TW200727092A - Composition for removing photoresist - Google Patents

Composition for removing photoresist

Info

Publication number
TW200727092A
TW200727092A TW096100978A TW96100978A TW200727092A TW 200727092 A TW200727092 A TW 200727092A TW 096100978 A TW096100978 A TW 096100978A TW 96100978 A TW96100978 A TW 96100978A TW 200727092 A TW200727092 A TW 200727092A
Authority
TW
Taiwan
Prior art keywords
photoresist
stripping
compound
composition
effect
Prior art date
Application number
TW096100978A
Other languages
Chinese (zh)
Inventor
Suk-Il Yoon
Seong-Bae Kim
Jong-Hyun Jeong
Soon-Beom Huh
Byung-Uk Kim
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200727092A publication Critical patent/TW200727092A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • C11D2111/22—

Abstract

The present invention is related to the composition for stripping the photoresist, and is particularly related to a composition containing the compound, which has excellent stripping effect on the photoresist, selected from the ring-shaped compound having double oxygen bonds, (ethylene) glycol compound, and carbonic acid compound. The invented composition for stripping the photoresist can further contain the lactone compound, amine or organic acid, oxidizing agent or its mixture. The invented composition for stripping the photoresist can be applied to remove the photoresist used in the pattern formation for the metal layout of circuit or display device, and has excellent stripping effect on the residual photoresist on the patterned metal film. In addition, the variation of ingredients and medicament fatigue caused by the vaporization at high temperature is extremely small such that it is capable of reducing the etching effect on the patterned metal film to the minimum.
TW096100978A 2006-01-10 2007-01-10 Composition for removing photoresist TW200727092A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060002683A KR20070074746A (en) 2006-01-10 2006-01-10 Composition for removing a (photo)resist

Publications (1)

Publication Number Publication Date
TW200727092A true TW200727092A (en) 2007-07-16

Family

ID=38343247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096100978A TW200727092A (en) 2006-01-10 2007-01-10 Composition for removing photoresist

Country Status (4)

Country Link
JP (1) JP2007188077A (en)
KR (1) KR20070074746A (en)
CN (1) CN101025579A (en)
TW (1) TW200727092A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101668063B1 (en) * 2013-05-07 2016-10-20 주식회사 엘지화학 Stripper composition for removing photoresist and stripping mthod of photoresist using the same
BR112016024205B1 (en) * 2014-04-16 2023-10-17 Ecolab Inc. CLEANING COMPOSITIONS AND METHOD FOR REMOVING AN ACRYLIC-BASED POLYMER MATERIAL FROM TABLET COATINGS
KR102317153B1 (en) * 2016-06-15 2021-10-26 동우 화인켐 주식회사 Resist stripper composition
KR102446132B1 (en) * 2016-09-16 2022-09-22 닛산 가가쿠 가부시키가이샤 protective film forming composition
CN115418647B (en) * 2022-08-19 2024-01-05 广东红日星实业有限公司 Wax removing water and preparation method and application thereof

Also Published As

Publication number Publication date
JP2007188077A (en) 2007-07-26
CN101025579A (en) 2007-08-29
KR20070074746A (en) 2007-07-18

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