TW200733224A - Substrate processing method and substrate processing apparatus - Google Patents

Substrate processing method and substrate processing apparatus

Info

Publication number
TW200733224A
TW200733224A TW095144642A TW95144642A TW200733224A TW 200733224 A TW200733224 A TW 200733224A TW 095144642 A TW095144642 A TW 095144642A TW 95144642 A TW95144642 A TW 95144642A TW 200733224 A TW200733224 A TW 200733224A
Authority
TW
Taiwan
Prior art keywords
substrate processing
substrate
processing method
processing apparatus
supplied
Prior art date
Application number
TW095144642A
Other languages
Chinese (zh)
Inventor
Akio Hashizume
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200733224A publication Critical patent/TW200733224A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/06—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane
    • B05B7/062—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet
    • B05B7/066—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet with an inner liquid outlet surrounded by at least one annular gas outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

According to the substrate processing method of the invention, a mixed fluid obtained by mixing an organic solvent and a gas is supplied to the surface of the substrate. Thereafter, a resist strip liquid to strip off the resist from the surface of the substrate is supplied to the surface of the substrate.
TW095144642A 2005-12-02 2006-12-01 Substrate processing method and substrate processing apparatus TW200733224A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005349676 2005-12-02
JP2006275092A JP4986565B2 (en) 2005-12-02 2006-10-06 Substrate processing method and substrate processing apparatus

Publications (1)

Publication Number Publication Date
TW200733224A true TW200733224A (en) 2007-09-01

Family

ID=38224766

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144642A TW200733224A (en) 2005-12-02 2006-12-01 Substrate processing method and substrate processing apparatus

Country Status (5)

Country Link
US (1) US20070154636A1 (en)
JP (1) JP4986565B2 (en)
KR (1) KR100848981B1 (en)
CN (1) CN1975585B (en)
TW (1) TW200733224A (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4986566B2 (en) * 2005-10-14 2012-07-25 大日本スクリーン製造株式会社 Substrate processing method and substrate processing apparatus
EP2106303B1 (en) * 2007-01-22 2012-10-10 Lam Research AG Method for cleaning a surface
JP5185688B2 (en) * 2008-05-15 2013-04-17 ルネサスエレクトロニクス株式会社 Substrate processing method and substrate processing apparatus
JP2010009724A (en) * 2008-06-30 2010-01-14 Sony Chemical & Information Device Corp Optical master disk processing liquid, and method of processing optical master disk
JP5381388B2 (en) 2009-06-23 2014-01-08 東京エレクトロン株式会社 Liquid processing equipment
CN102096346B (en) * 2009-12-15 2013-06-12 北大方正集团有限公司 Silicon wafer photoresist-removing method and device and method for removing photoresist on silicon wafer by using developing bench
JP2011198933A (en) * 2010-03-18 2011-10-06 Tokyo Electron Ltd Device and method for removing resist
MY159125A (en) * 2010-03-31 2016-12-15 Hoya Corp Manufacturing method of a glass substrate for a magnetic disk
JP5958950B2 (en) * 2011-07-13 2016-08-02 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
KR102111467B1 (en) * 2012-03-23 2020-05-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Spray gun barrel with inseparable nozzle
CN102755970B (en) * 2012-07-16 2014-06-18 常州瑞择微电子科技有限公司 On-line SPM generating system and control method thereof
JP6094851B2 (en) * 2012-08-28 2017-03-15 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
US8691022B1 (en) * 2012-12-18 2014-04-08 Lam Research Ag Method and apparatus for processing wafer-shaped articles
JP6045357B2 (en) * 2013-01-16 2016-12-14 キヤノン株式会社 Method for forming a chemical layer
KR20150000548A (en) * 2013-06-24 2015-01-05 삼성전자주식회사 Substrate treating apparatus
US9805946B2 (en) * 2013-08-30 2017-10-31 Taiwan Semiconductor Manufacturing Company Limited Photoresist removal
JP6256828B2 (en) * 2013-10-10 2018-01-10 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
CN105655232B (en) * 2014-11-25 2019-08-23 旺宏电子股份有限公司 Substrate processing method using same, substrate board treatment and its application
DE102015000450A1 (en) * 2015-01-15 2016-07-21 Siltectra Gmbh Separating device for the chip-free separation of wafers from donor substrates
CN105772290B (en) * 2016-05-11 2018-05-11 电子科技大学 A kind of ultrasonic spray pyrolysis spray equipment and its application method
JP2018110186A (en) * 2017-01-04 2018-07-12 東京エレクトロン株式会社 Liquid processing device and liquid processing method
JP2017175166A (en) * 2017-06-23 2017-09-28 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing device
CN107329289A (en) * 2017-07-19 2017-11-07 武汉华星光电技术有限公司 Remove electrostatic stripping off device and liquid crystal panel making apparatus
CN110191588B (en) * 2018-03-26 2020-04-17 扬宣电子(清远)有限公司 PCB etching device and using method thereof
CN109449078A (en) * 2018-11-23 2019-03-08 上海华力微电子有限公司 A kind of particle minimizing technology suitable for copper wiring technique
KR102121237B1 (en) 2018-12-06 2020-06-10 세메스 주식회사 Apparatus and Method for treating substrate
JP7250566B2 (en) * 2019-02-26 2023-04-03 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
EP3828228A1 (en) * 2019-11-29 2021-06-02 Borealis AG Method for removing foreign materials from the surface of an article

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192319A (en) * 1990-07-23 1992-07-10 Matsushita Electron Corp Resist removing method
US5201960A (en) * 1991-02-04 1993-04-13 Applied Photonics Research, Inc. Method for removing photoresist and other adherent materials from substrates
JP3278935B2 (en) * 1992-10-31 2002-04-30 ソニー株式会社 Resist removal method
KR100372995B1 (en) * 1994-05-24 2003-03-31 히다치 가세고교 가부시끼가이샤 Method of Forming Resin Film Resin Film of Desired Pattern on Substrate, Semiconductor Chip, Semiconductor Package, and Resist Image Remover
JPH0969509A (en) * 1995-09-01 1997-03-11 Matsushita Electron Corp Cleaning/etching/drying system for semiconductor wafer and using method thereof
JP3690619B2 (en) * 1996-01-12 2005-08-31 忠弘 大見 Cleaning method and cleaning device
JPH1167738A (en) * 1997-08-18 1999-03-09 Oki Electric Ind Co Ltd Ashing and ashing system
JP3880189B2 (en) * 1998-02-13 2007-02-14 芝浦メカトロニクス株式会社 Ashing apparatus and ashing method
KR100287173B1 (en) * 1998-03-13 2001-06-01 윤종용 Method for removing photoresist and method for manufacturing semiconductor device using the same
JP3120425B2 (en) * 1998-05-25 2000-12-25 旭サナック株式会社 Resist stripping method and apparatus
JP2001093806A (en) * 1999-09-20 2001-04-06 Seiko Epson Corp Method and apparatus for removing resist film
JP4005326B2 (en) * 2000-09-22 2007-11-07 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
US6579810B2 (en) * 2001-06-21 2003-06-17 Macronix International Co. Ltd. Method of removing a photoresist layer on a semiconductor wafer
JP4004318B2 (en) * 2002-03-25 2007-11-07 野村マイクロ・サイエンス株式会社 Method and agent for removing organic coating
JP2004140196A (en) * 2002-10-17 2004-05-13 Nec Electronics Corp Manufacturing method of semiconductor device and substrate washing equipment
JP4040425B2 (en) * 2002-10-17 2008-01-30 Ｎｅｃエレクトロニクス株式会社 Manufacturing method of semiconductor device
JP4318950B2 (en) * 2003-04-22 2009-08-26 東京エレクトロン株式会社 Substrate processing method and substrate processing system
JP2004349501A (en) * 2003-05-22 2004-12-09 Dainippon Screen Mfg Co Ltd Substrate processing method and substrate processing apparatus
JP2005032819A (en) * 2003-07-08 2005-02-03 Dainippon Screen Mfg Co Ltd Device and method for peeling resist
TWI377453B (en) * 2003-07-31 2012-11-21 Akrion Technologies Inc Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing
JP2005191511A (en) * 2003-12-02 2005-07-14 Dainippon Screen Mfg Co Ltd Substrate processing equipment and substrate processing method
JP2005228790A (en) * 2004-02-10 2005-08-25 Mitsubishi Electric Corp Resist removal method, resist-removing apparatus, and semiconductor wafer
JP4377285B2 (en) * 2004-06-04 2009-12-02 大日本スクリーン製造株式会社 Substrate processing method and substrate processing apparatus
JP4986566B2 (en) * 2005-10-14 2012-07-25 大日本スクリーン製造株式会社 Substrate processing method and substrate processing apparatus
JP4795854B2 (en) * 2006-06-05 2011-10-19 大日本スクリーン製造株式会社 Substrate processing method and substrate processing apparatus
US20080060682A1 (en) * 2006-09-13 2008-03-13 Taiwan Semiconductor Manufacturing Co., Ltd. High temperature spm treatment for photoresist stripping

Also Published As

Publication number Publication date
CN1975585B (en) 2011-01-12
JP4986565B2 (en) 2012-07-25
JP2007180497A (en) 2007-07-12
US20070154636A1 (en) 2007-07-05
KR20070058327A (en) 2007-06-08
KR100848981B1 (en) 2008-07-30
CN1975585A (en) 2007-06-06

Similar Documents

Publication Publication Date Title
TW200733224A (en) Substrate processing method and substrate processing apparatus
TW200732836A (en) Method for expelling gas positioned between a substrate and a mold
TW200612198A (en) Ink composition for etching resist, method of forming etching resist pattern using the same, and method of forming microchannel using the ink composition
TW200725727A (en) Substrate processing method and substrate processing apparatus
TW200721279A (en) Method of forming pattern, film structure, electrooptical device and electronic equipment
TW200726858A (en) Apparatus and method for supercritical fluid removal or deposition processes
TW200611062A (en) Apparatus, system and method to vary dimensions of a substrate during nano-scale manufacturing
WO2007087408A3 (en) Method and arrangement for feeding chemicals into a process stream
DK1358946T3 (en) Process for impregnating porous mineral substrates
WO2006025605A3 (en) Liquid crystal material filling method and liquid crystal material filling apparatus
TW200738322A (en) Methods and apparatus for process abatement
CY1107884T1 (en) CAPACINE PRODUCERS AND THE PRODUCTION AND USE OF THESE
DE602006016845D1 (en) USE OF MARKING LIQUIDS FOR VINYL SUBSSTRATES
ATE504554T1 (en) METHOD FOR SUBSTITUTION OF INDENOFLUORENES
SG155256A1 (en) Immersion liquid, exposure apparatus, and exposure process
WO2009024549A3 (en) Process and apparatus for oxidizing organic compounds
EA200970098A1 (en) WATER TREATMENT DOWNHOUSE FOR OIL-BASED DRILLING SOLUTIONS
TW200745786A (en) Method for removing masking materials with reduced low-k dielectric material damage
SG132647A1 (en) Lithographic apparatus and device manufacturing method
TW200744140A (en) Apparatus for aligning microchips on substrate and method for the same
WO2010086621A3 (en) Method for attachment of silicon-containing compounds to a surface and for synthesis of hypervalent silicon-compounds
TW200801857A (en) Photoresist stripping liquid and method for processing substrate using the liquid
DK1858655T3 (en) Method and apparatus for removing paint and sealant
WO2009037307A3 (en) Accelerated reduction of organic substances with boranes
TW200731018A (en) Method and apparatus for photoelectrochemical etching