TW200743179A - Semiconductor structure - Google Patents
Semiconductor structureInfo
- Publication number
- TW200743179A TW200743179A TW096103886A TW96103886A TW200743179A TW 200743179 A TW200743179 A TW 200743179A TW 096103886 A TW096103886 A TW 096103886A TW 96103886 A TW96103886 A TW 96103886A TW 200743179 A TW200743179 A TW 200743179A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor structure
- coupled
- voltage
- substrate
- shield lines
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/382,202 US20070257339A1 (en) | 2006-05-08 | 2006-05-08 | Shield structures |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200743179A true TW200743179A (en) | 2007-11-16 |
TWI343092B TWI343092B (en) | 2011-06-01 |
Family
ID=38660444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096103886A TWI343092B (en) | 2006-05-08 | 2007-02-02 | Semiconductor structure |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070257339A1 (zh) |
CN (1) | CN101071804B (zh) |
TW (1) | TWI343092B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101814645B (zh) * | 2009-02-25 | 2013-05-29 | 台湾积体电路制造股份有限公司 | 耦合微条线结构及其制造方法 |
US9001280B2 (en) | 2012-06-08 | 2015-04-07 | Apple Inc. | Devices and methods for shielding displays from electrostatic discharge |
US9048127B2 (en) * | 2013-09-25 | 2015-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three dimensional circuit including shielded inductor and method of forming same |
US10451652B2 (en) * | 2014-07-16 | 2019-10-22 | Teradyne, Inc. | Coaxial structure for transmission of signals in test equipment |
JP6515678B2 (ja) * | 2015-05-25 | 2019-05-22 | 富士通株式会社 | コンバータ搭載基板 |
CN104900632B (zh) * | 2015-06-07 | 2019-03-08 | 上海华虹宏力半导体制造有限公司 | 信号线屏蔽结构 |
US10431511B2 (en) | 2017-05-01 | 2019-10-01 | Qualcomm Incorporated | Power amplifier with RF structure |
JP2020043219A (ja) * | 2018-09-11 | 2020-03-19 | ソニーセミコンダクタソリューションズ株式会社 | 回路基板、半導体装置、および、電子機器 |
CN113380833B (zh) * | 2021-05-31 | 2024-02-20 | 合肥维信诺科技有限公司 | 阵列基板、显示面板及阵列基板的制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6211541B1 (en) * | 1999-02-01 | 2001-04-03 | Lucent Technologies, Inc. | Article for de-embedding parasitics in integrated circuits |
TW558823B (en) * | 2002-04-10 | 2003-10-21 | Via Tech Inc | Through-hole process of integrated circuit substrate |
JP2004039867A (ja) * | 2002-07-03 | 2004-02-05 | Sony Corp | 多層配線回路モジュール及びその製造方法 |
US6878964B1 (en) * | 2003-09-26 | 2005-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ground-signal-ground pad layout for device tester structure |
-
2006
- 2006-05-08 US US11/382,202 patent/US20070257339A1/en not_active Abandoned
-
2007
- 2007-02-02 TW TW096103886A patent/TWI343092B/zh active
- 2007-04-19 CN CN2007100969570A patent/CN101071804B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN101071804B (zh) | 2011-07-20 |
CN101071804A (zh) | 2007-11-14 |
US20070257339A1 (en) | 2007-11-08 |
TWI343092B (en) | 2011-06-01 |
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