TW200742013A - Semiconductor flip-chip package component and fabricating method - Google Patents
Semiconductor flip-chip package component and fabricating methodInfo
- Publication number
- TW200742013A TW200742013A TW095115442A TW95115442A TW200742013A TW 200742013 A TW200742013 A TW 200742013A TW 095115442 A TW095115442 A TW 095115442A TW 95115442 A TW95115442 A TW 95115442A TW 200742013 A TW200742013 A TW 200742013A
- Authority
- TW
- Taiwan
- Prior art keywords
- chip package
- package component
- semiconductor flip
- die
- flip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/731—Location prior to the connecting process
- H01L2224/73101—Location prior to the connecting process on the same surface
- H01L2224/73103—Bump and layer connectors
- H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Dicing (AREA)
Abstract
A semiconductor flip-chip package component and fabricating method is disclosed. The present invention improves using pre-coated an anisotropic conductive adhesive on wafer-level flip chip package disadvantage of the prior art. The present invention provides using a non-conductive paste and compliant polymer bump on the die to product the semiconductor flip-chip package component. The semiconductor flip-chip package component comprises at least one compliant polymer bump sits on a die, and a paste sit on the surface of the die, wherein the surface of the die is the same of the compliant polymer bumps surface. The semiconductor flip-chip package component has low-priced, fine pitch and overcome size limitation of the type carrier package advantages.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095115442A TWI299555B (en) | 2006-04-28 | 2006-04-28 | Semiconductor flip-chip package component and fabricating method |
KR1020060074225A KR100868616B1 (en) | 2006-04-28 | 2006-08-07 | Semiconductor flip-chip package component and fabricating method |
JP2006215739A JP2007300052A (en) | 2006-04-28 | 2006-08-08 | Flip-chip packaging part, and manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095115442A TWI299555B (en) | 2006-04-28 | 2006-04-28 | Semiconductor flip-chip package component and fabricating method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200742013A true TW200742013A (en) | 2007-11-01 |
TWI299555B TWI299555B (en) | 2008-08-01 |
Family
ID=38769275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095115442A TWI299555B (en) | 2006-04-28 | 2006-04-28 | Semiconductor flip-chip package component and fabricating method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007300052A (en) |
KR (1) | KR100868616B1 (en) |
TW (1) | TWI299555B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI492342B (en) * | 2011-10-12 | 2015-07-11 | Novatek Microelectronics Corp | Ic chip package and chip-on-glass structure using the same |
TWI500126B (en) * | 2013-01-02 | 2015-09-11 | Au Optronics Corp | Method of packaging driving device of display device and package structure of driving device of display device |
US9236360B2 (en) | 2011-10-12 | 2016-01-12 | Novatek Microelectronics Corp. | IC chip package and chip-on-glass structure using the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10595418B2 (en) * | 2017-12-29 | 2020-03-17 | China Petroleum & Chemical Corporation | Method and apparatus for improving drilling electronics performance |
US11444065B2 (en) | 2019-05-30 | 2022-09-13 | Nanosys, Inc. | Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03160738A (en) * | 1989-11-17 | 1991-07-10 | Fujitsu Ltd | Facedown chip and its manufacture and its mounting board |
JPH0897399A (en) * | 1994-09-28 | 1996-04-12 | Fujitsu Ltd | Semiconductor chip, its manufacturing method, semiconductor device, its manufacturing method and mounting structure of semiconductor device |
JPH08204166A (en) * | 1995-01-23 | 1996-08-09 | Nippon Hoso Kyokai <Nhk> | Multilayered solid-state image sensing device |
JP3197788B2 (en) * | 1995-05-18 | 2001-08-13 | 株式会社日立製作所 | Method for manufacturing semiconductor device |
JP3038703B2 (en) * | 1995-07-20 | 2000-05-08 | カシオ計算機株式会社 | Semiconductor device, method of manufacturing the same, and method of mounting the same |
JP2000299409A (en) * | 1999-04-16 | 2000-10-24 | Rohm Co Ltd | Structure for flip chip mounting semiconductor chip and its manufacture |
JP4334128B2 (en) * | 2000-10-27 | 2009-09-30 | パナソニック株式会社 | Semiconductor mounting method and semiconductor mounting apparatus |
JP2003023034A (en) * | 2001-07-06 | 2003-01-24 | Matsushita Electric Works Ltd | Flip-chip mounting method |
JP3718190B2 (en) * | 2002-07-31 | 2005-11-16 | 富士通株式会社 | Method for forming surface mount structure and surface mount structure |
JP2005340761A (en) * | 2004-04-27 | 2005-12-08 | Seiko Epson Corp | Packaging method of semiconductor device, circuit board, electro-optical device, and electronic apparatus |
JP2006086265A (en) * | 2004-09-15 | 2006-03-30 | Seiko Epson Corp | Wiring board, its manufacturing method and electronic apparatus |
-
2006
- 2006-04-28 TW TW095115442A patent/TWI299555B/en not_active IP Right Cessation
- 2006-08-07 KR KR1020060074225A patent/KR100868616B1/en not_active IP Right Cessation
- 2006-08-08 JP JP2006215739A patent/JP2007300052A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI492342B (en) * | 2011-10-12 | 2015-07-11 | Novatek Microelectronics Corp | Ic chip package and chip-on-glass structure using the same |
US9236360B2 (en) | 2011-10-12 | 2016-01-12 | Novatek Microelectronics Corp. | IC chip package and chip-on-glass structure using the same |
TWI500126B (en) * | 2013-01-02 | 2015-09-11 | Au Optronics Corp | Method of packaging driving device of display device and package structure of driving device of display device |
Also Published As
Publication number | Publication date |
---|---|
TWI299555B (en) | 2008-08-01 |
KR20070106364A (en) | 2007-11-01 |
JP2007300052A (en) | 2007-11-15 |
KR100868616B1 (en) | 2008-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |