TW200741968A - Butted contact structure and method for forming the same - Google Patents
Butted contact structure and method for forming the sameInfo
- Publication number
- TW200741968A TW200741968A TW096109408A TW96109408A TW200741968A TW 200741968 A TW200741968 A TW 200741968A TW 096109408 A TW096109408 A TW 096109408A TW 96109408 A TW96109408 A TW 96109408A TW 200741968 A TW200741968 A TW 200741968A
- Authority
- TW
- Taiwan
- Prior art keywords
- region
- forming
- contact structure
- same
- source
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000002955 isolation Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
- H01L21/743—Making of internal connections, substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising semiconducting material
- H01L21/28531—Making of side-wall contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/405,102 US7586147B2 (en) | 2006-04-17 | 2006-04-17 | Butted source contact and well strap |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200741968A true TW200741968A (en) | 2007-11-01 |
Family
ID=38605312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096109408A TW200741968A (en) | 2006-04-17 | 2007-03-19 | Butted contact structure and method for forming the same |
Country Status (3)
Country | Link |
---|---|
US (2) | US7586147B2 (zh) |
CN (1) | CN101060109A (zh) |
TW (1) | TW200741968A (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8471390B2 (en) * | 2006-05-12 | 2013-06-25 | Vishay-Siliconix | Power MOSFET contact metallization |
US8035140B2 (en) * | 2007-07-26 | 2011-10-11 | Infineon Technologies Ag | Method and layout of semiconductor device with reduced parasitics |
US7902608B2 (en) * | 2009-05-28 | 2011-03-08 | International Business Machines Corporation | Integrated circuit device with deep trench isolation regions for all inter-well and intra-well isolation and with a shared contact to a junction between adjacent device diffusion regions and an underlying floating well section |
US9306056B2 (en) | 2009-10-30 | 2016-04-05 | Vishay-Siliconix | Semiconductor device with trench-like feed-throughs |
US8675397B2 (en) | 2010-06-25 | 2014-03-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cell structure for dual-port SRAM |
US8399931B2 (en) | 2010-06-30 | 2013-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Layout for multiple-fin SRAM cell |
US9449962B2 (en) * | 2010-08-06 | 2016-09-20 | Altera Corporation | N-well/P-well strap structures |
US8217464B2 (en) * | 2010-08-06 | 2012-07-10 | Altera Corporation | N-well/P-well strap structures |
US8310860B1 (en) * | 2010-11-30 | 2012-11-13 | Texas Instruments Incorporated | SRAM strap row double well contact |
US8315086B1 (en) * | 2010-11-30 | 2012-11-20 | Texas Instruments Incorporated | SRAM strap row well contact |
US8320165B1 (en) * | 2010-11-30 | 2012-11-27 | Texas Instrument Incorporated | SRAM strap row substrate contact |
US20120261738A1 (en) * | 2012-06-29 | 2012-10-18 | Dustin Do | N-Well/P-Well Strap Structures |
US10157987B1 (en) | 2017-08-14 | 2018-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fin-based strap cell structure |
US11404423B2 (en) | 2018-04-19 | 2022-08-02 | Taiwan Semiconductor Manufacturing Co., Ltd | Fin-based strap cell structure for improving memory performance |
US10629739B2 (en) * | 2018-07-18 | 2020-04-21 | Globalfoundries Inc. | Methods of forming spacers adjacent gate structures of a transistor device |
US10868020B2 (en) | 2018-08-29 | 2020-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Well strap structures and methods of forming the same |
KR102609372B1 (ko) | 2018-08-31 | 2023-12-06 | 삼성전자주식회사 | 반도체 소자 |
US10797058B2 (en) | 2018-09-28 | 2020-10-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Conductive feature formation |
US11600623B2 (en) | 2018-11-26 | 2023-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Well pick-up region design for improving memory macro performance |
US11367479B2 (en) | 2019-09-30 | 2022-06-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | SRAM structure and method |
TWI755874B (zh) | 2019-09-30 | 2022-02-21 | 台灣積體電路製造股份有限公司 | 半導體裝置及其形成方法 |
US11121138B1 (en) | 2020-04-24 | 2021-09-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Low resistance pickup cells for SRAM |
US11374088B2 (en) | 2020-08-14 | 2022-06-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Leakage reduction in gate-all-around devices |
US20220246756A1 (en) * | 2021-01-29 | 2022-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method for manufacturing the same |
US11482518B2 (en) | 2021-03-26 | 2022-10-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structures having wells with protruding sections for pickup cells |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952849A (ja) * | 1982-09-20 | 1984-03-27 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH01264253A (ja) * | 1988-04-15 | 1989-10-20 | Hitachi Ltd | 半導体装置の製造方法 |
KR100451513B1 (ko) * | 2002-05-07 | 2004-10-06 | 주식회사 하이닉스반도체 | 반도체 소자의 콘택홀 형성 방법 |
US6686247B1 (en) * | 2002-08-22 | 2004-02-03 | Intel Corporation | Self-aligned contacts to gates |
-
2006
- 2006-04-17 US US11/405,102 patent/US7586147B2/en active Active
-
2007
- 2007-03-19 TW TW096109408A patent/TW200741968A/zh unknown
- 2007-04-09 CN CNA200710090890XA patent/CN101060109A/zh active Pending
-
2009
- 2009-07-28 US US12/510,951 patent/US7906389B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20090286395A1 (en) | 2009-11-19 |
US7906389B2 (en) | 2011-03-15 |
US7586147B2 (en) | 2009-09-08 |
US20070243671A1 (en) | 2007-10-18 |
CN101060109A (zh) | 2007-10-24 |
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