TW200739970A - Side-view light emitting diode package having a reflector - Google Patents

Side-view light emitting diode package having a reflector

Info

Publication number
TW200739970A
TW200739970A TW096109211A TW96109211A TW200739970A TW 200739970 A TW200739970 A TW 200739970A TW 096109211 A TW096109211 A TW 096109211A TW 96109211 A TW96109211 A TW 96109211A TW 200739970 A TW200739970 A TW 200739970A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
diode package
reflector
view light
Prior art date
Application number
TW096109211A
Other languages
English (en)
Other versions
TWI331815B (en
Inventor
Sergey Bukesov
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060024670A external-priority patent/KR20070094247A/ko
Priority claimed from KR1020060029513A external-priority patent/KR100771569B1/ko
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Publication of TW200739970A publication Critical patent/TW200739970A/zh
Application granted granted Critical
Publication of TWI331815B publication Critical patent/TWI331815B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW096109211A 2006-03-17 2007-03-16 Side-view light emitting diode package having a reflector TWI331815B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060024670A KR20070094247A (ko) 2006-03-17 2006-03-17 반사기를 구비하는 측면 발광 다이오드 패키지
KR1020060029513A KR100771569B1 (ko) 2006-03-31 2006-03-31 발광소자용 반사컵과 이를 사용한 발광소자 및 이의제조방법

Publications (2)

Publication Number Publication Date
TW200739970A true TW200739970A (en) 2007-10-16
TWI331815B TWI331815B (en) 2010-10-11

Family

ID=38522621

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109211A TWI331815B (en) 2006-03-17 2007-03-16 Side-view light emitting diode package having a reflector

Country Status (3)

Country Link
US (2) US7777244B2 (zh)
TW (1) TWI331815B (zh)
WO (1) WO2007108616A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8362493B2 (en) 2007-11-02 2013-01-29 Sanken Electric Co., Ltd. Configurations of a semiconductor light emitting device and planar light source

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007108616A1 (en) * 2006-03-17 2007-09-27 Seoul Semiconductor Co., Ltd. Side-view light emitting diode package having a reflector
US20100282566A1 (en) * 2007-09-26 2010-11-11 Mei, Inc. Document validator subassembly
DE102008003971A1 (de) * 2008-01-11 2009-07-16 Ledon Lighting Jennersdorf Gmbh Leuchtdiodenanordnung mit Schutzrahmen
KR101491485B1 (ko) * 2008-11-18 2015-02-11 삼성전자주식회사 측면 방출형 발광장치 및 선광원형 발광장치
TWM390542U (en) * 2010-03-17 2010-10-11 Hon Hai Prec Ind Co Ltd LED lead frame
RU2452059C1 (ru) * 2011-01-13 2012-05-27 Закрытое Акционерное Общество "Научно-Производственная Коммерческая Фирма "Элтан Лтд" Светодиодный источник белого света с удаленным фотолюминесцентным отражающим конвертером
TWI451605B (zh) 2011-03-08 2014-09-01 Lextar Electronics Corp 具有金屬反射面與散熱塊之發光二極體結構
JP6236999B2 (ja) * 2013-08-29 2017-11-29 日亜化学工業株式会社 発光装置
CN103872219B (zh) * 2014-03-18 2016-09-14 深圳市瑞丰光电子股份有限公司 一种led封装支架及led发光体
CN108886079B (zh) * 2016-03-22 2022-07-19 苏州乐琻半导体有限公司 发光器件
CN110391326A (zh) * 2018-04-17 2019-10-29 展晶科技(深圳)有限公司 侧面发光型发光二极管封装结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10020465A1 (de) 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
US6552368B2 (en) 2000-09-29 2003-04-22 Omron Corporation Light emission device
US6878972B2 (en) 2001-06-08 2005-04-12 Agilent Technologies, Inc. Light-emitting diode with plastic reflector cup
JP2004265980A (ja) 2003-02-28 2004-09-24 Noritsu Koki Co Ltd 発光ダイオード光源ユニット
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
KR100665216B1 (ko) * 2005-07-04 2007-01-09 삼성전기주식회사 개선된 측벽 반사 구조를 갖는 측면형 발광다이오드
WO2007108616A1 (en) * 2006-03-17 2007-09-27 Seoul Semiconductor Co., Ltd. Side-view light emitting diode package having a reflector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8362493B2 (en) 2007-11-02 2013-01-29 Sanken Electric Co., Ltd. Configurations of a semiconductor light emitting device and planar light source
TWI401828B (zh) * 2007-11-02 2013-07-11 Sanken Electric Co Ltd 半導體發光裝置及平面光源

Also Published As

Publication number Publication date
US20090200566A1 (en) 2009-08-13
WO2007108616A1 (en) 2007-09-27
TWI331815B (en) 2010-10-11
US7777244B2 (en) 2010-08-17
US8138514B2 (en) 2012-03-20
US20100308364A1 (en) 2010-12-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees