TW200734814A - Photo-sensitive composition, photo-sensitive film, photo-sensitive lamination, permanet pattern-forming method and printing substrate - Google Patents

Photo-sensitive composition, photo-sensitive film, photo-sensitive lamination, permanet pattern-forming method and printing substrate

Info

Publication number
TW200734814A
TW200734814A TW096103485A TW96103485A TW200734814A TW 200734814 A TW200734814 A TW 200734814A TW 096103485 A TW096103485 A TW 096103485A TW 96103485 A TW96103485 A TW 96103485A TW 200734814 A TW200734814 A TW 200734814A
Authority
TW
Taiwan
Prior art keywords
photo
sensitive
forming method
exposure
aforesaid
Prior art date
Application number
TW096103485A
Other languages
Chinese (zh)
Other versions
TWI403832B (en
Inventor
Kimi Ikeda
Akinori Fujita
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW200734814A publication Critical patent/TW200734814A/en
Application granted granted Critical
Publication of TWI403832B publication Critical patent/TWI403832B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The objects of the invention are to provide a photo-sensitive composition having good sensitivity and excellent preservation obtained by means of using an oxime derivative and a certain sensitizer, a photo-sensitive film, a permanent pattern-forming method using aforesaid photo-sensitive composition, and a printing substrate having a permanent pattern formed by aforesaid permanent pattern-forming method. Therefore, the invention provides a photo-sensitive composition comprising a binder, a polymerizable compound, a photo-polymerization initiator and a heat crosslinking agent, and having an energy fluctuation (log E1/E0) in the range of ± 0.3 under the condition that the formed photo-sensitive is subjected to exposure and development, wherein E1 is the minimum energy being used in exposure and without changing the thickness of the portion to be exposed of a photosensitive layer before exposure and after development for a photo-sensitive layer laminated onto a substrate which is enclosed under 24 DEG C, 60%RH and preserved at 40 DEG C for 3 days: whereas E0 is the minimum energy being used in the aforesaid exposure for the photo-sensitive layer laminated onto a substrate after preservation under 24 DEG C, in the dark for 3 days.
TW096103485A 2006-03-08 2007-01-31 Photo-sensitive composition, photo-sensitive film, photo-sensitive lamination, permanet pattern-forming method and printing substrate TWI403832B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006063373A JP4584164B2 (en) 2006-03-08 2006-03-08 Photosensitive composition, photosensitive film, permanent pattern forming method, and printed circuit board

Publications (2)

Publication Number Publication Date
TW200734814A true TW200734814A (en) 2007-09-16
TWI403832B TWI403832B (en) 2013-08-01

Family

ID=38474703

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103485A TWI403832B (en) 2006-03-08 2007-01-31 Photo-sensitive composition, photo-sensitive film, photo-sensitive lamination, permanet pattern-forming method and printing substrate

Country Status (5)

Country Link
JP (1) JP4584164B2 (en)
KR (1) KR101291638B1 (en)
CN (1) CN101438210B (en)
TW (1) TWI403832B (en)
WO (1) WO2007102261A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008292677A (en) * 2007-05-23 2008-12-04 Mitsubishi Chemicals Corp Reactive resin composition, color filter, and image display device
JP2009086376A (en) * 2007-09-28 2009-04-23 Fujifilm Corp Photosensitive composition, photosensitive film, photosensitive layered product, permanent pattern forming method, printed circuit board
KR102135064B1 (en) * 2014-08-13 2020-07-17 동우 화인켐 주식회사 Negative-type photosensitive resin comopsition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY121423A (en) * 1998-06-26 2006-01-28 Ciba Sc Holding Ag Photopolymerizable thermosetting resin compositions
SG77689A1 (en) * 1998-06-26 2001-01-16 Ciba Sc Holding Ag New o-acyloxime photoinitiators
SG97168A1 (en) * 1999-12-15 2003-07-18 Ciba Sc Holding Ag Photosensitive resin composition
TWI250378B (en) * 1999-12-15 2006-03-01 Ciba Sc Holding Ag Photosensitive resin composition
NL1016815C2 (en) * 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester photo initiators.
JP2002107926A (en) * 2000-09-29 2002-04-10 Taiyo Ink Mfg Ltd Photosensitive resin composition
JP3860170B2 (en) * 2001-06-11 2006-12-20 チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド Photoinitiators of oxime esters with combined structures
JP2006047952A (en) * 2004-04-09 2006-02-16 Fuji Photo Film Co Ltd Photosensitive composition, photosensitive film, permanent pattern and method for forming the same
JP2005309247A (en) * 2004-04-23 2005-11-04 Fuji Photo Film Co Ltd Photosensitive composition, photosensitive film, permanent pattern and method for forming the same
JP4419736B2 (en) * 2004-07-20 2010-02-24 Ｊｓｒ株式会社 Photosensitive resin composition, display panel spacer and display panel

Also Published As

Publication number Publication date
TWI403832B (en) 2013-08-01
KR20080109833A (en) 2008-12-17
WO2007102261A1 (en) 2007-09-13
KR101291638B1 (en) 2013-08-01
JP2007240891A (en) 2007-09-20
CN101438210B (en) 2012-06-20
JP4584164B2 (en) 2010-11-17
CN101438210A (en) 2009-05-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees