200807304 • 九、發明說明: ▲ 【發明所屬之技術領域】 • 本發明係有關於一種射頻辨識標籤之封裝方法，尤指 一種直接且同時壓合及硬化多顆晶粒與基材導電圖案之封 裝方法，可提高電子產品之單位時間產能，且產品良率高， 適用於通訊、資料儲存、射頻辨識標簽等相關電子產品技 術領域。 【先前技術】 無線射頻辨識（Radio Frequency Identification， RFID)，是一種運用無線電波傳輸訊息之非接觸式自動辨識 技術，通過射頻信號自動辨識目標物件並獲取相關資料， 辨識工作無須人工干預，可工作於各種環境，近年來，其 發展技術已漸趨成熟並有取代傳統條碼系統之勢。 一般無線射頻辨識系統主要包括讀取機（Reader)、標 藏（Tag)以及電腦系統三大部分，其中，標籤之作用在於可 存放資料並發送可供讀取器讀取之辨識碼，而標籤則係由 結合有RF電路、邏輯電路及記憶體之晶片、天線及其他元 件所構成，目前已知標籤結構，依其材質厚薄不同，又分 為不可撓與可撓兩類，如圖一及圖二所示，係為厚且不可 撓之標籤結構。 圖一所示該標籤10，係藉熱耦合之方式以環氧化物或 共熔合金為黏著劑將晶粒11黏著於一基材16上，於該晶 200807304 =11上叹有接點12，再於該接點12連接導線14至基材 ’、m 、導線14 ’即可完成該標籤10之封裝。 ，二所示該標籤2G，係於—基材沈上設有晶粒Μ， :::粒2…妾點22，再於該接點_塗佈黏 曰i五與5亥基材26相對應位置所設之接點25相互黏合， 取後再以封裝材料^ θ I 。 _ 即可完成該標籤2G之封卜接點22、接點25， —料兩㈣統標籤之封裝結構，均存細下缺點： 度極厚且不可撓，以圖—所示標籤μ而言，其—般 f ^ 1 1.5_左右，而圖二所示標籤2〇之厚度為 薄形:=中因此無應用於信用卡、㈣ 二、材其=二 、包固木上，經由加熱、加壓使之硬化， 以達成所需之封裝強度，但一次僅能拾取一顆晶粒進 —仃封裝，導致生產率無法提升。 二、：Z方:複雜，且需要中間步驟(如黏著、接線等步 四、 由於制可70成’不僅生產效能低’且製作成本高。 由^程㈣’故所需之控制條件亦較為 增加所需製作成本，降低市場競爭力。 口而 五、 ：粒封裝之再現性控制因素較為複雜，故品管不易控 性標籤結構，因此有薄而具撓 減封衣之結構’如圖三所示中華民國新型專利申請 7 200807304 案號第86214751號「於薄而撓性之封 憶體」，其具有一可撓之基材 ^々射錢路與記 聚酿亞胺或聚醋等材質之薄膜，於^=係為有機體、 體成型有薄型銅質天線33，將 虫刻或電鍍一 ㈣之-面朝向糊，再 線3 3相互連結電性導通而完成晶粒 :曰立二 施例結構尚包括上下兩疊層36,該疊層上圖不；貫 合物質之外覆層39，於外覆層39之内側面二^貝聚 =1天:由鐘可使疊層36相-接解 相万、“+者’该專利亦揭露有關該晶粒31金天線扪 連、、，。之方^ ’包括熱壓縮連結、超音 社 料熱熔連結、導體黏著連結 ：-1、銲 知技術手段，故在此不予贅述:=:=於習 取-顆曰封裝製程卻仍舊—次僅能拾 提升生=率 對一顆晶粒進行封裝，並無法有效 民對提高生產效率之主要需求，目前已知專利有中華 專，請案號第.咖⑽號「用於射頻』S 組裝的方法與設備」，該案係提供—種轉二 夕顆晶粒之方法與設備，如其說明書中述及，習知技； 二:固地挑選及放置晶粒於基底上，故產量不佳技= 指失'因Γ卜一次拾取兩粒或更多晶粒而造成額外晶粒之 晶圓㈣亥案所提供之技術手段則可同時將多數晶粒由 曰曰' Τ夕至另一表面或任何兩表面之間，因而可大幅縮減 200807304 拾取及放置晶粒之步驟及時間，達到提升生產量之目的。 配合上述一次轉移多顆晶粒之步驟，該案所提供封裝 晶粒之方式，係包含： (a) 從一支撐表面轉移多數晶粒至一晶片載具，其具有 多數可存取於晶片載具之一第一表面上的胞，以致其多數 晶粒之各晶粒駐存於多數胞之一相應胞中且係凹陷在相關 於第一表面之相應胞中；及 (b) 塗敷填充材料於多數胞之各胞中，以實質上覆蓋相 應胞中之各晶粒。 (c) 定位晶片載具之第一表面緊鄰於一具有多數標籤 基底部分之基底結構的一表面； (d) 衝壓晶片載具之一第二表面鄰近一相反於多數胞 之各胞的位置以移動各晶粒離開相應的胞，以致其覆蓋各 晶粒之第一表面的填充材料接觸多數標籤基底部分之一相 應標戴基底，及 (e) 安裝各晶粒之第一表面至相應的標籤基底以致其 各晶粒之至少一接觸墊被電耦合至相應標籤基底之至少一 相應接觸墊。其中，該步驟（e)尚包含一填充材料之硬化步 驟。 根據上述封裝步驟，該專利又提出分別如圖四及圖五 所示兩種不同態樣之具體封裝方法，其相異點在於晶粒之 接觸墊朝向不同；如圖四所示，晶粒42a、42b之接觸墊 421a、421b係朝向支撐表面421之外部，於該標籤基底46 朝向晶粒42a之面上設置有天線461，緊鄰該標籤基底46 設有一衝壓帶40，藉由一衝壓構件41將晶粒42a衝出支 9 200807304 撐表面421時’可同時將填充材料44a推向標籤基底46， 待接觸墊421a與天線461接觸後，再將填充材料44a硬 化，如此，即可將晶粒42a封裝於標籤基底46上，且接觸 墊421a與天線461相互耦接；至於圖五所示實施態樣，其 晶粒52a、52b之接觸墊521a、521b則朝向支撐表面521， 其係於該標籤基底56朝向晶粒528之面上設置有天線 561，於相對應於晶粒52a處設有胞562，該胞562之深度 係可谷納日日粒5 2 a ’緊鄰该標戴基底5 6設有一衝壓帶5 0， 同樣地，藉由一衝壓構件51將晶粒52a衝出支撐表面521 時’可同時將填充材料54a推向標籤基底56，待晶粒52a 完全移入胞562後，再將填充材料54a硬化，最後再於接 觸墊521a與天線561上成型電導體（圖中未示出），使接觸 墊421a與天線461相互耦接，如此，即可將晶粒52a封裝 於標籤基底56上。 值得注意的是，即使接觸墊朝向不同，其封裝方法均 係先將晶粒衝出支撐表面與標籤基底接觸，藉由晶粒擠出 填充材料，最後將填充材料硬化，而此種封裝方法所存在 之最主要缺失在於，該填充材料未完全硬化前，容易產生 晶粒與標籤基底無法緊密貼合之狀況，因而導致下列狀況： 、以圖四之態樣而言，因而使得晶粒42a與天線461無 法接觸導通； 、固五之恕樣而言，由於晶粒52a浮凸，因而造成後 績電導體成型之困難； 二、於填充材料硬化過程中，容易造成晶粒移位； 四、晶粒擠出填充材料之份量不均。 200807304 據此可知，前述專利雖可一次轉移多顆晶粒，但卻使 得產品不良率提高。 【發明内容】 有鑑於習知技術之缺失，本發明之主要目的在於提出 一種射頻辨識標籤之封裝方法，直接且同時壓合及硬化多 顆晶粒與導電圖案，可提高電子產品之單位時間產能，且 產品良率高。 為達到上述目的，本發明提出一種射頻辨識標籤之封 裝方法，其包含： a. 於複數晶粒與導電圖案之間設置黏合材料； b. 將該複數晶粒與導電圖案相互黏附； c. 提供壓力使晶粒與導電圖案相互迫緊’於晶粒與導電圖 案持續迫緊之過程中，同時提供能量使黏合材料硬化。 較佳地，該步驟a之黏合材料係設置於晶粒上。 較佳地，該晶粒具有具導電性之凸塊，係用以與導電 圖案相接觸以構成電性導通。 較佳地，該步驟a之黏合材料係設置於該晶粒具有凸 塊之面上。 較佳地，該步驟a之黏合材料係設置於導電圖案上。 較佳地，該步驟a之黏合材料係設置於晶粒及導電圖 案上。 較佳地’該步驟a之黏合材料係為導電材料。 200807304 較佳地，該步驟a之黏合材料係為非導電材料。 較佳地，該步驟a之黏合材料係為内含導電粒子之非 導電材料。 較佳地，該步驟c係藉由一壓合機構以提供使晶粒與 導電圖案相互迫緊之壓力。 較佳地，該壓合機構係包括： 至少一承載件，係設置於該基材不具有導電圖案之一 面，用以承載基材， 至少一相對件，係設置於該基材具有導電圖案之一面； 該承載件與該相對件可作相互貼合或分離之相對運 動，以將該晶粒及基材夾合於該承載件與相對件之間，使 該晶粒與導電圖案相互迫緊。 較佳地，該承載件係為靜止之固定件，該相對件係為 可作往復運動之活動件，藉由該相對件朝向該承載件運 動，可使該晶粒與導電圖案相互迫緊。 較佳地，該承載件係為可作往復運動之活動件，該相 對件係為靜止之固定件，藉由該相對件朝向該承載件運 動，可使該晶粒與導電圖案相互迫緊。 較佳地，該承載件與該相對件均為可作往復運動之活 動件，藉由該承載件與該相對件朝向運動，可使該晶粒與 導電圖案相互迫緊。 較佳地，其係設置有複數之相對件，每一相對件係相 對應於至少一晶粒。 較佳地，該複數之相對件係可作不同步往復運動。 200807304 . 較佳地，該步驟C中使黏合材料硬化之能量係由一能 量源提供，可同時硬化複數晶粒之黏合材料。 較佳地，該步驟C中使黏合材料硬化之能量係由複數 ^ 之能量源提供，每一晶粒具有相對應之能量源。 較佳地，於該步驟C中使黏合材料硬化之能量可為聲 波、光能或熱能其中之一或其組合。 較佳地，該基材之形狀係為個別分離之片狀（Sheet)， φ 於該基材上設有陣列之導電圖案。 較佳地，該基材之形狀係為連續可捲繞成捲（Reel)之 帶狀，於該基材上設有陣列之導電圖案。 較佳地，該基材之材質可為PET(Polyester)、 Pl(Polyimide)、FR4 等塑膠薄膜。 較佳地，該導電圖案之材質可為單一導電金屬、具有 複數種類導電金屬之合金其中之一或其組合。 為使貴審查委員對於本發明之結構目的和功效有更 馨進一步之了解與認同，茲配合圖示詳細說明如后。 【實施方式】 以下將參照隨附之圖式來描述本發明為達成目的所使 用的技術手段與功效，而以下圖式所列舉之實施例僅為辅 助說明，以利貴審查委員瞭解，但本案之技術手段並不限 於所列舉圖式。 請先參閱圖六A至圖六C係本發明之單位晶粒之較佳 實施例之前視、俯視及側視圖，該晶粒60之底面設有複數 200807304 . 之具導電性之凸塊61，該凸塊61係用以與封裝表面之導 電圖案相接觸以構成電性導通’以無線射頻辨識標戴而 I 言，其導電圖案即為天線，但不以此為限；再請參閱圖七 ^ A至圖七C所示本發明之單位導電圖案之較佳實施例之前 視、俯視及侧視圖，該導電圖案7 0概呈一矩形，其具有分 離之兩導腳71a、71b，該導電圖案70係設置於一基材72 上，該導電圖案70之材質可為單一導電金屬、具有複數種 類導電金屬之合金其中之一或其組合，該基材72可為可撓 ⑩ 或不可撓之不導電材質，然以可撓之PET(Polyester)、 PKPolyimide)、FR4等塑膠薄膜材質為佳，有關該導電圖 案7 0之設置型恶有多種’清茶閱圖八至圖十5如圖八所不 該導電圖案70係行列於一呈長條帶狀之基材72a上，而圖 九所示該導電圖案70係複數陣列於一分離之矩形片狀 (Sheet)之基材72b上，而圖十所示該導電圖案70係複數 陣列於一呈長條帶狀之基材72c上，當圖八及圖十所示長 條帶狀基材72a、72c為可撓之塑膠薄膜材質時，則可將其 • 捲繞成捲（Reel)，不僅可縮小體積、減少所佔空間，且利 於連續作業；至於該導電圖案70之設置方式，圖九係呈 4x4矩形陣列，圖十則平行連續設置有四行，然可依實際 機台或基材面積不同而變化，不以圖示為限。 ， 請續參閱圖十一 A及圖十一 B，係顯示以圖六系列之 晶粒6· 0與圖八所不長條帶狀基材7 2 a之導電圖案7 0相互 配合之俯視圖.及前視圖，該晶粒60之兩導電性之凸塊61 係分別設置於該導電圖案70之兩導腳71a、71b上，於該 該晶粒60與談導電圖案70之間設置有黏合材料80，該黏 14 200807304 . 合材料80可設置於該晶粒60具有凸塊61之面上，或設置 於該導電圖案70之兩導腳71 a、71 b上’亦可以同時設置 ‘ 於該晶粒60與該導電圖案70相對黏合之面上，該黏合材 ^ 料80可為導電材料、非導電材料，或内含導電粒子之非導 電材料，依實際作業所需而設定，例如採用非導電性熱硬 化膠時，係經由加熱、加壓硬化達成需要封裝強度，若為 具導電性之導電膠，透過内含之導電粒子，可以加熱或加 壓方式達成硬化並導通之效果，以圖十一 B所示狀態，該 _ 晶粒60之凸塊61與該導電圖案70尚未經加壓作業接觸導 通，兩者之間仍具有一間距d。 請續參閱圖十二A及圖十二B，係顯示對晶粒60與導 電圖案70進行加壓之壓合機構較佳實施例之動作示意 圖，該壓合機構90係包括分別設置於該基材72a之底面及 頂面之一承載件91以及一相對件92，由於一般作業習慣 係將該基材72a具有導電圖案70之一面朝上，因此，該承 載件91係設置於該基材72a不具有導電圖案之一面，可用 ϋ 以承載該基材72a，而該相對件92則設置於該基材具有導 電圖案之一面，亦即該晶粒60設置一面上，該承載件91 與該相對件92可作相互貼合或分離之相對運動，以圖十二 A及圖十二B所示該壓合機構90，其承載件91為固定件， • 其相對件92係為可上下往復運動之活動件，當圖十一 B所 < 示尚未經加壓作業接觸導通之該晶粒60與該導電圖案70 .被送達該相對件92底部時，可控制該相對件92朝向該承 載件91移動一定距離，以將該晶粒60及基材72a夾合於 該承載件91與相對件92之間，使該晶粒60之凸塊61與 15 200807304 導電！確實相互适緊，如圖十二B所示。 上述之運動方：目十五，5亥承载件91及相對件92除 對件92係為固式^，亦可設置為如圖十三所示態樣，該相 活動件；或如^，而該承載件91為可上下往復運動之 均為可上下彳主 料祕’該承載件91及相對件92 馨 到使該承_12之活祕；上述兩種設置態、樣均可達 動，達到將今及相對件92作相互貼合或分離之相對運 ⑼之凸心二”0=合於其間，使該晶粒 置複數組之相=一=1置態樣外，亦可如圖十五所示設 92c係相對庫^件，心心圖示該相對件他、·、 於複數之“ ，然可依實際所需設置相對應 所示之固Li 純運動之㈣件，或如圖十三 該承載it均^承91為活動件，或如圖十四所示與 是，依92相同，此處不再予以資述，必須說明的 92^同=動業所需’可控制該複數之相對件92a、92b、 之ί十Γ斤示本發明之硬化能量源之較佳實施例 能量，至於該能量之形式可=光 質而t :之或其組口，視該黏合材料8〇所採用之材 晶粒_電圖案70細^ 、 £合加壓之同時，由該組硬化能量源100發出能 200807304 ‘ 量101同時對多組進行對晶粒60與導電圖案70之黏合材 . 料80進行硬化步驟；亦可如圖十七所示，設置有多組硬化 能量源100a〜100c，各組硬化能量源100a〜100c係相對應 於每組晶粒60與導電圖案70之位置，可控制該晶粒6〇與 導電圖案70被送至相對應之硬化能量源1〇〇a~1〇〇c下方就 定位’而後再控制硬化能量源〗〇〇a〜〗⑽c發出能量使黏合 材料80硬化；當黏合材料8〇確實硬化後，再控制硬化能 _ 量源1〇〇停止發出能量，且該承載件91及相對件92分離 以將已確實黏合之晶粒60與基材72a送出，進行後續作業 程序。 、/' 、、示a上述I置及方法’晴同時參閱圖十六及圖十八， 玎歸納出本發明所提供之用以將晶粒封裝於具有導電圖案 之基材上之步驟，其包含： 木 a·設置黏合材料80於複數晶粒60與導電圖案7〇之間· b·相互黏附該複數晶粒60與導電圖案70 ; c·提供壓力使晶粒6〇與導電圖案70相互迫緊，於晶粒⑽ _ 與導電圖案7〇持續迫緊之過程中，同時提供能量使黏合材 料80硬化。 ^ 由於該黏合材料80於未硬化、硬化過程中直至完全硬 化，該晶粒60之凸塊61與導電圖案70始終被持續， ▲ 因此，可避免該晶粒⑽於進行該黏合材料80硬^步驟前 _ 產生移，，或於黏合材料8〇硬化過程中產生形變而二二: 可大幅提供生產良率，而本發明直接且同時壓合及硬化多 顆晶粒60與導電圖案70之封裝方法，更可提高電子產品 之單位時間產能，其方式簡單確實，不僅適用 200807304 標籤封裝，亦適用於其他任何相同或類似之電子產品晶粒 封裝。 惟以上所述者，僅為本發明之最佳實施例而已，當不 能以之限定本發明所實施之範圍。即大凡依本發明申請專 利範圍所作之均等變化與修飾，皆應仍屬於本發明專利涵 蓋之範圍内，謹請貴審查委員明鑑，並祈惠准，是所至 禱。 【圖式簡單說明】 圖一至圖五係習知五種不同態樣之無線射頻辨識系統 之標籤封裝結構示意圖。 圖六A至圖六C係本發明之單位晶粒之較佳實施例之 前視、俯視及側視圖。 圖七A至圖七C係本發明之單位導電圖案之較佳實施 例之前視、俯視及侧視圖。 圖八至圖十係本發明之基材之三種較佳實施例結構示 意圖。 圖十一 A及圖十一 B係顯示以圖六系列之晶粒與圖八 所不長條帶狀基材之導電圖案相互配合之俯視圖及如視 圖。 圖十二A及圖十二B係顯示對晶粒與導電圖案進行加 壓之壓合機構較佳實施例之動作示意圖。 圖十三至圖十五係本發明之壓合機構之不同較佳實施 例之結構及動作示意圖。 圖十六及圖十七係本發明之硬化能量源之不同較佳實 18 200807304 施例之結構示意圖。 圖十八係本發明之流程示意圖。 【主要元件符號說明】 6 0 -晶粒 61 -凸塊 70-導電圖案_ 71a、71b-導腳 72、72a、72b、72c-基材 8 0 -黏合材料 90- 壓合機構 91- 承載件 92、92a、92b、92c-相對件 100、100a、100b、100c-硬化能量源 101 -能量 19200807304 • Nine, invention description: ▲ [Technical field of invention] The present invention relates to a method for packaging an RFID tag, and more particularly to a package for directly and simultaneously pressing and hardening a plurality of die and substrate conductive patterns. The method can improve the unit time productivity of electronic products and has high product yield, and is suitable for related electronic product technology fields such as communication, data storage, and radio frequency identification tags. [Prior Art] Radio Frequency Identification (RFID) is a non-contact automatic identification technology that uses radio waves to transmit information. It automatically identifies target objects and acquires related data through radio frequency signals. The identification work can be performed without manual intervention. In various environments, in recent years, its development technology has gradually matured and has the potential to replace the traditional bar code system. The general radio frequency identification system mainly includes three parts: a reader (reader), a tag (Tag) and a computer system. The function of the tag is to store data and send an identification code that can be read by the reader, and the tag It is composed of a chip, an antenna and other components combined with an RF circuit, a logic circuit and a memory. Currently, the tag structure is known to be inflexible and flexible according to the thickness of the material, as shown in Fig. 1. As shown in Figure 2, it is a thick and inflexible label structure. The label 10 shown in FIG. 1 adheres the die 11 to a substrate 16 by means of thermal coupling with an epoxide or a eutectic alloy as an adhesive, and has a contact 12 on the crystal 200807304=11. The connection of the label 10 can be completed by connecting the wire 14 to the substrate ', m, and the wire 14' at the contact 12. 2, the label 2G is attached to the substrate sink with a grain Μ, ::: granule 2... 妾 point 22, and then the joint _ coating 曰 i five and 5 hai substrate 26 phase The contacts 25 provided at the corresponding positions are bonded to each other, and then the package material ^ θ I is taken. _ can complete the sealing structure of the label 2G of the label 2G, the contact 25, the material of the two (four) system label, all have the following disadvantages: Extremely thick and inflexible, in the figure - the label μ , the general f ^ 1 1.5_ or so, and the thickness of the label 2 所示 shown in Figure 2 is thin: = therefore not used in credit cards, (four) two, timber = two, wrapped wood, heated, plus The pressure is hardened to achieve the required package strength, but only one die can be picked up at a time, resulting in an inability to increase productivity. Second, the Z side: complex, and requires intermediate steps (such as adhesion, wiring, etc. Step 4, because the system can be 70% 'not only low production efficiency' and high production cost. The control conditions required by ^程(四)' are also relatively Increase the required production cost and reduce the market competitiveness. Mouth and five: The reproducibility control factor of the grain package is more complicated, so the quality control label structure is not easy to control, so there is a thin and flexible structure of the seal. The new patent application No. 7 200807304 of the Republic of China No. 86214751, "Small and flexible sealing body", has a flexible substrate ^ 々 钱 路 与 与 与 与 与 与 与 与 与 与 与 与 与The film is made of an organic body, a thin copper antenna 33 is formed, and the surface of the insect or electroplating is turned toward the paste, and the wire 3 3 is electrically connected to each other to complete the crystal grain: The structure of the example further comprises two upper and lower laminations 36, the upper layer of the laminate is not; the outer covering layer 39 of the conforming material is disposed on the inner side of the outer covering layer 39 for 1 day: the laminated layer 36 can be made by the bell - Interview with Xiang Wan, "+ who's patent also disclosed about the die 31 gold antenna Qilian,,, The square ^ 'includes the hot compression joint, the supersonic material hot melt joint, the conductor adhesive joint: -1, the welding knows the technical means, so it is not described here: =: = in the acquisition - the package process is still - The only time to pick up the upgrade = rate to package a die, and can not effectively meet the main demand for improving production efficiency. Currently known patents are Chinese, please refer to the number No. (C) (for RF) S-assembly method and equipment", the method provides a method and equipment for transferring the celestial crystal grains, as described in the specification, conventional techniques; 2: solid selection and placement of the crystal grains on the substrate, so the yield Unsatisfactory = refers to the loss of 'wafers because of the pick-up of two or more grains at a time to cause additional die wafers. (4) The technical means provided by the case can simultaneously take most of the grains from 曰曰' Between a surface or any two surfaces, the step and time of picking up and placing the die can be greatly reduced to achieve the purpose of increasing the throughput. In combination with the above-mentioned step of transferring a plurality of dies at a time, the package provides the packaged grain. Ways, including: (a) from a support surface Moving a plurality of dies to a wafer carrier having a plurality of cells accessible on a first surface of the wafer carrier such that each of the plurality of grains resides in a corresponding cell of the majority of the cells Depressing in respective cells associated with the first surface; and (b) applying a filler material to each of the plurality of cells to substantially cover each of the grains in the respective cells. (c) locating the first wafer carrier a surface adjacent to a surface of a base structure having a plurality of label base portions; (d) a second surface of the stamped wafer carrier adjacent to a position opposite to each of the plurality of cells to move the respective grains away from the respective cells, such that The filler material covering the first surface of each of the dies contacts a corresponding one of the plurality of label substrate portions, and (e) the first surface of each of the dies is mounted to the corresponding label substrate such that at least one of its dies The pads are electrically coupled to at least one respective contact pad of the respective label substrate. Wherein, step (e) further comprises a hardening step of a filling material. According to the above packaging step, the patent further proposes a specific packaging method of two different aspects as shown in FIG. 4 and FIG. 5, respectively, which differ in that the contact pads of the die face are different; as shown in FIG. 4, the die 42a The contact pads 421a, 421b of the 42b are oriented toward the outside of the support surface 421. The antenna 461 is disposed on the surface of the label substrate 46 facing the die 42a, and a stamping tape 40 is disposed adjacent to the label substrate 46 by a stamping member 41. When the die 42a is punched out of the support 9 200807304 support surface 421, the filler material 44a can be simultaneously pushed toward the label substrate 46, and after the contact pad 421a is in contact with the antenna 461, the filler material 44a is hardened, so that the die can be 42a is packaged on the label substrate 46, and the contact pads 421a and the antenna 461 are coupled to each other; as shown in the embodiment shown in FIG. 5, the contact pads 521a, 521b of the crystal grains 52a, 52b face the support surface 521, which is attached thereto. The label substrate 56 is provided with an antenna 561 on the surface of the die 528, and a cell 562 is disposed corresponding to the die 52a. The depth of the cell 562 is adjacent to the target substrate 5 6 has a stamping belt 50, and, similarly, When the die 52a is punched out of the support surface 521 by a stamping member 51, the filler material 54a can be simultaneously pushed toward the label substrate 56, and after the die 52a is completely moved into the cell 562, the filler material 54a is hardened and finally contacted. An electrical conductor (not shown) is formed on the pad 521a and the antenna 561 to couple the contact pad 421a and the antenna 461. Thus, the die 52a can be packaged on the tag substrate 56. It is worth noting that even if the contact pads are oriented differently, the packaging method is to first punch the die out of the support surface to contact the label substrate, extrude the filler material by the die, and finally harden the filler material, and the packaging method is The main disadvantage of the existence is that before the filling material is completely cured, the condition that the crystal grains and the label substrate are not closely adhered is easily generated, thereby causing the following conditions: In the aspect of FIG. 4, the crystal grains 42a and thus The antenna 461 can not be in contact with the conduction; in the case of the solid five, since the die 52a is embossed, it is difficult to form the electrical conductor after the second generation; 2. In the hardening process of the filler material, the grain displacement is easily caused; The amount of die-extruded filler material is uneven. 200807304 According to this, although the aforementioned patent can transfer a plurality of crystal grains at a time, the defect rate of the product is improved. SUMMARY OF THE INVENTION In view of the lack of the prior art, the main object of the present invention is to provide a method for packaging an RFID tag, which can directly and simultaneously press and harden a plurality of crystal grains and conductive patterns, thereby improving the unit time productivity of the electronic product. And the product yield is high. In order to achieve the above object, the present invention provides a method for packaging a radio frequency identification tag, comprising: a. providing an adhesive material between a plurality of crystal grains and a conductive pattern; b. adhering the plurality of crystal grains and the conductive pattern to each other; c. providing The pressure causes the die and the conductive pattern to be forced to each other 'in the process of continuously pressing the die and the conductive pattern while providing energy to harden the bond. Preferably, the bonding material of the step a is disposed on the die. Preferably, the die has conductive bumps for contacting the conductive pattern to form electrical conduction. Preferably, the bonding material of the step a is disposed on a surface of the crystal grain having a bump. Preferably, the bonding material of the step a is disposed on the conductive pattern. Preferably, the bonding material of the step a is disposed on the die and the conductive pattern. Preferably, the adhesive material of step a is a conductive material. 200807304 Preferably, the bonding material of the step a is a non-conductive material. Preferably, the bonding material of the step a is a non-conductive material containing conductive particles. Preferably, the step c is performed by a pressing mechanism to provide a pressure for pressing the die and the conductive pattern to each other. Preferably, the pressing mechanism comprises: at least one carrier disposed on the substrate without one surface of the conductive pattern for carrying the substrate, and at least one opposing member disposed on the substrate having a conductive pattern The bearing member and the opposing member can be moved relative to each other or separated to sandwich the die and the substrate between the carrier and the opposing member, so that the die and the conductive pattern are tight with each other. . Preferably, the carrier is a stationary fixing member, and the opposite member is a reciprocating movable member. The opposing member moves toward the carrier to urge the die and the conductive pattern to each other. Preferably, the carrier is a reciprocating movable member, and the opposite member is a stationary fixing member. The opposing member moves toward the carrier to urge the die and the conductive pattern to each other. Preferably, the carrier member and the opposite member are reciprocating movable members, and the die and the conductive member are moved toward each other to force the die and the conductive pattern to be mutually pressed. Preferably, it is provided with a plurality of opposing members, each opposing member corresponding to at least one die. Preferably, the plurality of opposing members are for asynchronous reciprocating motion. 200807304. Preferably, the energy for hardening the bonding material in the step C is provided by an energy source, and the bonding material of the plurality of crystal grains can be hardened at the same time. Preferably, the energy for hardening the bonding material in the step C is provided by a plurality of energy sources, each of which has a corresponding energy source. Preferably, the energy for hardening the adhesive material in the step C may be one or a combination of sound waves, light energy or heat energy. Preferably, the shape of the substrate is an individual separated sheet, and φ is provided with an array of conductive patterns on the substrate. Preferably, the substrate is in the form of a strip that can be continuously wound into a reel, and an array of conductive patterns is provided on the substrate. Preferably, the material of the substrate is a plastic film such as PET (Polyester), Pl (Polyimide), or FR4. Preferably, the material of the conductive pattern may be one of a single conductive metal, an alloy having a plurality of types of conductive metals, or a combination thereof. In order to make your reviewer have a better understanding and recognition of the structural purpose and efficacy of the present invention, the detailed description is as follows. [Embodiment] Hereinafter, the technical means and effects of the present invention for achieving the object will be described with reference to the accompanying drawings, and the embodiments listed in the following drawings are only for the purpose of explanation, so that the reviewer understands, but the case Technical means are not limited to the illustrated figures. Please refer to FIG. 6A to FIG. 6C for a front view, a plan view and a side view of a preferred embodiment of the unit die of the present invention. The bottom surface of the die 60 is provided with a plurality of conductive bumps 61. The bump 61 is used to contact the conductive pattern of the package surface to form an electrical conduction. The radio frequency identification is used for the radio frequency identification, and the conductive pattern is the antenna, but not limited thereto; ^A to FIG. 7C shows a preferred embodiment of the unit conductive pattern of the present invention. The conductive pattern 70 has a rectangular shape with two separate lead legs 71a, 71b. The conductive pattern 70 has a front view, a top view and a side view. The pattern 70 is disposed on a substrate 72. The material of the conductive pattern 70 can be one of a single conductive metal, an alloy having a plurality of types of conductive metals, or a combination thereof. The substrate 72 can be flexible or inflexible. Non-conductive material, but it is better to use flexible PET (Polyester), PKPolyimide), FR4 and other plastic film materials. There are many kinds of setting patterns for the conductive pattern 70. See Figure 8 to Figure 10 The conductive patterns 70 are not listed in a long strip On the substrate 72a, the conductive pattern 70 shown in FIG. 9 is a plurality of arrays on a separate rectangular substrate 72b, and the conductive pattern 70 shown in FIG. On the strip-shaped substrate 72c, when the long strip-shaped substrates 72a and 72c shown in Figs. 8 and 10 are made of a flexible plastic film material, they can be wound into a roll (Reel). Reduce the volume, reduce the space occupied, and facilitate continuous operation; as for the arrangement of the conductive pattern 70, Figure 9 is a 4x4 rectangular array, and Figure 10 is arranged in parallel with four rows, depending on the actual machine or substrate area. Different from change, not limited to the illustration. Please refer to FIG. 11A and FIG. 11B for a plan view of the pattern 6 of the FIG. 6 series and the conductive pattern 70 of the strip substrate 7 2 a of FIG. And the front view, the two conductive bumps 61 of the die 60 are respectively disposed on the two guiding legs 71a, 71b of the conductive pattern 70, and an adhesive material is disposed between the die 60 and the conductive pattern 70. 80, the adhesive 14 200807304. The composite material 80 can be disposed on the surface of the die 60 having the bump 61, or disposed on the two guiding legs 71 a, 71 b of the conductive pattern 70 can also be disposed at the same time. The adhesive material 80 may be a conductive material, a non-conductive material, or a non-conductive material containing conductive particles, which is set according to actual operation, for example, using non-conductive materials. In the case of conductive thermosetting adhesive, it is required to achieve the required encapsulation strength by heating and press hardening. If it is a conductive conductive paste, it can be hardened or conductive by heat or pressure through the conductive particles contained therein. In the state shown in FIG. 11B, the bump 61 of the die 60 and the guide Pattern 70 has not been contacted by the pressing operation is turned on, still has a distance d therebetween. Referring to FIG. 12A and FIG. 12B, FIG. 12A is a schematic view showing the operation of a preferred embodiment of a pressing mechanism for pressing the die 60 and the conductive pattern 70. The pressing mechanism 90 includes a base member respectively disposed on the base. The bottom surface of the material 72a and the one of the top surface of the carrier member 91 and the opposite member 92, since the substrate 72a has one of the conductive patterns 70 facing upward, the carrier member 91 is disposed on the substrate. 72a does not have one surface of the conductive pattern, and can be used to carry the substrate 72a, and the opposite member 92 is disposed on one side of the substrate having a conductive pattern, that is, the die 60 is disposed on one side, and the carrier 91 is The opposing members 92 can be moved relative to each other or separated. The pressing mechanism 90 is shown in FIG. 12A and FIG. 12B, and the supporting member 91 is a fixing member, and the opposing member 92 is reciprocally movable up and down. The movable movable member, when the die 60 and the conductive pattern 70 that have not been contacted by the pressurized working contact are fed to the bottom of the opposite member 92, the opposite member 92 can be controlled toward the carrier. The piece 91 moves a certain distance to sandwich the die 60 and the substrate 72a Between the carrier 91 and the opposing member 92, the bumps 60 of the die 61 and the conductive 15200807304! It is indeed mutually tight, as shown in Figure 12B. The above-mentioned motion side: the fifteenth, the 5th seath bearing member 91 and the opposite piece 92 except the pairing member 92 are solid type ^, and may also be set as shown in FIG. 13 , the phase moving piece; or such as ^, The carrier member 91 is reciprocally movable up and down, and the carrier member 91 and the opposite member 92 are singulated to make the bearing -12 active; the above two settings can be achieved. In the meantime, the convex core 2" of the relative movement (9) of the present and the opposite members 92 is combined with each other, so that the phase of the array is set to the phase = one = 1 state, or Figure 15 shows that the 92c is relative to the library, and the heart is shown in the opposite part of the "," and "in the plural", but the corresponding solid (Li) movement can be set according to the actual needs, or as Figure 13 shows that the bearer is a movable part, or as shown in Figure 14 and yes, according to 92, no further description is given here, and the required 92^ must be controlled The plurality of opposing members 92a, 92b, and the like, the energy of the preferred embodiment of the hardened energy source of the present invention, as the form of the energy can be = light quality and t: or its group mouth Depending on the material used in the bonding material _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The bonding material of the pattern 70. The material 80 is subjected to a hardening step; as shown in FIG. 17, a plurality of sets of hardening energy sources 100a to 100c are provided, and each group of hardening energy sources 100a to 100c corresponds to each group of crystal grains 60 and The position of the conductive pattern 70 can control the die 6 and the conductive pattern 70 to be sent to the corresponding hardened energy source 1〇〇a~1〇〇c to locate 'and then control the hardened energy source〗 〇〇 a~ (10)c emits energy to harden the bonding material 80; when the bonding material 8 does harden, the hardening energy is controlled, the source 1 〇〇 stops emitting energy, and the carrier 91 and the opposing member 92 are separated to form the crystal which has been surely bonded. The pellet 60 is sent out to the substrate 72a for subsequent work procedures. And /', and the above-mentioned I-position and method 'clearly, referring to FIG. 16 and FIG. 18, the steps of the present invention for packaging the die on the substrate having the conductive pattern are summarized. The method includes: a wood a·setting adhesive material 80 between the plurality of crystal grains 60 and the conductive pattern 7〇·b· adhering the plurality of crystal grains 60 and the conductive pattern 70; c· providing pressure to make the crystal grains 6〇 and the conductive pattern 70 mutually Tightening, while the die (10) _ and the conductive pattern 7 are continuously pressed, energy is simultaneously supplied to harden the adhesive material 80. ^ Since the adhesive material 80 is hardened and hardened during the hardening process, the bumps 61 and the conductive pattern 70 of the die 60 are always continued, ▲ Therefore, the die (10) can be prevented from being hardened by the bonding material 80. Before the step _ production shift, or deformation during the hardening process of the bonding material 8 而 2: can provide a large production yield, and the present invention directly and simultaneously press and harden the packaging of the plurality of crystal grains 60 and the conductive pattern 70 The method can also improve the unit time productivity of electronic products. The method is simple and reliable. It is applicable not only to the 200807304 label package, but also to any other identical or similar electronic product chip package. However, the above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto. That is to say, the equivalent changes and modifications made by the applicants in accordance with the scope of the patent application of the present invention should still fall within the scope of the patents of the present invention. I would like to ask your review committee to give a clear explanation and pray for the best. [Simple description of the diagram] Figure 1 to Figure 5 are schematic diagrams of the label packaging structure of the radio frequency identification system of five different aspects. Figures 6A through 6C are front, top and side views of a preferred embodiment of the unitary die of the present invention. Figures 7A through 7C are front, top and side views of a preferred embodiment of the unit conductive pattern of the present invention. Figures 8 through 10 are structural illustrations of three preferred embodiments of the substrate of the present invention. Figure 11A and Figure 11B show a top view and a view of the pattern of the Figure 6 series and the conductive pattern of the strip-shaped substrate of Figure 8. Fig. 12A and Fig. 12B are schematic views showing the operation of a preferred embodiment of the pressing mechanism for pressing the crystal grains and the conductive pattern. Figures 13 through 15 are schematic views showing the structure and operation of different preferred embodiments of the press-fit mechanism of the present invention. 16 and 17 are different preferred embodiments of the hardened energy source of the present invention. 18 200807304 Schematic diagram of the structure of the embodiment. Figure 18 is a schematic flow chart of the present invention. [Main component symbol description] 6 0 - die 61 - bump 70 - conductive pattern _ 71a, 71b - lead 72, 72a, 72b, 72c - substrate 8 0 - adhesive material 90 - press mechanism 91 - carrier 92, 92a, 92b, 92c - opposing members 100, 100a, 100b, 100c - hardened energy source 101 - energy 19