TW200730290A - Soldering flux, cream solder, method for soldering, food container and electronic device - Google Patents
Soldering flux, cream solder, method for soldering, food container and electronic deviceInfo
- Publication number
- TW200730290A TW200730290A TW095134764A TW95134764A TW200730290A TW 200730290 A TW200730290 A TW 200730290A TW 095134764 A TW095134764 A TW 095134764A TW 95134764 A TW95134764 A TW 95134764A TW 200730290 A TW200730290 A TW 200730290A
- Authority
- TW
- Taiwan
- Prior art keywords
- soldering
- cream solder
- soldering flux
- water
- free
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005272779 | 2005-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200730290A true TW200730290A (en) | 2007-08-16 |
Family
ID=37888803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134764A TW200730290A (en) | 2005-09-20 | 2006-09-20 | Soldering flux, cream solder, method for soldering, food container and electronic device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4322948B2 (zh) |
TW (1) | TW200730290A (zh) |
WO (1) | WO2007034758A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI461118B (zh) * | 2010-11-08 | 2014-11-11 | Ngk Spark Plug Co | 具有電子零件之配線基板及其製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5003560B2 (ja) * | 2008-03-31 | 2012-08-15 | 三菱マテリアル株式会社 | ディスペンス塗布用Au−Sn合金はんだペースト |
JPWO2012173059A1 (ja) * | 2011-06-13 | 2015-02-23 | 千住金属工業株式会社 | ソルダペースト |
JP5927745B2 (ja) * | 2012-06-27 | 2016-06-01 | 三菱マテリアル株式会社 | SnAgCu系はんだ粉末及びこの粉末を用いたはんだ用ペースト |
JP2014168791A (ja) * | 2013-03-01 | 2014-09-18 | Hitachi Chemical Co Ltd | フラックスフィルム、フリップチップ接続方法、及び半導体装置 |
JP6096035B2 (ja) * | 2013-03-29 | 2017-03-15 | 株式会社タムラ製作所 | はんだ付け用フラックス組成物およびそれを用いた電子基板の製造方法 |
WO2015022719A1 (ja) * | 2013-08-12 | 2015-02-19 | 千住金属工業株式会社 | フラックス、ソルダペースト及びはんだ継手 |
JP6764123B1 (ja) * | 2019-10-04 | 2020-09-30 | 千住金属工業株式会社 | ソルダペースト |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0386389A (ja) * | 1989-08-31 | 1991-04-11 | Nippon Handa Kk | 水溶性クリームはんだ |
US5085365B1 (en) * | 1990-05-15 | 1995-08-08 | Hughes Aircraft Co | Water soluble soldering flux |
JP2641841B2 (ja) * | 1994-04-25 | 1997-08-20 | 株式会社ニホンゲンマ | クリームはんだ |
JPH08257790A (ja) * | 1995-03-23 | 1996-10-08 | Sanyo Chem Ind Ltd | クリーム半田用粘結剤 |
JPH09192882A (ja) * | 1996-01-12 | 1997-07-29 | Uchihashi Estec Co Ltd | はんだ付け用液状フラックス |
JP3335307B2 (ja) * | 1998-03-19 | 2002-10-15 | 株式会社東芝 | ソルダーペースト及びハンダ接合形成用フラックス |
JP3273757B2 (ja) * | 1998-03-19 | 2002-04-15 | 株式会社東芝 | ソルダーペースト及びハンダ接合形成用フラックス |
JP2005074484A (ja) * | 2003-09-01 | 2005-03-24 | Matsushita Electric Works Ltd | はんだ付け用水性フラックス |
-
2006
- 2006-09-15 JP JP2007536478A patent/JP4322948B2/ja not_active Expired - Fee Related
- 2006-09-15 WO PCT/JP2006/318421 patent/WO2007034758A1/ja active Application Filing
- 2006-09-20 TW TW095134764A patent/TW200730290A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI461118B (zh) * | 2010-11-08 | 2014-11-11 | Ngk Spark Plug Co | 具有電子零件之配線基板及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2007034758A1 (ja) | 2009-03-26 |
WO2007034758A1 (ja) | 2007-03-29 |
JP4322948B2 (ja) | 2009-09-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200730290A (en) | Soldering flux, cream solder, method for soldering, food container and electronic device | |
EP2100690A4 (en) | RIVER FOR LEAD-FREE SOLDERING AND SOLDERING PROCESSES | |
MY154604A (en) | Solder alloy, solder paste, and electronic circuit board | |
GB2453826A (en) | Metal-containing virucidal compositions and uses | |
TW200607598A (en) | Composition of a solder, and method of manufacturing a solder connection | |
HK1053278A1 (en) | A lead-free solder, method for preparing the same and method of soldering by using the same | |
WO2011076770A3 (en) | A solder paste composition, a solder paste and a soldering flux | |
EP2177305A4 (en) | LEAD-FREE SOLDER IN CONTAINER FOR ELECTRONIC ON-BOARD CIRCUIT | |
MY158123A (en) | Mixed alloy solder paste | |
MY168183A (en) | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device | |
TW200704829A (en) | Immersion method | |
EP1928547A4 (en) | IMPLANTABLE MEDICAL DEVICE | |
ZA201008715B (en) | Oxygen-scavenging mixtures | |
BRPI0517384A (pt) | solda sem chumbo, e, métodos de preparar a mesma, e de soldar | |
TW200604349A (en) | Lead-free solder alloy | |
TW200746359A (en) | Capacitor attachment method | |
TW200625488A (en) | A method for solder bump formation | |
MX2011006157A (es) | Oligoelementos. | |
AU2012363597B2 (en) | Audio solder alloy | |
MY140781A (en) | Flux for soldering, soldering method, and printed circuit board | |
MY157689A (en) | Gluconic acid containing photoresist cleaning composition for multi-metal device processing | |
PH12021551205A1 (en) | Flux, solder alloy, joined body, and method for producing joined body | |
TW200643231A (en) | Electrolyte and method for depositing tin-bismuth alloy layers | |
EP1911543A4 (en) | LEAD-FREE LOT FOR ADDITIONAL INTRODUCTION AND METHOD FOR CONTROLLING CU CONCENTRATION AND NI CONCENTRATION IN A SOLDER BATH | |
MY165410A (en) | Device and method for wave soldering |