TW200736619A - A probe array structure and a method of making a probe array structure - Google Patents

A probe array structure and a method of making a probe array structure

Info

Publication number
TW200736619A
TW200736619A TW095148740A TW95148740A TW200736619A TW 200736619 A TW200736619 A TW 200736619A TW 095148740 A TW095148740 A TW 095148740A TW 95148740 A TW95148740 A TW 95148740A TW 200736619 A TW200736619 A TW 200736619A
Authority
TW
Taiwan
Prior art keywords
probe array
array structure
making
contact structures
structures
Prior art date
Application number
TW095148740A
Other languages
English (en)
Chinese (zh)
Inventor
Benjamin N Eldridge
Treliant Fang
John K Gritters
Igor Y Khandros
Lun-Yu Ma
Gaetan L Mathieu
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of TW200736619A publication Critical patent/TW200736619A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095148740A 2006-01-03 2006-12-25 A probe array structure and a method of making a probe array structure TW200736619A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/306,574 US20070152685A1 (en) 2006-01-03 2006-01-03 A probe array structure and a method of making a probe array structure

Publications (1)

Publication Number Publication Date
TW200736619A true TW200736619A (en) 2007-10-01

Family

ID=38223689

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148740A TW200736619A (en) 2006-01-03 2006-12-25 A probe array structure and a method of making a probe array structure

Country Status (7)

Country Link
US (1) US20070152685A1 (enExample)
EP (1) EP1977260A2 (enExample)
JP (1) JP2009524800A (enExample)
KR (1) KR20080081991A (enExample)
CN (1) CN101490570A (enExample)
TW (1) TW200736619A (enExample)
WO (1) WO2007081522A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI874679B (zh) * 2020-07-20 2025-03-01 義大利商探針科技公司 用於電子裝置的測試設備的探針頭的接觸探針

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US9533376B2 (en) 2013-01-15 2017-01-03 Microfabrica Inc. Methods of forming parts using laser machining
JP4916893B2 (ja) * 2007-01-05 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
US8513942B1 (en) * 2009-12-23 2013-08-20 Formfactor, Inc. Method of forming a probe substrate by layering probe row structures and probe substrates formed thereby
US8476538B2 (en) * 2010-03-08 2013-07-02 Formfactor, Inc. Wiring substrate with customization layers
US8519534B2 (en) * 2010-09-22 2013-08-27 Palo Alto Research Center Incorporated Microsprings partially embedded in a laminate structure and methods for producing same
TWI458985B (zh) * 2011-02-23 2014-11-01 King Yuan Electronics Co Ltd 高硬度耐磨探針與其製作方法
US8525168B2 (en) * 2011-07-11 2013-09-03 International Business Machines Corporation Integrated circuit (IC) test probe
WO2013134564A1 (en) * 2012-03-07 2013-09-12 Advantest Corporation Transferring electronic probe assemblies to space transformers
KR101378012B1 (ko) 2012-03-14 2014-03-24 삼성전자주식회사 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
US9878401B1 (en) 2013-01-15 2018-01-30 Microfabrica Inc. Methods of forming parts using laser machining
KR101877861B1 (ko) * 2017-01-23 2018-08-09 (주)다람기술 검사프로브 제조방법 및 제조장치, 그리고 이에 의해 제조된 검사프로브
CN109752576B (zh) * 2017-11-01 2021-01-08 中华精测科技股份有限公司 探针卡装置及其信号传输模块
CN108020695B (zh) * 2017-11-23 2020-11-10 武汉迈斯卡德微电子科技有限公司 一种探针的制作方法
US11977099B2 (en) * 2018-02-06 2024-05-07 Hitachi High-Tech Corporation Method for manufacturing semiconductor device
US11821918B1 (en) 2020-04-24 2023-11-21 Microfabrica Inc. Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
US11828775B1 (en) 2020-05-13 2023-11-28 Microfabrica Inc. Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships
JP7660569B2 (ja) * 2020-06-22 2025-04-11 株式会社ヨコオ プランジャの製造方法
TWI843252B (zh) * 2022-10-25 2024-05-21 台灣光罩股份有限公司 微機電探針及其製造方法

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US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5262722A (en) * 1992-04-03 1993-11-16 General Electric Company Apparatus for near surface nondestructive eddy current scanning of a conductive part using a multi-layer eddy current probe array
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US20030048108A1 (en) * 1993-04-30 2003-03-13 Beaman Brian Samuel Structural design and processes to control probe position accuracy in a wafer test probe assembly
US5785538A (en) * 1995-11-27 1998-07-28 International Business Machines Corporation High density test probe with rigid surface structure
US6525551B1 (en) * 1997-05-22 2003-02-25 International Business Machines Corporation Probe structures for testing electrical interconnections to integrated circuit electronic devices
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US6661244B2 (en) * 2000-03-06 2003-12-09 Wentworth Laboratories, Inc. Nickel alloy probe card frame laminate
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
JP2002062313A (ja) * 2000-08-22 2002-02-28 Toppan Printing Co Ltd 電気検査用治具及びその製造方法
JP4081309B2 (ja) * 2002-02-01 2008-04-23 新光電気工業株式会社 電子部品用ソケット及びその製造方法並びに電子部品用ソケットを用いた実装構造
US6651325B2 (en) * 2002-02-19 2003-11-25 Industrial Technologies Research Institute Method for forming cantilever beam probe card and probe card formed
US7010854B2 (en) * 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
US7047638B2 (en) * 2002-07-24 2006-05-23 Formfactor, Inc Method of making microelectronic spring contact array
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI874679B (zh) * 2020-07-20 2025-03-01 義大利商探針科技公司 用於電子裝置的測試設備的探針頭的接觸探針

Also Published As

Publication number Publication date
JP2009524800A (ja) 2009-07-02
WO2007081522A2 (en) 2007-07-19
KR20080081991A (ko) 2008-09-10
EP1977260A2 (en) 2008-10-08
WO2007081522A3 (en) 2009-02-12
US20070152685A1 (en) 2007-07-05
CN101490570A (zh) 2009-07-22

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