200803636 九、發明說明： t發明所屬技術領域;j 發明領域 本發明係有關於一種印刷基板之安裝結構，特別係有 5關於利用螺栓等而將印刷基板固定安裝於框體等構造物上 之結構中，不會吸收印刷基板與框體間所產生的廉力並可 加以緩和者。200803636 IX. OBJECTS OF THE INVENTION: The present invention relates to a mounting structure of a printed circuit board, and in particular to a structure for fixing a printed circuit board to a structure such as a frame by bolts or the like. In this case, the power generated between the printed substrate and the frame body is not absorbed and can be alleviated.
L· lltr H 發明背景 10 15L· lltr H Background of the invention 10 15
通常，於印刷基板上搭載各種電子零件時，係藉由熔 融或溶焊等而進行固定動作。進㈣焊等時，為達顺^ 料炫融之溫度’會因零件類及印刷基板本身之間、或印刷 基板之樹脂部分及金屬部分之間的熱膨脹係數差，㈣整 個印刷基板施加減力。其結果’製成的零件安裝印刷^ 板多有翹曲情形。如此ϋ結餘態下利用螺^ 而將印刷基板固定在框料固定結構物上，因輯印刷臭 板矯正她曲，故會料職㈣料部分施加機械性1 力’而有破壞料接合部之虞。特別是，對需《小_ 的攜帶型終端機等所使用的印刷基板而言，其熔焊接合部 極為細小，故前述問題顯得尤其重要。 —第1圖及第2圖顯不習知―般之印刷基板的安裝結構。 弟1⑷圖係搭載有電子零件之印刷基板的平面圖，第聊 m面圖印刷基板j係譬如由玻璃環氧等之樹脂構成。 ’、要之私子零件2係如料，藉由焊彬而固定搭載於印刷 20 200803636 基板1上，但如㈣，搭載有電子零件2之印刷基板 1多有翹曲情形。 。搭载有電子零件2之印刷基板j在翹曲狀態下，如第2 圖所不’利用印刷基板的固定用螺孔4且藉由螺检6固定在 框體5等之岐結構物上。如此，若印刷基板工在已修正其 〜曲狀怨下加以安裝，並固定於框體5，印刷基板！上將作 用有欲矯正該翹曲的應力。因此，如前述，會在印刷基板i 的燦燁部分7施加機械性應力，而如圖示，恐有破壞炼焊接 合部7a之虞。 4作為用以防止利用螺栓而將印刷基板固定於框體等之 固定結構物時，產生如前述之應力的習知技術，譬如有曰 本專利公開公報特開平5·41169號。依該技術，其目的係在 於抑制產生於安|在基板本體上之電子零件的應力，以防 止電子零件之特性劣化及遭到破壞，並低成本的提高可靠 度，又’基板本體上設有由其周緣部延伸至止螺用孔周圍 的狹缝’當基板整體具_情形以及安裝部有所偏移時， 可防止基板本體中安裝有電子零件的部分產生因變形而導 欵的應力。 該習知技術中，雖利用狹缝來吸收印刷基板的變形， 但同狹縫係由基板本體的周緣部延伸至止螺用孔的邊緣， 且用以m定印職板的螺孔其位置若在印刷基板的周緣部 附近，此雖無特關題，但當該部分位在遠離印刷基板周 緣部的内科’是π設置如前叙錢，或者是非得設 置由基板周緣部延伸至内部的長狹縫，即，會產生印刷基 6 200803636 - 板的配置設計上之問題。Usually, when various electronic components are mounted on a printed circuit board, the fixing operation is performed by fusion or welding. In the case of the (four) welding, etc., the temperature of the material to be melted and melted may be due to the difference in thermal expansion coefficient between the parts and the printed substrate itself, or between the resin portion and the metal portion of the printed substrate, and (4) the entire printed substrate is biased. . As a result, the parts mounted on the printed board have a lot of warpage. In this way, the printed circuit board is fixed on the frame fixing structure by using the screw, and the printed stencil is corrected by the printed stencil, so that the mechanical part 1 is applied to the material part (4) and the joint of the broken material is broken. Hey. In particular, the above-mentioned problems are particularly important for a printed circuit board used in a portable terminal or the like which requires a small size, since the welded joint portion is extremely small. - Figures 1 and 2 show the mounting structure of a conventional printed circuit board. The 1st (4) drawing is a plan view of a printed circuit board on which an electronic component is mounted, and the printed circuit board j is made of a resin such as glass epoxy. The private parts 2 are required to be fixedly mounted on the substrate 1 of the printing 20 200803636 by soldering, but as shown in (4), the printed circuit board 1 on which the electronic component 2 is mounted has a large warpage. . In the warped state, the printed circuit board j on which the electronic component 2 is mounted is fixed to the structure of the frame 5 or the like by the screw test 6 by the screw hole 4 for fixing the printed circuit board as shown in Fig. 2 . In this way, if the printed substrate is mounted under the corrected curvature, and fixed to the frame 5, the printed substrate is printed! The upper body has a stress to correct the warp. Therefore, as described above, mechanical stress is applied to the burnt portion 7 of the printed substrate i, and as shown, there is a fear that the welded joint portion 7a is broken. (4) As a fixing structure for preventing the fixing of the printed circuit board to the frame or the like by the use of the bolts, a conventional technique such as the above-described stress is generated, for example, Japanese Laid-Open Patent Publication No. Hei No. Hei No. Hei. According to the technology, the object is to suppress the stress generated on the electronic component on the substrate body, to prevent deterioration and damage of the characteristics of the electronic component, and to improve reliability at low cost, and to provide a substrate body The slit "which extends from the peripheral portion to the periphery of the stopper hole" prevents the portion of the substrate body from which the electronic component is mounted from being deformed by the deformation when the substrate is integrally formed and the mounting portion is displaced. In the prior art, although the slit is used to absorb the deformation of the printed substrate, the same slit extends from the peripheral edge portion of the substrate body to the edge of the screw hole, and the position of the screw hole for the printing plate is used. If there is no special problem in the vicinity of the peripheral portion of the printed circuit board, when the portion is located away from the periphery of the printed circuit board, the internal medicine 'is π set as described above, or must be disposed from the peripheral portion of the substrate to the inside. Long slits, ie, will produce print base 6 200803636 - problem with the design of the board.
【專利文獻1】日本特開平5-041169號公報 I：發明内容J • 發明概要 5 發明欲解決之課題 如前述，若在搭載有電子零件之印刷基板產生龜曲狀 態下將之固定於固定結構物上，因印刷基板上作用有欲矯 • 正該翹曲的應力，故會對印刷基板的炼焊部分施加機械： 應力，而有破壞熔焊接合部之虞。又，如專利文獻丨，於基 10板本體上設置由其周緣部延伸至止螺用孔邊緣的狹縫時， 該狹縫係由基板本體之周緣部延伸至止螺用孔的邊緣，而 若印刷基板之固定部分係位在遠離周緣部的内部時，即不 易设置狹縫，或者非得設置由基板周緣部延伸至内部的長 狹縫。 故，本發明為解決前述習知印刷基板之安裝結構上的 • ㈣點，係當利明栓等而將安裝有零件之印刷基板固定 在汇體專之固疋結構物上時，除緩和施力口於印刷基板上之 溶焊零件其燦焊接合部之應力，並有效利用印刷基板的基 KHbase) ’以提供適合高密度安裝的印刷基板之安裝結 β 20 構。 為達成W述課題，本發明係提供如下述之印刷基板之 安衣結構’即，在印刷基板中，用以將該印刷基板固定在[Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. 5-041169. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION As described above, when a printed circuit board on which an electronic component is mounted is fixed in a tortuous state, it is fixed to a fixed structure. In the object, since the stress on the printed circuit board is applied to the warpage of the printed circuit board, mechanical stress is applied to the welded portion of the printed circuit board, and the weld joint portion is broken. Further, as in the patent document, when a slit extending from the peripheral edge portion to the edge of the stopper hole is provided in the base body of the base 10, the slit extends from the peripheral edge portion of the substrate body to the edge of the screw hole. When the fixed portion of the printed substrate is tied away from the inside of the peripheral portion, it is difficult to provide a slit, or a long slit extending from the peripheral edge portion of the substrate to the inside is not required. Therefore, the present invention is to solve the above-mentioned (4) point of the mounting structure of the conventional printed circuit board, and to fix the printed circuit board on which the component is mounted on the fixed structure of the sink body, etc. The solder-welded part on the printed substrate has the stress of the solder joint, and effectively utilizes the base of the printed substrate K's to provide a mounting structure of the printed circuit board suitable for high-density mounting. In order to achieve the problem, the present invention provides a mounting structure of a printed substrate as described below, that is, in a printed substrate, the printed substrate is fixed in the printed circuit board.
Lf㉟上之固定用孔周陳近，設有可吸收伴隨前述 固定動作而產生之應力的_部。 7 200803636 如此 基板固心等而將安裝有零件之印刷 固定孔周η 、α&、、’°構物上時’由於印刷基板上之 «定設有吸收應力用之緩衝部，故，將印刷基The fixing hole on the Lf35 is close to the circumference, and is provided with a portion that absorbs the stress generated by the above-described fixing operation. 7 200803636 When the substrate is fixed, etc., the printing fixing hole η, α&, and '° in the structure are mounted on the printed circuit board, the buffer portion for absorbing stress is fixed on the printed circuit board. base
生的機械性^構物上時，可緩和伴隨印刷基板赵曲而產 板上之炫焊:：。因此，可避免破壞及損傷搭載於印刷基 有該緩==其料接合部，且由於翻定孔周圍附近 基底部產生^衫會_做科之印㈣板其主要的 載區域，刷㈣整體之零件搭 中任則述緩衝部係*貫通印刷基板之狹縫及非貫通之溝槽 或一者所組成。如此，緩衝部藉由設於引刷基板 =的狹縫或溝槽而組成，緩衝部即可彻印刷基板的切 削、1鑽等機械性加工、或侧等之化學性處理，而以習 知方法輕易地形成。 ”这緩衝部係由狹縫組成，且該狹縫多數且圓孤狀地 又置於與$述固定用孔同心之圓上。藉由讓緩衝部做成多 數狹縫，可將固定孔附近的周圍區域作為均等的應力吸收 部位。 ^ 月;j述緩衝部係由設在印刷基板之雙面或其中一面上的 2〇 >冓槽所構成，且該溝槽係沿著與前述固定用孔同心之圓而 設置。此時，前述溝槽之特徵係設置有多數個且呈圓弧狀。 藉由讓緩衝部做成多數圓弧狀之溝槽，可讓固定孔附近的 周圍區域作為均等的應力吸收部位。 又’印刷基板係於聚醯亞胺樹脂層的雙面上，積層有 8 200803636 單一或多數玻璃環氧樹脂層的多層板，又，設於印刷基板 之雙面或其中一面上的前述溝槽，係除去玻璃環氧樹脂層 之部分而形成者。藉此，可有效地將印刷基板内層中具柔 軟性之聚醯亞胺樹脂，作為應力吸收用的緩衝層。 5 再者，前述缓衝部包含：在印刷基板之雙面或其中一 面上，沿著與前述固定用孔同心之圓而設置之非貫通溝 槽；及設置於前述溝槽内之一部分的單一或多數貫通狹 縫。如此，藉由組合非貫通溝槽及貫通狹縫而構成緩衝部， 可將固定孔附近的周圍區域作為具均等性又具有所欲求之 10 柔軟性的應力吸收部位。 圖式簡單說明 第1圖係顯示習知一般的印刷基板之安裝結構在安裝 前的狀態，第1(a)圖係平面圖，第1(b)圖係侧面圖。 第2圖係顯示同一習知例的印刷基板之安裝結構在安 15 裝後狀態的側面圖。 第3圖係顯示本發明印刷基板之安裝結構第一實施態 樣的平面圖。 第4圖係顯示本發明印刷基板之安裝結構第二實施態 樣’第4(a)圖係平面圖，第4(b)圖係第4(a)圖之A —A截面圖。 20 第5圖係顯示本發明印刷基板之安裝結構其第三實施 態樣，第5(a)圖係平面圖，第5(b)圖係第5(a)圖之B — B截面 圖。 第6圖係第5(b)圖之C所示部分的放大截面圖。 【TiC 】 200803636 較佳實施例之詳細說明 以下，參照圖面說明本發明實施態樣。 第3〜5圖顯示本發明印刷基板之安裝結構的各實施態 樣，印刷基板10係譬如由玻璃環氧等之樹脂組成。如前述， 5必要的電子零件12係藉由焊料（未予圖式）而固定搭載於印 刷基板10上。印刷基板10設有用以將該印刷基板1〇固定於 框体等固定結構物（未予圖式）上的固定用孔14。 第3圖所示之第一實施態樣中，印刷基板10之固定用孔 14周圍附近，設有作為緩衝部，即多數貫通印刷基板1〇的 10狹缝20。該等貫通狹缝2〇係沿著與固定用孔14同心且位在 其周圍附近之圓周，等間隔地配置在三處所而形成為圓弧 狀狹縫。 因此，如前述，縱或是搭載有電子零件12之印刷基板 1〇產生翹曲，且於該狀態下固定在框體等固定結構物（未予 15圖式）上時，前述三處所的圓弧狀狹縫20可作為緩衝部，吸 收掉伴隨印刷基板1〇之翹曲而產生的機械性應力。藉由讓 緩衝部做成多數狹縫，可將固定孔附近的周圍區域作為均 等的應力吸收部位。 如此，圓弧狀狹縫20係等間隔地配置在三處所，因此 2〇縱或是利用固定用孔Η且藉由螺栓而將印刷基板1〇固定於 框体上，可將該固定用孔14作為中心而產生均等的緩衝作 用。 第4(a)圖係顯示本發明印刷基板之安裝結構其第二實 施態樣的平面圖，第4〇>)圖係第4(a)圖中A —A處截面圖。此 200803636 第二實施態樣中，在印刷基板10中電子零件12之搭載面側 且係固定用孔14的周圍附近，設有作為緩衝部，即未貫通 印刷基板10的溝槽22。该等非貫通溝槽22係沿著與固定用 孔14同心且位在其周圍附近的圓周，等間隔地配置在三處 5 而成圓弧狀。 與第一實施態樣相同地，縱或是搭載有電子零件12之 印刷基板10產生翹曲，且於該狀態下固定在框體等固定結 構物（未予圖式）上時，前述三處所之圓弧狀非貫通溝槽22 可作為缓衝部，吸收掉伴隨印刷基板10之翹曲而產生的機 10 械性應力。 由於圓弧狀非貫通溝槽22係等間隔地配置在三處所， 因此縱或是利用固定用孔14且藉由螺检而將印刷基板1〇固 定於框体等固定結構物上，可將該固定用孔14作為中心而 產生均等的緩衝作用。 15 第5(a)圖係顯示本發明印刷基板之安裝結構其第三實 施態樣的平面圖，第5(b)圖係第5(a)圖中B — B處戴面圖。 又，第6圖係第5(b)圖中C所示部分的放大截面圖。 第三實施態樣中，印刷基板1〇係在正中央的聚酿亞胺 樹脂層10a的雙面上，積層有多數層之玻璃環氧樹脂層l〇b 20而構成為多層印刷基板。正中央的的聚醯亞胺樹脂層1〇a之 雙面、及各玻璃環氧樹脂層l〇b的上面，即各層之間，形成 有由銅之圖樣所組成的導電層l〇c。 此第三實施態樣中，沿著一在印刷基板1〇的雙面上， 與固疋用孔14同心又位在其附近的圓周’而形成有非貫通 11 200803636 溝槽24，再者，該等非貫通溝槽24係除去玻璃環氧樹脂層 l〇b之部分，而僅殘留下正中央的聚醯亞胺樹脂層1〇a之狀 悲。藉此，印刷基板10其正中央之層，即具柔軟性的聚醯 亞胺樹脂層10a為露出非貫通溝槽24之狀態，此部分可有效 5 作為應力吸收用的緩衝層。 再者’此第二實施態樣中的非貫通溝槽24，可在製造 多層軟硬結合(Rigid-Flexible)印刷基板1 〇本身之製程中加 以形成。 以上參照附圖說明本發明之實施態樣，惟本發明並不 限於兩述實施態樣，於本發明之精神乃至範圍内，可做出 各種態樣、變形、修正等。 【產業上之可利用性】 如前述說明，本發明係在印刷基板中，用以將該印刷 基板固定在固定結構物上之固定用孔周圍附近，設置可吸 15收伴隨前述固定動作而產生之應力的緩衝部，因此，可避 免破壞及毀損搭載於印刷基板上之熔焊零件其熔焊接合 部，再者，由於僅固定孔周圍附近有該緩衝部，因此不會 對搭載有零件之印刷基板的主要空間造成影響，可有效利 用印刷基板其整體之零件搭载區域，獲致適合高密度 20 結構。 又 、 【圖式簡單說明】 第1圖係顯示習知一般的印刷基板之安裝結構在安裝 刚的狀態’第l(a)圖係平面圖，第1(b)圖係侧面圖。 第2圖係顯示同一習知例的印刷基板之安裝結構在安 12 200803636 裝後狀態的側面圖。 弟3圖係顯示本發明印刷基板之安裝結構第一實施態 樣的平面圖。 第4圖係顯示本發明印刷基板之安裝結構第二實施態 5樣，苐4(a)圖係平面圖，第4(b)圖係第4(a)圖之a — A截面圖。 第5圖係顯示本發明印刷基板之安裝結構其第三實施 態樣，第5(a)圖係平面圖，第5(b)圖係第5(勾圖之；6 —B截面 圖。When the mechanical structure is formed, the soldering on the board with the printed circuit board can be alleviated::. Therefore, it is possible to avoid damage and damage. The printing unit is provided with the slow joint == the joint portion of the material, and the base portion of the vicinity of the turning hole is produced. In the case of the parts, the buffer portion is formed by a slit penetrating the printed circuit board and a non-through groove or one. In this way, the buffer portion is composed of a slit or a groove provided in the brush substrate =, and the buffer portion can be used for cutting the substrate, mechanical processing such as drilling, or chemical treatment on the side. The method is easily formed. The buffer portion is composed of a slit, and the slit is placed in a circle which is concentric with the fixing hole in a plurality of round and solitary shapes. By making the buffer portion a plurality of slits, the fixing hole can be The surrounding area serves as an equal stress absorbing portion. ^月;j The buffer portion is composed of a 2〇> groove provided on both sides or one side of the printed substrate, and the groove is fixed along the aforementioned The hole is provided with a concentric circle. At this time, the groove is provided with a plurality of features and has an arc shape. By making the buffer portion a plurality of arc-shaped grooves, the surrounding area near the fixing hole can be made. As a uniform stress absorbing site. The printed substrate is laminated on both sides of the polyimide film layer, and has a multilayer board of 8 200803636 single or most glass epoxy layers, and is provided on both sides of the printed substrate or The groove on one surface is formed by removing a portion of the glass epoxy layer, whereby the flexible polyimide resin in the inner layer of the printed substrate can be effectively used as a buffer layer for stress absorption. 5 Furthermore, the aforementioned buffer package a non-penetrating groove provided on a double or one surface of the printed substrate along a circle concentric with the fixing hole; and a single or a plurality of through slits provided in one of the grooves. The buffer portion is formed by combining the non-through grooves and the through slits, and the surrounding area in the vicinity of the fixing hole can be used as the stress absorbing portion having the flexibility and the desired flexibility of 10. The drawing is simplified. The mounting structure of a general printed circuit board is in a state before mounting, the first (a) is a plan view, and the first (b) is a side view. The second figure shows the mounting structure of the printed circuit board of the same conventional example. Fig. 3 is a plan view showing a first embodiment of the mounting structure of the printed circuit board of the present invention. Fig. 4 is a view showing a second embodiment of the mounting structure of the printed circuit board of the present invention. Fig. 4(b) is a cross-sectional view taken along line A-A of Fig. 4(a). Fig. 5 is a view showing a third embodiment of the mounting structure of the printed circuit board of the present invention, item 5(a) Figure plan, section 5 (b) is the fifth (a) of the B - Fig. 6 is an enlarged cross-sectional view showing a portion shown in section C of Fig. 5(b). [TiC] 200803636 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. 5 shows various embodiments of the mounting structure of the printed circuit board of the present invention, and the printed circuit board 10 is composed of, for example, a resin such as glass epoxy. As described above, the necessary electronic components 12 are soldered (not shown). The printed circuit board 10 is fixedly mounted on the printed circuit board 10. The printed circuit board 10 is provided with a fixing hole 14 for fixing the printed circuit board 1 to a fixed structure (not shown) such as a housing. The first embodiment shown in FIG. In the aspect, a buffer portion, that is, a plurality of slits 20 penetrating the printed circuit board 1 is provided in the vicinity of the periphery of the fixing hole 14 of the printed circuit board 10. These through slits 2 are formed in an arcuate slit at three places which are concentric with the fixing hole 14 and are located in the vicinity of the periphery thereof at equal intervals. Therefore, as described above, when the printed circuit board 1 on which the electronic component 12 is mounted is warped, and is fixed to a fixed structure such as a frame (not shown in the figure) in this state, the circle of the above three places The arcuate slit 20 serves as a buffer portion and absorbs mechanical stress accompanying warpage of the printed substrate. By making the buffer portion a plurality of slits, the surrounding area in the vicinity of the fixing hole can be used as an equal stress absorbing portion. In this way, since the arc-shaped slits 20 are arranged at three intervals at equal intervals, the fixing holes can be fixed by fixing the printed circuit board 1 to the frame by the fixing holes and by the bolts. 14 acts as a center to produce an equal buffering effect. Fig. 4(a) is a plan view showing a second embodiment of the mounting structure of the printed circuit board of the present invention, and Fig. 4(a) is a sectional view taken along line A-A of Fig. 4(a). In the second embodiment, in the printed circuit board 10, in the vicinity of the mounting surface side of the electronic component 12 and around the fixing hole 14, a buffer portion, that is, a trench 22 that does not penetrate the printed circuit board 10 is provided. These non-through grooves 22 are arranged in three places at equal intervals along the circumference concentric with the fixing hole 14 and located in the vicinity thereof, and are formed in an arc shape. Similarly to the first embodiment, when the printed circuit board 10 on which the electronic component 12 is mounted is warped, and is fixed to a fixed structure such as a frame (not shown) in this state, the above three places The arc-shaped non-through groove 22 serves as a buffer portion and absorbs the mechanical stress caused by the warpage of the printed circuit board 10. Since the arc-shaped non-through grooves 22 are arranged at three intervals at equal intervals, the printed circuit board 1 can be fixed to a fixed structure such as a frame by the fixing holes 14 by the fixing holes 14 in the vertical direction. The fixing hole 14 serves as a center to generate an equal cushioning action. 15(a) is a plan view showing a third embodiment of the mounting structure of the printed circuit board of the present invention, and Fig. 5(b) is a front view of the B-B in Fig. 5(a). Further, Fig. 6 is an enlarged cross-sectional view showing a portion indicated by C in Fig. 5(b). In the third embodiment, the printed circuit board 1 is formed on the both sides of the center of the polyacrylonitrile resin layer 10a, and a plurality of layers of the glass epoxy resin layer 10b are laminated to form a multilayer printed board. A conductive layer 10c composed of a pattern of copper is formed on both sides of the polyimine resin layer 1a in the center and on the upper surface of each of the glass epoxy layers 10b, that is, between the layers. In the third embodiment, the groove 24 is formed through a non-penetrating 11 200803636 along a circumference on the both sides of the printed substrate 1 同 which is concentric with the fixing hole 14 and located in the vicinity thereof. These non-through grooves 24 are portions in which the glass epoxy resin layer 10b is removed, and only the polyimine resin layer 1a in the center is left. Thereby, the layer in the center of the printed circuit board 10, that is, the flexible polyimide film layer 10a is in a state in which the non-through grooves 24 are exposed, and this portion can be effectively used as a buffer layer for stress absorption. Further, the non-through-groove 24 in this second embodiment can be formed in the process of manufacturing a multi-layer Rigid-Flexible printed substrate 1 itself. The embodiments of the present invention have been described above with reference to the drawings, but the present invention is not limited to the embodiments, and various modifications, modifications, and the like can be made within the spirit and scope of the invention. [Industrial Applicability] As described above, the present invention is applied to a printed circuit board for fixing the printed circuit board in the vicinity of a fixing hole on a fixed structure, and is provided with a suction 15 to be generated in association with the fixing operation. Since the buffer portion of the stress is prevented from damaging and damaging the welded joint portion of the welded component mounted on the printed circuit board, the buffer portion is provided only in the vicinity of the fixed hole, so that the component is not mounted. The main space of the printed circuit board is affected, and the entire component mounting area of the printed circuit board can be effectively utilized, resulting in a high-density 20 structure. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a mounting structure of a conventional printed circuit board in a state immediately after mounting, and a side view of Fig. 1(b). Fig. 2 is a side view showing the mounting structure of the printed circuit board of the same conventional example in an assembled state of An 12 200803636. Fig. 3 is a plan view showing a first embodiment of the mounting structure of the printed circuit board of the present invention. Fig. 4 is a view showing a second embodiment of the mounting structure of the printed circuit board of the present invention, a plan view of Fig. 4(a), and a view of Fig. 4(b) showing a cross section of Fig. 4(a). Fig. 5 is a view showing a third embodiment of the mounting structure of the printed circuit board of the present invention, Fig. 5(a) is a plan view, and Fig. 5(b) is a fifth (hooked; 6-B sectional view).
第6圖係第5(b)圖之c所示部分的放大截面圖。 1 〇 【主要疋件符號說明】 1··.印刷基板 2···電子零件 3···焊料 4…螺孔 10a...聚醯亞胺樹脂層 10b…玻璃環氧樹脂層 10c...導電層 12...電子零件Fig. 6 is an enlarged cross-sectional view showing a portion shown in c of Fig. 5(b). 1 〇 [Main component symbol description] 1··. Printed substrate 2···Electronic component 3···Solder 4... Screw hole 10a... Polyimine resin layer 10b... Glass epoxy layer 10c.. . Conductive layer 12...electronic parts
5.··框體 6···螺栓 7···熔焊部分 7a…熔焊接辦 ⑽…印刷基板 14...固定用孔 20…狹缝 22…溝槽 24···雜 135.··Frame 6···Bolt 7···welding part 7a...welding station (10)...printing board 14...fixing hole 20...slit 22...groove 24··· Miscellaneous 13