TW200800453A - Plate heat pipe manufacturing method using ultrasound welding technique - Google Patents

Plate heat pipe manufacturing method using ultrasound welding technique Download PDF

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Publication number
TW200800453A
TW200800453A TW095122501A TW95122501A TW200800453A TW 200800453 A TW200800453 A TW 200800453A TW 095122501 A TW095122501 A TW 095122501A TW 95122501 A TW95122501 A TW 95122501A TW 200800453 A TW200800453 A TW 200800453A
Authority
TW
Taiwan
Prior art keywords
heat pipe
flat
manufacturing
ultrasonic welding
capillary structure
Prior art date
Application number
TW095122501A
Other languages
English (en)
Chinese (zh)
Other versions
TWI294325B (enExample
Inventor
xiu-wei Yang
Pei-Pei Chen
Wen-Hua Yu
zhao-xiang Zheng
Original Assignee
Asia Vital Component Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Component Co filed Critical Asia Vital Component Co
Priority to TW095122501A priority Critical patent/TW200800453A/zh
Priority to US11/585,135 priority patent/US20070294892A1/en
Publication of TW200800453A publication Critical patent/TW200800453A/zh
Application granted granted Critical
Publication of TWI294325B publication Critical patent/TWI294325B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09—Heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW095122501A 2006-06-22 2006-06-22 Plate heat pipe manufacturing method using ultrasound welding technique TW200800453A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095122501A TW200800453A (en) 2006-06-22 2006-06-22 Plate heat pipe manufacturing method using ultrasound welding technique
US11/585,135 US20070294892A1 (en) 2006-06-22 2006-10-24 Method for making a plate type heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095122501A TW200800453A (en) 2006-06-22 2006-06-22 Plate heat pipe manufacturing method using ultrasound welding technique

Publications (2)

Publication Number Publication Date
TW200800453A true TW200800453A (en) 2008-01-01
TWI294325B TWI294325B (enExample) 2008-03-11

Family

ID=38872252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122501A TW200800453A (en) 2006-06-22 2006-06-22 Plate heat pipe manufacturing method using ultrasound welding technique

Country Status (2)

Country Link
US (1) US20070294892A1 (enExample)
TW (1) TW200800453A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12385699B2 (en) * 2022-01-18 2025-08-12 Yi Chang Co., Ltd. Heat sink
US12480717B2 (en) * 2023-05-26 2025-11-25 Asia Vital Components (China) Co., Ltd. Mesh capillary woven structure
US12487034B2 (en) * 2023-05-26 2025-12-02 Asia Vital Components (China) Co., Ltd. Capillary mesh woven structure

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4737285B2 (ja) * 2008-12-24 2011-07-27 ソニー株式会社 熱輸送デバイス及び電子機器
CN102205485A (zh) * 2010-03-31 2011-10-05 富准精密工业(深圳)有限公司 平板式热管及其制造方法
TWM394682U (en) * 2010-04-26 2010-12-11 Asia Vital Components Co Ltd Miniature heat spreader structure
TWI542850B (zh) * 2010-04-26 2016-07-21 Asia Vital Components Co Ltd Flat plate heat pipe structure and manufacturing method thereof
TWI479302B (zh) * 2011-08-17 2015-04-01 奇鋐科技股份有限公司 散熱裝置之固定結構
JP5654176B2 (ja) * 2012-04-16 2015-01-14 古河電気工業株式会社 ヒートパイプ
US20150122460A1 (en) * 2013-11-06 2015-05-07 Asia Vital Components Co., Ltd. Heat pipe structure
US11397057B2 (en) * 2014-09-26 2022-07-26 Asia Vital Components Co., Ltd. Vapor chamber structure
TWI641795B (zh) * 2015-07-27 2018-11-21 英商極致科技股份有限公司 Plate temperature equalization device
CN105583587A (zh) * 2016-03-25 2016-05-18 大连新锋钢管厂 一种紧固箍焊接加工工艺
WO2018198375A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー
US11033949B2 (en) * 2017-06-19 2021-06-15 Asia Vital Components Co., Ltd. Method of manufacturing a heat dissipation unit
WO2019065864A1 (ja) * 2017-09-29 2019-04-04 株式会社村田製作所 ベーパーチャンバー
CN111757634B (zh) 2019-03-29 2023-11-14 台达电子工业股份有限公司 热传递装置
JP6998979B2 (ja) * 2020-01-31 2022-01-18 古河電気工業株式会社 ベーパーチャンバ
JP7132958B2 (ja) 2020-01-31 2022-09-07 古河電気工業株式会社 ベーパーチャンバ
US20220243994A1 (en) * 2021-02-04 2022-08-04 Northrop Grumman Systems Corporation Metal woodpile capillary wick

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497662A (en) * 1966-05-05 1970-02-24 American Mach & Foundry Welding of seams by high frequency heating current while forcing welding metal into the seam
US3576210A (en) * 1969-12-15 1971-04-27 Donald S Trent Heat pipe
US3834457A (en) * 1971-01-18 1974-09-10 Bendix Corp Laminated heat pipe and method of manufacture
US5305941A (en) * 1992-12-28 1994-04-26 Plato Products, Inc. Desoldering wick

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12385699B2 (en) * 2022-01-18 2025-08-12 Yi Chang Co., Ltd. Heat sink
US12480717B2 (en) * 2023-05-26 2025-11-25 Asia Vital Components (China) Co., Ltd. Mesh capillary woven structure
US12487034B2 (en) * 2023-05-26 2025-12-02 Asia Vital Components (China) Co., Ltd. Capillary mesh woven structure

Also Published As

Publication number Publication date
US20070294892A1 (en) 2007-12-27
TWI294325B (enExample) 2008-03-11

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