TW200728482A - Inertial bonding method of forming a sputtering target assembly and assembly made therefrom - Google Patents
Inertial bonding method of forming a sputtering target assembly and assembly made therefromInfo
- Publication number
- TW200728482A TW200728482A TW095135801A TW95135801A TW200728482A TW 200728482 A TW200728482 A TW 200728482A TW 095135801 A TW095135801 A TW 095135801A TW 95135801 A TW95135801 A TW 95135801A TW 200728482 A TW200728482 A TW 200728482A
- Authority
- TW
- Taiwan
- Prior art keywords
- sputtering target
- assembly
- forming
- made therefrom
- bonding method
- Prior art date
Links
- 238000005477 sputtering target Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C11/00—Alloys based on lead
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72143105P | 2005-09-28 | 2005-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200728482A true TW200728482A (en) | 2007-08-01 |
Family
ID=37682777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095135801A TW200728482A (en) | 2005-09-28 | 2006-09-27 | Inertial bonding method of forming a sputtering target assembly and assembly made therefrom |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070084719A1 (zh) |
JP (1) | JP2009510264A (zh) |
KR (1) | KR20080054414A (zh) |
CN (1) | CN101313083A (zh) |
DE (1) | DE112006002609T5 (zh) |
TW (1) | TW200728482A (zh) |
WO (1) | WO2007038651A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561654B (en) * | 2010-11-24 | 2016-12-11 | Plansee Se | Composition for bonding rotary target for sputtering and method for bonding rotary target using the same |
TWI746634B (zh) * | 2017-09-12 | 2021-11-21 | 日商三菱綜合材料股份有限公司 | 圓筒型濺鍍靶 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2213763A3 (en) * | 2003-08-11 | 2010-08-18 | Honeywell International Inc. | Target/backing plate constructions, and methods of forming target/backing plate constructions |
EP2230325A1 (en) * | 2009-03-20 | 2010-09-22 | Applied Materials, Inc. | Deposition apparatus with high temperature rotatable target and method of operating thereof |
CN103354210B (zh) * | 2013-06-27 | 2016-08-10 | 清华大学 | 一种键合方法及采用该键合方法形成的键合结构 |
US10192849B2 (en) * | 2014-02-10 | 2019-01-29 | Infineon Technologies Ag | Semiconductor modules with semiconductor dies bonded to a metal foil |
KR101923292B1 (ko) * | 2014-07-31 | 2018-11-28 | 제이엑스금속주식회사 | 방식성의 금속과 Mo 또는 Mo 합금을 확산 접합한 백킹 플레이트, 및 그 백킹 플레이트를 구비한 스퍼터링 타깃-백킹 플레이트 조립체 |
US20160167353A1 (en) * | 2014-12-12 | 2016-06-16 | GM Global Technology Operations LLC | Systems and methods for joining components |
US10807864B2 (en) * | 2017-01-30 | 2020-10-20 | The Regents Of The University Of Colorado, A Body Corporate | Methods of achieving universal interfacing using suspended and/or freestanding structures |
EP3825126B1 (en) * | 2019-11-25 | 2023-03-15 | Linxens Holding | Laminated foil structure and method of forming the same |
CN115647571A (zh) * | 2022-12-26 | 2023-01-31 | 北京坤飞航天科技有限公司 | 一种t形接头的铸焊铆复合连接方法及连接结构 |
CN116511752B (zh) * | 2023-01-31 | 2024-02-06 | 度亘核芯光电技术(苏州)有限公司 | 一种铜表面结构、制备方法及其焊接方法 |
Family Cites Families (29)
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US3452421A (en) * | 1964-03-13 | 1969-07-01 | Caterpillar Tractor Co | Friction welding of dissimilar materials |
US3693238A (en) * | 1970-10-02 | 1972-09-26 | Aluminum Co Of America | Friction welding of aluminum and ferrous workpieces |
US3804691A (en) * | 1972-05-12 | 1974-04-16 | Western Electric Co | Method of bonding using an infrared heating lamp |
US3998376A (en) * | 1975-12-12 | 1976-12-21 | Estan Manufacturing Company | Method for forming a connection between two tubes |
US4349954A (en) * | 1980-11-26 | 1982-09-21 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Mechanical bonding of metal method |
DE3233215C1 (de) * | 1982-09-07 | 1984-04-19 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Befestigen von in Scheiben- oder Plattenform vorliegenden Targetmaterialien auf Kuehlteller fuer Aufstaeubanlagen |
US5230459A (en) * | 1992-03-18 | 1993-07-27 | Tosoh Smd, Inc. | Method of bonding a sputter target-backing plate assembly assemblies produced thereby |
US5269899A (en) * | 1992-04-29 | 1993-12-14 | Tosoh Smd, Inc. | Cathode assembly for cathodic sputtering apparatus |
US5693203A (en) * | 1992-09-29 | 1997-12-02 | Japan Energy Corporation | Sputtering target assembly having solid-phase bonded interface |
US5286361A (en) * | 1992-10-19 | 1994-02-15 | Regents Of The University Of California | Magnetically attached sputter targets |
US5342496A (en) * | 1993-05-18 | 1994-08-30 | Tosoh Smd, Inc. | Method of welding sputtering target/backing plate assemblies |
US6199259B1 (en) * | 1993-11-24 | 2001-03-13 | Applied Komatsu Technology, Inc. | Autoclave bonding of sputtering target assembly |
WO1996015283A1 (en) * | 1994-11-15 | 1996-05-23 | Tosoh Smd, Inc. | Method of bonding targets to backing plate member |
US5593082A (en) * | 1994-11-15 | 1997-01-14 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby |
US5522535A (en) * | 1994-11-15 | 1996-06-04 | Tosoh Smd, Inc. | Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies |
JPH08218166A (ja) * | 1995-02-10 | 1996-08-27 | Sumitomo Chem Co Ltd | スパッタリング用ターゲットの接合方法 |
US5836506A (en) * | 1995-04-21 | 1998-11-17 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
US5857611A (en) * | 1995-08-16 | 1999-01-12 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
US5863398A (en) * | 1996-10-11 | 1999-01-26 | Johnson Matthey Electonics, Inc. | Hot pressed and sintered sputtering target assemblies and method for making same |
JPH1112716A (ja) * | 1997-06-19 | 1999-01-19 | Seiko Epson Corp | ロウ接用材料およびその製造方法 |
US6071389A (en) * | 1998-08-21 | 2000-06-06 | Tosoh Smd, Inc. | Diffusion bonded sputter target assembly and method of making |
US6749103B1 (en) * | 1998-09-11 | 2004-06-15 | Tosoh Smd, Inc. | Low temperature sputter target bonding method and target assemblies produced thereby |
US6348113B1 (en) * | 1998-11-25 | 2002-02-19 | Cabot Corporation | High purity tantalum, products containing the same, and methods of making the same |
US6725522B1 (en) * | 2000-07-12 | 2004-04-27 | Tosoh Smd, Inc. | Method of assembling target and backing plates |
WO2002022300A1 (en) * | 2000-09-11 | 2002-03-21 | Tosoh Smd, Inc. | Method of manufacturing sputter targets with internal cooling channels |
WO2002047865A1 (en) * | 2000-12-15 | 2002-06-20 | Tosoh Smd, Inc. | Friction fit target assembly for high power sputtering operation |
EP1349682B1 (en) * | 2000-12-18 | 2008-10-08 | Tosoh Smd, Inc. | Low temperature sputter target/backing plate joining technique and assemblies made thereby |
US6536653B2 (en) * | 2001-01-16 | 2003-03-25 | Industrial Technology Research Institute | One-step bumping/bonding method for forming semiconductor packages |
DE60326621D1 (de) * | 2002-10-21 | 2009-04-23 | Cabot Corp | Verfahren zur herstellung eines sputtertargets und sputtertarget |
-
2006
- 2006-09-26 KR KR1020087010004A patent/KR20080054414A/ko not_active Application Discontinuation
- 2006-09-26 US US11/527,766 patent/US20070084719A1/en not_active Abandoned
- 2006-09-26 CN CNA2006800438895A patent/CN101313083A/zh active Pending
- 2006-09-26 DE DE112006002609T patent/DE112006002609T5/de not_active Withdrawn
- 2006-09-26 JP JP2008533591A patent/JP2009510264A/ja active Pending
- 2006-09-26 WO PCT/US2006/037784 patent/WO2007038651A1/en active Application Filing
- 2006-09-27 TW TW095135801A patent/TW200728482A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561654B (en) * | 2010-11-24 | 2016-12-11 | Plansee Se | Composition for bonding rotary target for sputtering and method for bonding rotary target using the same |
TWI746634B (zh) * | 2017-09-12 | 2021-11-21 | 日商三菱綜合材料股份有限公司 | 圓筒型濺鍍靶 |
Also Published As
Publication number | Publication date |
---|---|
JP2009510264A (ja) | 2009-03-12 |
CN101313083A (zh) | 2008-11-26 |
WO2007038651A1 (en) | 2007-04-05 |
DE112006002609T5 (de) | 2008-08-21 |
KR20080054414A (ko) | 2008-06-17 |
US20070084719A1 (en) | 2007-04-19 |
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