TW200802530A - Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program - Google Patents

Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program

Info

Publication number
TW200802530A
TW200802530A TW095133882A TW95133882A TW200802530A TW 200802530 A TW200802530 A TW 200802530A TW 095133882 A TW095133882 A TW 095133882A TW 95133882 A TW95133882 A TW 95133882A TW 200802530 A TW200802530 A TW 200802530A
Authority
TW
Taiwan
Prior art keywords
substrate
program
processing
computer
side wall
Prior art date
Application number
TW095133882A
Other languages
English (en)
Chinese (zh)
Other versions
TWI305934B (enExample
Inventor
Michio Tanaka
Shinichi Shinozuka
Masahide Tadokoro
Kunie Ogata
Hiroshi Tomita
Ryoichi Uemura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200802530A publication Critical patent/TW200802530A/zh
Application granted granted Critical
Publication of TWI305934B publication Critical patent/TWI305934B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW095133882A 2005-09-13 2006-09-13 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program TW200802530A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005265191 2005-09-13
JP2006179725A JP4636555B2 (ja) 2005-09-13 2006-06-29 基板処理装置、基板処理方法、基板処理プログラム及びそのプログラムを記録したコンピュータ読み取り可能な記録媒体

Publications (2)

Publication Number Publication Date
TW200802530A true TW200802530A (en) 2008-01-01
TWI305934B TWI305934B (enExample) 2009-02-01

Family

ID=37864961

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133882A TW200802530A (en) 2005-09-13 2006-09-13 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program

Country Status (5)

Country Link
US (1) US7867674B2 (enExample)
JP (1) JP4636555B2 (enExample)
KR (1) KR101074441B1 (enExample)
TW (1) TW200802530A (enExample)
WO (1) WO2007032369A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4891139B2 (ja) 2007-04-20 2012-03-07 東京エレクトロン株式会社 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体
JP4969304B2 (ja) 2007-04-20 2012-07-04 東京エレクトロン株式会社 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体
JP5258082B2 (ja) 2007-07-12 2013-08-07 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2014063908A (ja) * 2012-09-21 2014-04-10 Tokyo Electron Ltd 基板処理システム
JP5995881B2 (ja) * 2014-01-09 2016-09-21 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、及びコンピュータ読み取り可能な記録媒体
KR101985751B1 (ko) * 2016-12-30 2019-06-05 세메스 주식회사 기판 지지 장치 및 이를 가지는 기판 처리 설비, 그리고 기판 처리 방법
CN106597758B (zh) * 2017-01-03 2019-09-24 京东方科技集团股份有限公司 用于处理光阻部件的方法和装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211630A (ja) * 1994-01-26 1995-08-11 Sony Corp パターン形成方法及びその装置
JP2001143850A (ja) * 1999-09-03 2001-05-25 Tokyo Electron Ltd 基板の加熱処理装置，基板の加熱処理方法，基板処理装置及び基板処理方法
US6402509B1 (en) * 1999-09-03 2002-06-11 Tokyo Electron, Limited Substrate processing apparatus and substrate processing method
KR100811964B1 (ko) * 2000-09-28 2008-03-10 동경 엘렉트론 주식회사 레지스트 패턴 형성장치 및 그 방법
EP1273973A1 (en) * 2001-07-03 2003-01-08 Infineon Technologies SC300 GmbH & Co. KG Method for adjusting a temperature in a resist process
JP4127664B2 (ja) * 2003-06-30 2008-07-30 株式会社東芝 現像処理装置の調整方法

Also Published As

Publication number Publication date
KR101074441B1 (ko) 2011-10-17
JP2007110078A (ja) 2007-04-26
WO2007032369A1 (ja) 2007-03-22
TWI305934B (enExample) 2009-02-01
US7867674B2 (en) 2011-01-11
US20090104548A1 (en) 2009-04-23
JP4636555B2 (ja) 2011-02-23
KR20080049016A (ko) 2008-06-03

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