TW200735727A - Plasma treatment apparatus, matching box, impedance matching device, and coupler - Google Patents

Plasma treatment apparatus, matching box, impedance matching device, and coupler

Info

Publication number
TW200735727A
TW200735727A TW096120782A TW96120782A TW200735727A TW 200735727 A TW200735727 A TW 200735727A TW 096120782 A TW096120782 A TW 096120782A TW 96120782 A TW96120782 A TW 96120782A TW 200735727 A TW200735727 A TW 200735727A
Authority
TW
Taiwan
Prior art keywords
power feeding
feeding bar
contact device
matching box
insertion hole
Prior art date
Application number
TW096120782A
Other languages
English (en)
Other versions
TWI301039B (zh
Inventor
Tsutomu Higashiura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200735727A publication Critical patent/TW200735727A/zh
Application granted granted Critical
Publication of TWI301039B publication Critical patent/TWI301039B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
TW096120782A 2001-12-13 2002-12-13 Plasma treatment apparatus, matching box, impedance matching device, and coupler TW200735727A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001380183A JP4488662B2 (ja) 2001-12-13 2001-12-13 プラズマ処理装置、マッチングボックス

Publications (2)

Publication Number Publication Date
TW200735727A true TW200735727A (en) 2007-09-16
TWI301039B TWI301039B (zh) 2008-09-11

Family

ID=19187109

Family Applications (2)

Application Number Title Priority Date Filing Date
TW096120782A TW200735727A (en) 2001-12-13 2002-12-13 Plasma treatment apparatus, matching box, impedance matching device, and coupler
TW091136099A TWI290811B (en) 2001-12-13 2002-12-13 Plasma processing apparatus, matching box, impedance integrator and coupler

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW091136099A TWI290811B (en) 2001-12-13 2002-12-13 Plasma processing apparatus, matching box, impedance integrator and coupler

Country Status (6)

Country Link
US (1) US7025857B2 (zh)
JP (1) JP4488662B2 (zh)
KR (1) KR100625762B1 (zh)
AU (1) AU2002354234A1 (zh)
TW (2) TW200735727A (zh)
WO (1) WO2003054940A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6939434B2 (en) * 2000-08-11 2005-09-06 Applied Materials, Inc. Externally excited torroidal plasma source with magnetic control of ion distribution
KR100470224B1 (ko) * 2002-02-05 2005-02-05 주성엔지니어링(주) 매칭박스 고정장치를 가지는 척
JP2006339144A (ja) * 2005-05-31 2006-12-14 Ngk Insulators Ltd プラズマ処理装置
JP2007191792A (ja) * 2006-01-19 2007-08-02 Atto Co Ltd ガス分離型シャワーヘッド
US8920597B2 (en) 2010-08-20 2014-12-30 Applied Materials, Inc. Symmetric VHF source for a plasma reactor
US9032012B2 (en) * 2011-06-27 2015-05-12 International Business Machines Corporation Configurable pacing for messaging systems
JP2013098177A (ja) * 2011-10-31 2013-05-20 Semes Co Ltd 基板処理装置及びインピーダンスマッチング方法
US9132436B2 (en) * 2012-09-21 2015-09-15 Applied Materials, Inc. Chemical control features in wafer process equipment
KR101605722B1 (ko) * 2014-08-29 2016-03-23 세메스 주식회사 피더 및 기판 처리 장치
KR101864821B1 (ko) * 2017-11-16 2018-06-05 전북대학교산학협력단 태양전지 보호 기판 코팅용 플라즈마 표면처리 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122618B2 (ja) * 1996-08-23 2001-01-09 東京エレクトロン株式会社 プラズマ処理装置
JPH11330058A (ja) * 1998-05-19 1999-11-30 Tokyo Electron Ltd プラズマ処理装置
JP2001262355A (ja) * 2000-03-16 2001-09-26 Applied Materials Inc プラズマｃｖｄ装置およびその異常検出方法
TW529085B (en) * 2000-09-22 2003-04-21 Alps Electric Co Ltd Method for evaluating performance of plasma treatment apparatus or performance confirming system of plasma treatment system
JP3559760B2 (ja) * 2000-09-26 2004-09-02 株式会社日立製作所 プラズマ処理装置及びそのメンテナンス方法
JP4798834B2 (ja) * 2000-10-25 2011-10-19 アプライド マテリアルズ インコーポレイテッド ドライエッチング装置

Also Published As

Publication number Publication date
JP2003178988A (ja) 2003-06-27
TW200304764A (en) 2003-10-01
KR100625762B1 (ko) 2006-09-21
TWI301039B (zh) 2008-09-11
US7025857B2 (en) 2006-04-11
US20050011450A1 (en) 2005-01-20
KR20040065248A (ko) 2004-07-21
TWI290811B (en) 2007-12-01
JP4488662B2 (ja) 2010-06-23
AU2002354234A1 (en) 2003-07-09
WO2003054940A1 (fr) 2003-07-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees