TW200729236A - Conductive fine particle and anisotropic conductive material - Google Patents

Conductive fine particle and anisotropic conductive material

Info

Publication number
TW200729236A
TW200729236A TW095148092A TW95148092A TW200729236A TW 200729236 A TW200729236 A TW 200729236A TW 095148092 A TW095148092 A TW 095148092A TW 95148092 A TW95148092 A TW 95148092A TW 200729236 A TW200729236 A TW 200729236A
Authority
TW
Taiwan
Prior art keywords
fine particle
conductive
layer
conductive fine
conductive material
Prior art date
Application number
TW095148092A
Other languages
English (en)
Inventor
Xiao-Ge Wang
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200729236A publication Critical patent/TW200729236A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
TW095148092A 2005-12-22 2006-12-21 Conductive fine particle and anisotropic conductive material TW200729236A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005369780 2005-12-22

Publications (1)

Publication Number Publication Date
TW200729236A true TW200729236A (en) 2007-08-01

Family

ID=38188687

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148092A TW200729236A (en) 2005-12-22 2006-12-21 Conductive fine particle and anisotropic conductive material

Country Status (2)

Country Link
TW (1) TW200729236A (zh)
WO (1) WO2007072912A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509638B (zh) * 2009-03-31 2015-11-21 Sekisui Chemical Co Ltd Conductive particles, anisotropic conductive materials and connecting structures

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4991666B2 (ja) * 2008-09-19 2012-08-01 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP6777380B2 (ja) * 2014-05-27 2020-10-28 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61231066A (ja) * 1985-04-06 1986-10-15 Fujikura Kasei Kk 異方導電性ホツトメルト接着剤
JPH07118866A (ja) * 1993-10-21 1995-05-09 Nippon Chem Ind Co Ltd 分散性に優れた球状無電解めっき粉末、導電性材料およびその製造方法
JP3417699B2 (ja) * 1994-12-26 2003-06-16 日本化学工業株式会社 導電性無電解めっき粉体
JP3436327B2 (ja) * 1995-05-16 2003-08-11 日本化学工業株式会社 導電性無電解めっき粉体
JP4022750B2 (ja) * 2002-10-31 2007-12-19 信越化学工業株式会社 導電性粉体及びその製造方法並びに導電性シリコーンゴム組成物
JP4686120B2 (ja) * 2003-11-11 2011-05-18 積水化学工業株式会社 被覆導電粒子、異方性導電材料及び導電接続構造体
JP3914206B2 (ja) * 2004-01-30 2007-05-16 積水化学工業株式会社 導電性微粒子及び異方性導電材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509638B (zh) * 2009-03-31 2015-11-21 Sekisui Chemical Co Ltd Conductive particles, anisotropic conductive materials and connecting structures

Also Published As

Publication number Publication date
WO2007072912A1 (ja) 2007-06-28

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