TW200730290A - Soldering flux, cream solder, method for soldering, food container and electronic device - Google Patents

Soldering flux, cream solder, method for soldering, food container and electronic device

Info

Publication number
TW200730290A
TW200730290A TW095134764A TW95134764A TW200730290A TW 200730290 A TW200730290 A TW 200730290A TW 095134764 A TW095134764 A TW 095134764A TW 95134764 A TW95134764 A TW 95134764A TW 200730290 A TW200730290 A TW 200730290A
Authority
TW
Taiwan
Prior art keywords
soldering
cream solder
soldering flux
water
free
Prior art date
Application number
TW095134764A
Other languages
English (en)
Inventor
Kimio Yamakawa
Katsutoshi Mine
Original Assignee
Nihon Handa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Handa Co Ltd filed Critical Nihon Handa Co Ltd
Publication of TW200730290A publication Critical patent/TW200730290A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW095134764A 2005-09-20 2006-09-20 Soldering flux, cream solder, method for soldering, food container and electronic device TW200730290A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005272779 2005-09-20

Publications (1)

Publication Number Publication Date
TW200730290A true TW200730290A (en) 2007-08-16

Family

ID=37888803

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134764A TW200730290A (en) 2005-09-20 2006-09-20 Soldering flux, cream solder, method for soldering, food container and electronic device

Country Status (3)

Country Link
JP (1) JP4322948B2 (zh)
TW (1) TW200730290A (zh)
WO (1) WO2007034758A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI461118B (zh) * 2010-11-08 2014-11-11 Ngk Spark Plug Co 具有電子零件之配線基板及其製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5003560B2 (ja) * 2008-03-31 2012-08-15 三菱マテリアル株式会社 ディスペンス塗布用Ａｕ−Ｓｎ合金はんだペースト
CN106985564B (zh) * 2011-06-13 2019-03-08 千住金属工业株式会社 焊膏的印刷方法
JP5927745B2 (ja) * 2012-06-27 2016-06-01 三菱マテリアル株式会社 ＳｎＡｇＣｕ系はんだ粉末及びこの粉末を用いたはんだ用ペースト
JP2014168791A (ja) * 2013-03-01 2014-09-18 Hitachi Chemical Co Ltd フラックスフィルム、フリップチップ接続方法、及び半導体装置
JP6096035B2 (ja) * 2013-03-29 2017-03-15 株式会社タムラ製作所 はんだ付け用フラックス組成物およびそれを用いた電子基板の製造方法
US10160064B2 (en) 2013-08-12 2018-12-25 Senju Metal Industry Co., Ltd. Flux, solder paste and solder joint
JP6764123B1 (ja) * 2019-10-04 2020-09-30 千住金属工業株式会社 ソルダペースト

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0386389A (ja) * 1989-08-31 1991-04-11 Nippon Handa Kk 水溶性クリームはんだ
US5085365B1 (en) * 1990-05-15 1995-08-08 Hughes Aircraft Co Water soluble soldering flux
JP2641841B2 (ja) * 1994-04-25 1997-08-20 株式会社ニホンゲンマ クリームはんだ
JPH08257790A (ja) * 1995-03-23 1996-10-08 Sanyo Chem Ind Ltd クリーム半田用粘結剤
JPH09192882A (ja) * 1996-01-12 1997-07-29 Uchihashi Estec Co Ltd はんだ付け用液状フラックス
JP3335307B2 (ja) * 1998-03-19 2002-10-15 株式会社東芝 ソルダーペースト及びハンダ接合形成用フラックス
JP3273757B2 (ja) * 1998-03-19 2002-04-15 株式会社東芝 ソルダーペースト及びハンダ接合形成用フラックス
JP2005074484A (ja) * 2003-09-01 2005-03-24 Matsushita Electric Works Ltd はんだ付け用水性フラックス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI461118B (zh) * 2010-11-08 2014-11-11 Ngk Spark Plug Co 具有電子零件之配線基板及其製造方法

Also Published As

Publication number Publication date
WO2007034758A1 (ja) 2007-03-29
JPWO2007034758A1 (ja) 2009-03-26
JP4322948B2 (ja) 2009-09-02

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