TW200739781A - Technique for monitoring and controlling a plasma process - Google Patents

Technique for monitoring and controlling a plasma process

Info

Publication number
TW200739781A
TW200739781A TW096108396A TW96108396A TW200739781A TW 200739781 A TW200739781 A TW 200739781A TW 096108396 A TW096108396 A TW 096108396A TW 96108396 A TW96108396 A TW 96108396A TW 200739781 A TW200739781 A TW 200739781A
Authority
TW
Taiwan
Prior art keywords
drift tube
housing
monitoring
ions
technique
Prior art date
Application number
TW096108396A
Other languages
English (en)
Chinese (zh)
Inventor
Bon-Woong Koo
Ludovic Godet
Vassilis Panayotis Vourloumis
Vikram Singh
Ziwei Fang
Bernard G Lindsay
Original Assignee
Varian Semiconductor Equipment
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/371,907 external-priority patent/US7476849B2/en
Application filed by Varian Semiconductor Equipment filed Critical Varian Semiconductor Equipment
Publication of TW200739781A publication Critical patent/TW200739781A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00—Particle spectrometers or separator tubes
    • H01J49/26—Mass spectrometers or separator tubes
    • H01J49/34—Dynamic spectrometers
    • H01J49/40—Time-of-flight spectrometers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422—Arrangement for selecting ions or species in the plasma
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • General Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Plasma Technology (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electron Tubes For Measurement (AREA)
  • Drying Of Semiconductors (AREA)
TW096108396A 2006-03-10 2007-03-12 Technique for monitoring and controlling a plasma process TW200739781A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/371,907 US7476849B2 (en) 2006-03-10 2006-03-10 Technique for monitoring and controlling a plasma process
US11/678,524 US7453059B2 (en) 2006-03-10 2007-02-23 Technique for monitoring and controlling a plasma process

Publications (1)

Publication Number Publication Date
TW200739781A true TW200739781A (en) 2007-10-16

Family

ID=38319233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108396A TW200739781A (en) 2006-03-10 2007-03-12 Technique for monitoring and controlling a plasma process

Country Status (5)

Country Link
US (2) US7453059B2 (enExample)
JP (1) JP2009529765A (enExample)
KR (1) KR20080112266A (enExample)
TW (1) TW200739781A (enExample)
WO (1) WO2007106449A2 (enExample)

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* Cited by examiner, † Cited by third party
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TWI501179B (zh) * 2009-06-30 2015-09-21 蘭姆研究公司 無須產生電漿而判定電漿處理系統已否準備就緒之系統及方法

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US7453059B2 (en) * 2006-03-10 2008-11-18 Varian Semiconductor Equipment Associates, Inc. Technique for monitoring and controlling a plasma process
US7675730B2 (en) * 2007-06-25 2010-03-09 Varian Semiconductor Equipment Associates, Inc. Techniques for detecting wafer charging in a plasma processing system
US20090004836A1 (en) * 2007-06-29 2009-01-01 Varian Semiconductor Equipment Associates, Inc. Plasma doping with enhanced charge neutralization
US9123509B2 (en) 2007-06-29 2015-09-01 Varian Semiconductor Equipment Associates, Inc. Techniques for plasma processing a substrate
US20090017229A1 (en) * 2007-07-10 2009-01-15 Varian Semiconductor Equipment Associates, Inc. Processing System Platen having a Variable Thermal Conductivity Profile
US20090104761A1 (en) * 2007-10-19 2009-04-23 Varian Semiconductor Equipment Associates, Inc. Plasma Doping System With Charge Control
US20090104719A1 (en) * 2007-10-23 2009-04-23 Varian Semiconductor Equipment Associates, Inc. Plasma Doping System with In-Situ Chamber Condition Monitoring
US7888636B2 (en) * 2007-11-01 2011-02-15 Varian Semiconductor Equipment Associates, Inc. Measuring energy contamination using time-of-flight techniques
US7586100B2 (en) * 2008-02-12 2009-09-08 Varian Semiconductor Equipment Associates, Inc. Closed loop control and process optimization in plasma doping processes using a time of flight ion detector
US20090227096A1 (en) * 2008-03-07 2009-09-10 Varian Semiconductor Equipment Associates, Inc. Method Of Forming A Retrograde Material Profile Using Ion Implantation
US7927986B2 (en) * 2008-07-22 2011-04-19 Varian Semiconductor Equipment Associates, Inc. Ion implantation with heavy halogenide compounds
US20100019141A1 (en) * 2008-07-25 2010-01-28 Varian Semiconductor Equipment Associates, Inc. Energy contamination monitor with neutral current detection
US20100048018A1 (en) * 2008-08-25 2010-02-25 Varian Semiconductor Equipment Associates, Inc. Doped Layers for Reducing Electromigration
US20100155600A1 (en) * 2008-12-23 2010-06-24 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for plasma dose measurement
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US8698107B2 (en) * 2011-01-10 2014-04-15 Varian Semiconductor Equipment Associates, Inc. Technique and apparatus for monitoring ion mass, energy, and angle in processing systems
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CN102623287B (zh) * 2012-02-22 2015-03-11 北京交通大学 一种真空放电等离子体的离子流检测装置及方法
US9029763B2 (en) * 2013-08-30 2015-05-12 Agilent Technologies, Inc. Ion deflection in time-of-flight mass spectrometry
KR101406696B1 (ko) * 2013-12-27 2014-06-11 (주)제이오션 원격 플라즈마 소스를 위한 플라즈마 블록
US9230773B1 (en) * 2014-10-16 2016-01-05 Varian Semiconductor Equipment Associates, Inc. Ion beam uniformity control
US9627190B2 (en) * 2015-03-27 2017-04-18 Agilent Technologies, Inc. Energy resolved time-of-flight mass spectrometry
KR20160120382A (ko) 2015-04-07 2016-10-18 삼성전자주식회사 광학 분광 분석 장치 및 플라즈마 처리 장치
US10553411B2 (en) * 2015-09-10 2020-02-04 Taiwan Semiconductor Manufacturing Co., Ltd. Ion collector for use in plasma systems
TWI888050B (zh) * 2019-03-25 2025-06-21 日商亞多納富有限公司 製程系統
TWI897405B (zh) * 2019-03-25 2025-09-11 日商亞多納富有限公司 半導體製造系統、其控制方法及控制該系統的電腦程式
US11521832B2 (en) * 2020-01-10 2022-12-06 COMET Technologies USA, Inc. Uniformity control for radio frequency plasma processing systems
JP7050139B2 (ja) * 2020-12-14 2022-04-07 東京エレクトロン株式会社 基板処理装置及び測定用基板
CN113473675B (zh) * 2021-06-03 2022-10-18 荣耀终端有限公司 光源电路及终端
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EP4760772A1 (en) * 2024-12-10 2026-06-17 Centre National de la Recherche Scientifique Method and system for quantitative and time-resolved measurement of the material fluxes of a plasma acting on a surface

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501179B (zh) * 2009-06-30 2015-09-21 蘭姆研究公司 無須產生電漿而判定電漿處理系統已否準備就緒之系統及方法

Also Published As

Publication number Publication date
KR20080112266A (ko) 2008-12-24
WO2007106449A3 (en) 2007-11-01
US20070227231A1 (en) 2007-10-04
US7453059B2 (en) 2008-11-18
JP2009529765A (ja) 2009-08-20
US20090283670A1 (en) 2009-11-19
WO2007106449A2 (en) 2007-09-20

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