TW200800411A - Conformal coating system with closed loop control - Google Patents

Conformal coating system with closed loop control Download PDF

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Publication number
TW200800411A
TW200800411A TW096111404A TW96111404A TW200800411A TW 200800411 A TW200800411 A TW 200800411A TW 096111404 A TW096111404 A TW 096111404A TW 96111404 A TW96111404 A TW 96111404A TW 200800411 A TW200800411 A TW 200800411A
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Taiwan
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coating material
control system
volume
conformal coating
program
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TW096111404A
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English (en)
Inventor
Kenneth S Espenschied
Patrick T Hogan
Jorge Cruz
David Ruf
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Nordson Corp
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Publication of TW200800411A publication Critical patent/TW200800411A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/10—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to temperature or viscosity of liquid or other fluent material discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0431—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with spray heads moved by robots or articulated arms, e.g. for applying liquid or other fluent material to 3D-surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/24—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with means, e.g. a container, for supplying liquid or other fluent material to a discharge device
    • B05B7/2489—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with means, e.g. a container, for supplying liquid or other fluent material to a discharge device an atomising fluid, e.g. a gas, being supplied to the discharge device
    • B05B7/2494—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with means, e.g. a container, for supplying liquid or other fluent material to a discharge device an atomising fluid, e.g. a gas, being supplied to the discharge device a liquid being supplied from a pressurized or compressible container to the discharge device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Robotics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Description

200800411 九、發明說明： 【發明所屬之技術領域】 本發明係關於保角塗層系統，諸#，美國專利第 4,753,819號及第5,330，1〇1號中所展示之彼等保角堂層系 統’該等專利以全文引用方式併人本文中。美國專利第 6,692,572號（”572專利”）中展示最近之保角塗層系統，該專 利亦以全文引用方式併入本文中。 【先前技術】 本—72專利所不之糸統中，每次打開分配閥時，使用流 量計之編碼ϋ計數讀取所分配材料之體積。亦確^分配材 料之時：間隔以計算材料經由分配器之當前容量流動速 率。接者’比較此經計算流動速率與表示所要流動速率之 設定點且進行校正以將實際流動速率朝向所要流動速率移 動。在經計算流動速率太低之情況下藉由打開調節器或材 料錄控制闕70以達成較高流動速率，或在經計算流動速 2 兄f藉由封閉材料流動控制閥7〇以達成較低流 動速率，來達成校正。 此系統之劣勢在於：若系統用於將保角塗層選擇地塗覆 至電路板之組件或區域，則其將為非常不精確的。不精破 於閥將僅打開-非常短的時段（幾毫秒），且在該 將僅分配非常少量的塗層材料(其僅表示流 里计之戎個編碼器計數）。此等值之任—者又 … 為一顯者篁，從而導致任何經不精確計算之疗 速率。接著，將此經不精確計算 T^之/瓜動速率與設定點相 119706.doc 200800411 2車乂以產生一"块差’，，此甚至可能引起在錯誤方向中校 p從而導致下次打開闕時將分配錯誤的量。結果可容易 值。 夕的不精確性，其對使用者沒有實際價 之糸、洗精確得多，因為如以下將描 述’其確定分配在整個雷故# μ + ^ 個电路板上之塗層材料之體積（該確 疋可為相對精確地），且比鲂妳斗瞀杜也 比車乂、、二计异值與設定點且基於此
相對精確之計算進行校正。 【發明内容】 本發明提供-種用於將保角塗層材料塗覆至一電路板之 系統，其具有： 一用於保角塗層材料之儲集器； -分配n，其自該儲集器接收保角塗層材料且將保角塗 層材料分配於一電路板上； -調節器’其調節至該分配器之保角塗層材料之流量； 一流量計，其產生一表示流向該分配器之保角塗層材料 之體積的體積信號； 一自動機，其使該分配器相對於該電路板移動；及 一控制系統，其存取用於該電路板之一塗佈程式 (coating program)，該塗佈程式含有關於該電路板之哪些 組件或區域將由保角塗層材料塗佈之資訊，該控制系統根 據該塗佈程式中之該資訊控制該自動機及該分配器以將保 角塗層材料塗覆至電路板之選定組件及區域，其中在塗佈 程式完成時’該控制系統利用來自該流量計之一或多個體 119706.doc 200800411 積信號確定在該塗佈程式期間塗覆至該電路板之保角塗層 材料之一經計算體積，該控制系統比較此經計算體積與該 電路板之一所要保角塗層材料之所分配體積值以產生一誤 差信號，該誤差信號表示該經計算體積與該所要體積值之 間的差異，該誤差信號由該控制系統使用以操縱調節器經 由該分配器提供更高或更低流量之保角塗層材料。 【實施方式】
夢看圖1，加壓流體供應器（§)經由調節器⑺及齒輪流. 計W將保角塗層材料供應至施料器（b)。施料器⑻為保角 塗層施料器’諸如，Model sc 105或sc 2〇5薄膜塗佈機， ^ -Tit i Carlsbad, Calif〇rnia^ Asympt〇tic Techn〇1〇gies me。施料器（b)由自動機⑷操縱以將保角塗層材料塗覆至 電路板之選定區域。样备洽爲从士丨 保角X層材枓用於保護電路板之選突 組件免受濕氣、汗跡孳之旦彡乡鄭 丁趼寺之衫響。控制系統⑷控制自動機及 施料器。控制系統⑷自齒輪流量計⑷接收電脈衝信號， 該等電脈衝信號表相應於通過齒㈣料之流 流量計之旋轉移動。每一雷 母電脈衝表不通過齒輪流量計之树 料的體積。請注音，雜妙同 p 一 、 -雖；、、、、圖1展不流過調節器至流量計之 保角土層材料，但是可較佳倒置此等兩個組件之位置以 得保角塗層材料首先流過流量計且接著流過調節器。以此 方式’在塗層調㈣之後流量計將 料之壓力具有任何影響。 層材 當電路板進入執行塗佈操 得用於電路板之塗佈程式。 作之單元中時，控制系統（a)獲 塗佈程式確定電路板之哪些組 119706.doc 200800411 件及區域將由保角塗層材料塗佈。舉例而可能電路板 之-十五個組件或區域將由保角塗層材料（通常以條狀形 式塗覆保角塗層材料）來塗佈。在獲得塗佈程式之後，控 制系統將控制自動機（c)以在電路板上方於χ&γ方向中移 動施料态(b) ’在此移動期間按需要地打開並封閉閥以將保 角k層材料塗覆至電路板之所要組件及區域。因此，在每 -塗佈程式期’，控制系統⑷通常將打開並封閉分配閥二 十五次左右。 在每一塗佈程式開始時，控制系統（a)將自齒輪流量計（0) 獲得”編碼器計數”。同樣，在每一塗佈程式結束時，控制 系統（a)將獲得編碼器計數。接著，塗佈程式將確定程式之 、心、扁碼器汁數且使用其確定分配於電路板上之保角塗層材 料之總體積。接著，此總分配體積將與所要總分配體積相 比較且一控制信號將自控制系統（a)產生，且到達轉換 器⑻以按需要地操縱調節器⑺。因此，若分配於電路板 上之塗層材料之體積太低，則控制信號將使調節器⑺打開 得更寬以允許更多保角塗層材料流入施料器（b)。另一方 面，右分配於電路板上之塗層材料之體積太高，則控制信 號將使調節器（f)稍微封閉以減少保角塗層材料流入施料哭 (b)。 ^ 在進打此等校正時，控制系統將建構内及外控制窗。因 此，若在塗佈程式期間經計算之所分配總體積在所要總體 積之+八1%内，則控制系統（a)在此内控制窗内將不進行任 何校正。另一方面，若在控制程式期間經計算之所分配總 119706.doc 200800411 體積在所要编辦 之優先權所^It以上’則控制系統將如使用者 在内批心制窗外停止機器或發出-鑿報。 在内控制商與外4 號至轉換'間，控制系統⑷將產生-控制信 儿至轉換态（h)以如上所述择 卩Wf)。以此方式，在 土伸式期間影響 、♦治— 8所刀配之總體積之任何趨向可早地由快 變化發覺以抵銷f趨向。舉例而言，材料之黏度 、二刀配之總體積遠離所要值轉變且可使用本發明 之系統來快速偵測此變化且校正其。 此糸統藉由利用與先前技術系統相比為相對精蜂分配之 體積計算來幫助用戶維持高品質保角塗佈操作，同時藉由 塗覆超過需要之材料確保用戶不浪費材料。 在亡述較佳實施例中，流量調節器設置經改變以進行必 要之校正。另一選擇將為調整自動機之速度以調整分配於 電路^上之塗層材料之體積。舉例而言，若控制系統確定 、二汁之所分配體積比所要體積低5%，則控制系統將自 動機之速度減少5%以增加分配於電路板上之材料之量。 塗層材料溫度為可用於改變分配於電路板上之材料之量 的第二芬數。在此實施例中，控制器將改變保角塗層材料 之溫度以改變其黏度。若分配於電路板上之材料體積太 低，則保角塗層材料之溫度將被改變以改變其黏度且經由 分配器產生較高流量之塗層材料。 使用自動機速度或塗層材料溫度作為控制參數之優點在 於此專控制參數獨立於流體壓力。因此，獨立控制迴路可 利用流體壓力自分配器達成噴霧形狀之所要扇形寬度，同 -10. 119706.doc c 5 200800411 寸藉由改文自動機速度或塗層材料溫度將分配於電路板上 一 <塗f體積溫度維持至靠近所要設定點。相反，若利用控 第方法其中控制系統所產生之誤差信號改變調節 器之設置，則此變化將影響流體遷力。結果將為：藉由使 用屋力控制迴路同時操縱調節器達成所要分配體積不可维 持所要扇形寬度。 已描述本發明之較佳實施例，且雖然可對本發明產生方 〕 法項及裝置項兩者，但是至少可對本發明產生以下兩個樣 本糸統項。 【圖式簡單說明】 • ®l㈣加Μ流體供應器經由調節器及齒輪流量計將保 • 角塗層材料供應至施料器。 【主要元件符號說明】 a 控制系統 b 施料器 、 ; C 自動機 d 流量計 f 調節器 g 流體供應器 h E/P轉換器 119706.doc

Claims (1)

  1. 200800411 十、申請專利範圍： 1· 一種用於將保角塗層材料塗覆至 有： 電路板之系統 ，其具 一用於保角塗層材料之儲集器，· -分配器’其自該儲集器接收保角塗層材料且將保角 塗層材料分配於一電路板上； 一調節器’其調節至該分配器之保角塗層材料之流 量；
    流里计，其產生一表示流向該分配器之保角塗層材 料之體積的體積信號； 曰 一自動機，其使該分配器相對於該電路板移動；及 一控制系統，其存取用於該電路板之一塗佈程式，該 塗佈程式含有關於該電路板之哪些組件或區域將由保角 k層材料塗佈之資訊，該控制系統根據該塗佈程式中之 該資訊控制該自動機及該分配器以將保角塗層材料塗覆 至該電路板之選定組件及區域，其中在該塗佈程式完成 時，該控制系統利用來自該流量計之一或多個體積信號 確疋在該塗佈程式期間塗覆至該電路板之保角塗層材料 之一經計算體積，該控制系統比較此經計算體積與該電 路板之一所要保角塗層材料之所分配體積值以產生一誤 差信號，該誤差信號表示該經計算體積與該所要體積值 之間的差異，該誤差信號由該控制系統使用以操縱該調 即器經由該分配器提供更高或更低流量之保角塗層材 料。 θ 119706.doc 200800411 2·如請求項1之系統’其中該控制系统建構 外控制窗’當5亥誤差號在該内控制窗 統不採取行動’ Μ該誤差彳§號在該外控制 系統可操作以產生一警報或或停止該系統 一内控制窗及 内時該控制系 窗外時該控制
    119706.doc -2-
TW096111404A 2006-06-28 2007-03-30 Conformal coating system with closed loop control TW200800411A (en)

Applications Claiming Priority (1)

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