TW200737461A - Method for forming semiconductor package substrate - Google Patents

Method for forming semiconductor package substrate

Info

Publication number
TW200737461A
TW200737461A TW095111377A TW95111377A TW200737461A TW 200737461 A TW200737461 A TW 200737461A TW 095111377 A TW095111377 A TW 095111377A TW 95111377 A TW95111377 A TW 95111377A TW 200737461 A TW200737461 A TW 200737461A
Authority
TW
Taiwan
Prior art keywords
layer
forming
ball side
chip placement
conductive
Prior art date
Application number
TW095111377A
Other languages
English (en)
Chinese (zh)
Other versions
TWI292613B (enExample
Inventor
Pao-Hung Chou
Original Assignee
Phoenix Prec Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology filed Critical Phoenix Prec Technology
Priority to TW095111377A priority Critical patent/TW200737461A/zh
Publication of TW200737461A publication Critical patent/TW200737461A/zh
Application granted granted Critical
Publication of TWI292613B publication Critical patent/TWI292613B/zh

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095111377A 2006-03-31 2006-03-31 Method for forming semiconductor package substrate TW200737461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095111377A TW200737461A (en) 2006-03-31 2006-03-31 Method for forming semiconductor package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095111377A TW200737461A (en) 2006-03-31 2006-03-31 Method for forming semiconductor package substrate

Publications (2)

Publication Number Publication Date
TW200737461A true TW200737461A (en) 2007-10-01
TWI292613B TWI292613B (enExample) 2008-01-11

Family

ID=45067578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111377A TW200737461A (en) 2006-03-31 2006-03-31 Method for forming semiconductor package substrate

Country Status (1)

Country Link
TW (1) TW200737461A (enExample)

Also Published As

Publication number Publication date
TWI292613B (enExample) 2008-01-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees