TW200808479A (en) 2008-02-16

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees