TW200732412A - Non-halogen composition having phosphor-containing epoxy resin - Google Patents

Non-halogen composition having phosphor-containing epoxy resin

Info

Publication number
TW200732412A
TW200732412A TW095106032A TW95106032A TW200732412A TW 200732412 A TW200732412 A TW 200732412A TW 095106032 A TW095106032 A TW 095106032A TW 95106032 A TW95106032 A TW 95106032A TW 200732412 A TW200732412 A TW 200732412A
Authority
TW
Taiwan
Prior art keywords
phosphor
containing epoxy
printed circuit
halogen composition
circuit boards
Prior art date
Application number
TW095106032A
Other languages
English (en)
Chinese (zh)
Other versions
TWI305217B (https=
Inventor
yu-xuan Zheng
Ming-Te We
Original Assignee
Pont Taiwan Ltd Du
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pont Taiwan Ltd Du filed Critical Pont Taiwan Ltd Du
Priority to TW095106032A priority Critical patent/TW200732412A/zh
Priority to PCT/US2007/004853 priority patent/WO2007100734A2/en
Priority to EP07751602A priority patent/EP2054460A2/en
Priority to JP2008556459A priority patent/JP2009527632A/ja
Priority to US12/162,610 priority patent/US20090018241A1/en
Publication of TW200732412A publication Critical patent/TW200732412A/zh
Application granted granted Critical
Publication of TWI305217B publication Critical patent/TWI305217B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
TW095106032A 2006-02-23 2006-02-23 Non-halogen composition having phosphor-containing epoxy resin TW200732412A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW095106032A TW200732412A (en) 2006-02-23 2006-02-23 Non-halogen composition having phosphor-containing epoxy resin
PCT/US2007/004853 WO2007100734A2 (en) 2006-02-23 2007-02-22 A halogen-free phosphorous epoxy resin composition
EP07751602A EP2054460A2 (en) 2006-02-23 2007-02-22 A halogen-free phosphorous epoxy resin composition
JP2008556459A JP2009527632A (ja) 2006-02-23 2007-02-22 ハロゲンを含まないリン・エポキシ樹脂組成物
US12/162,610 US20090018241A1 (en) 2006-02-23 2007-02-22 Halogen-free phosphorous epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095106032A TW200732412A (en) 2006-02-23 2006-02-23 Non-halogen composition having phosphor-containing epoxy resin

Publications (2)

Publication Number Publication Date
TW200732412A true TW200732412A (en) 2007-09-01
TWI305217B TWI305217B (https=) 2009-01-11

Family

ID=38323955

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106032A TW200732412A (en) 2006-02-23 2006-02-23 Non-halogen composition having phosphor-containing epoxy resin

Country Status (5)

Country Link
US (1) US20090018241A1 (https=)
EP (1) EP2054460A2 (https=)
JP (1) JP2009527632A (https=)
TW (1) TW200732412A (https=)
WO (1) WO2007100734A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452081B (zh) * 2007-09-28 2014-09-11 Dow Global Technologies Llc 環氧樹脂調配物

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200732448A (en) * 2006-02-23 2007-09-01 Pont Taiwan Ltd Du Non-halogen adhesive containing polyphosphate compounds
US10966850B2 (en) * 2014-03-06 2021-04-06 W. L. Gore & Associates, Inc. Implantable medical device constraint and deployment apparatus
JP5920431B2 (ja) 2014-09-19 2016-05-18 横浜ゴム株式会社 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用エポキシ樹脂組成物の製造方法、プリプレグ及びハニカムパネル
JP7045173B2 (ja) * 2017-11-28 2022-03-31 藤森工業株式会社 カバーレイフィルムおよびそれを用いた電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001042359A1 (en) * 1999-12-13 2001-06-14 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
JP2002020715A (ja) * 2000-07-11 2002-01-23 Toshiba Chem Corp 難燃性接着剤組成物およびフレキシブルプリント配線板関連製品
TW498084B (en) * 2000-07-19 2002-08-11 Chang Chun Plastics Co Ltd Flame-retardant resin and flame retardant composition containing the same
JP2003105167A (ja) * 2001-07-27 2003-04-09 Toray Ind Inc 難燃性樹脂組成物とそれを用いた半導体装置用接着剤シート、カバーレイフィルム並びにフレキシブルプリント配線基板
TW200413467A (en) * 2003-01-16 2004-08-01 Chang Chun Plastics Co Ltd Resin composition without containing halogen
JP2005002294A (ja) * 2003-06-16 2005-01-06 Shin Etsu Chem Co Ltd 接着剤組成物、それを用いたカバーレイフィルムおよびフレキシブル印刷配線板
TW200732448A (en) * 2006-02-23 2007-09-01 Pont Taiwan Ltd Du Non-halogen adhesive containing polyphosphate compounds

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452081B (zh) * 2007-09-28 2014-09-11 Dow Global Technologies Llc 環氧樹脂調配物

Also Published As

Publication number Publication date
WO2007100734A3 (en) 2007-11-22
EP2054460A2 (en) 2009-05-06
JP2009527632A (ja) 2009-07-30
WO2007100734A2 (en) 2007-09-07
TWI305217B (https=) 2009-01-11
US20090018241A1 (en) 2009-01-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees