TW200742013A - Semiconductor flip-chip package component and fabricating method - Google Patents

Semiconductor flip-chip package component and fabricating method

Info

Publication number
TW200742013A
TW200742013A TW095115442A TW95115442A TW200742013A TW 200742013 A TW200742013 A TW 200742013A TW 095115442 A TW095115442 A TW 095115442A TW 95115442 A TW95115442 A TW 95115442A TW 200742013 A TW200742013 A TW 200742013A
Authority
TW
Taiwan
Prior art keywords
chip package
package component
semiconductor flip
die
flip
Prior art date
Application number
TW095115442A
Other languages
Chinese (zh)
Other versions
TWI299555B (en
Inventor
Wen-Chih Chen
Original Assignee
Taiwan Tft Lcd Ass
Chunghwa Picture Tubes Ltd
Au Optronics Corp
Quanta Display Inc
Hannstar Display Corp
Chi Mei Optoelectronics Corp
Ind Tech Res Inst
Toppoly Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Tft Lcd Ass, Chunghwa Picture Tubes Ltd, Au Optronics Corp, Quanta Display Inc, Hannstar Display Corp, Chi Mei Optoelectronics Corp, Ind Tech Res Inst, Toppoly Optoelectronics Corp filed Critical Taiwan Tft Lcd Ass
Priority to TW095115442A priority Critical patent/TWI299555B/en
Priority to KR1020060074225A priority patent/KR100868616B1/en
Priority to JP2006215739A priority patent/JP2007300052A/en
Publication of TW200742013A publication Critical patent/TW200742013A/en
Application granted granted Critical
Publication of TWI299555B publication Critical patent/TWI299555B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73101—Location prior to the connecting process on the same surface
    • H01L2224/73103—Bump and layer connectors
    • H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector

Abstract

A semiconductor flip-chip package component and fabricating method is disclosed. The present invention improves using pre-coated an anisotropic conductive adhesive on wafer-level flip chip package disadvantage of the prior art. The present invention provides using a non-conductive paste and compliant polymer bump on the die to product the semiconductor flip-chip package component. The semiconductor flip-chip package component comprises at least one compliant polymer bump sits on a die, and a paste sit on the surface of the die, wherein the surface of the die is the same of the compliant polymer bumps surface. The semiconductor flip-chip package component has low-priced, fine pitch and overcome size limitation of the type carrier package advantages.
TW095115442A 2006-04-28 2006-04-28 Semiconductor flip-chip package component and fabricating method TWI299555B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095115442A TWI299555B (en) 2006-04-28 2006-04-28 Semiconductor flip-chip package component and fabricating method
KR1020060074225A KR100868616B1 (en) 2006-04-28 2006-08-07 Semiconductor flip-chip package component and fabricating method
JP2006215739A JP2007300052A (en) 2006-04-28 2006-08-08 Flip-chip packaging part, and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095115442A TWI299555B (en) 2006-04-28 2006-04-28 Semiconductor flip-chip package component and fabricating method

Publications (2)

Publication Number Publication Date
TW200742013A true TW200742013A (en) 2007-11-01
TWI299555B TWI299555B (en) 2008-08-01

Family

ID=38769275

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115442A TWI299555B (en) 2006-04-28 2006-04-28 Semiconductor flip-chip package component and fabricating method

Country Status (3)

Country Link
JP (1) JP2007300052A (en)
KR (1) KR100868616B1 (en)
TW (1) TWI299555B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492342B (en) * 2011-10-12 2015-07-11 Novatek Microelectronics Corp Ic chip package and chip-on-glass structure using the same
TWI500126B (en) * 2013-01-02 2015-09-11 Au Optronics Corp Method of packaging driving device of display device and package structure of driving device of display device
US9236360B2 (en) 2011-10-12 2016-01-12 Novatek Microelectronics Corp. IC chip package and chip-on-glass structure using the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10595418B2 (en) * 2017-12-29 2020-03-17 China Petroleum & Chemical Corporation Method and apparatus for improving drilling electronics performance
KR102646084B1 (en) 2019-05-30 2024-03-12 나노시스, 인크. Light emitting diode device comprising positive photoresist insulating spacer and conductive sidewall contact and method of manufacturing same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03160738A (en) * 1989-11-17 1991-07-10 Fujitsu Ltd Facedown chip and its manufacture and its mounting board
JPH0897399A (en) * 1994-09-28 1996-04-12 Fujitsu Ltd Semiconductor chip, its manufacturing method, semiconductor device, its manufacturing method and mounting structure of semiconductor device
JPH08204166A (en) * 1995-01-23 1996-08-09 Nippon Hoso Kyokai <Nhk> Multilayered solid-state image sensing device
JP3197788B2 (en) * 1995-05-18 2001-08-13 株式会社日立製作所 Method for manufacturing semiconductor device
JP3038703B2 (en) * 1995-07-20 2000-05-08 カシオ計算機株式会社 Semiconductor device, method of manufacturing the same, and method of mounting the same
JP2000299409A (en) * 1999-04-16 2000-10-24 Rohm Co Ltd Structure for flip chip mounting semiconductor chip and its manufacture
JP4334128B2 (en) * 2000-10-27 2009-09-30 パナソニック株式会社 Semiconductor mounting method and semiconductor mounting apparatus
JP2003023034A (en) * 2001-07-06 2003-01-24 Matsushita Electric Works Ltd Flip-chip mounting method
JP3718190B2 (en) * 2002-07-31 2005-11-16 富士通株式会社 Method for forming surface mount structure and surface mount structure
JP2005340761A (en) * 2004-04-27 2005-12-08 Seiko Epson Corp Packaging method of semiconductor device, circuit board, electro-optical device, and electronic apparatus
JP2006086265A (en) * 2004-09-15 2006-03-30 Seiko Epson Corp Wiring board, its manufacturing method and electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492342B (en) * 2011-10-12 2015-07-11 Novatek Microelectronics Corp Ic chip package and chip-on-glass structure using the same
US9236360B2 (en) 2011-10-12 2016-01-12 Novatek Microelectronics Corp. IC chip package and chip-on-glass structure using the same
TWI500126B (en) * 2013-01-02 2015-09-11 Au Optronics Corp Method of packaging driving device of display device and package structure of driving device of display device

Also Published As

Publication number Publication date
KR20070106364A (en) 2007-11-01
JP2007300052A (en) 2007-11-15
TWI299555B (en) 2008-08-01
KR100868616B1 (en) 2008-11-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees