TW200726397A - Heat sink and electronic equipment - Google Patents

Heat sink and electronic equipment

Info

Publication number
TW200726397A
TW200726397A TW095117312A TW95117312A TW200726397A TW 200726397 A TW200726397 A TW 200726397A TW 095117312 A TW095117312 A TW 095117312A TW 95117312 A TW95117312 A TW 95117312A TW 200726397 A TW200726397 A TW 200726397A
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
electronic equipment
face
radiation
Prior art date
Application number
TW095117312A
Other languages
English (en)
Inventor
Satoru Ohno
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200726397A publication Critical patent/TW200726397A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW095117312A 2005-12-28 2006-05-16 Heat sink and electronic equipment TW200726397A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005378791A JP4011598B2 (ja) 2005-12-28 2005-12-28 ヒートシンクおよび電子機器

Publications (1)

Publication Number Publication Date
TW200726397A true TW200726397A (en) 2007-07-01

Family

ID=38192251

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117312A TW200726397A (en) 2005-12-28 2006-05-16 Heat sink and electronic equipment

Country Status (5)

Country Link
US (1) US20070144706A1 (zh)
JP (1) JP4011598B2 (zh)
KR (1) KR100826039B1 (zh)
CN (1) CN100568494C (zh)
TW (1) TW200726397A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI785778B (zh) * 2021-09-06 2022-12-01 可成科技股份有限公司 散熱機構與其製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2812917A4 (en) * 2012-02-09 2016-01-20 Nokia Siemens Networks Oy METHOD AND DEVICE FOR REDUCING MECHANICAL LOAD IN ASSEMBLY OF HEAT PILLAR ASSEMBLIES
US9060633B1 (en) * 2012-03-01 2015-06-23 Salvatore Fiola Double slanted napkin holder

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2473634A (en) * 1947-07-15 1949-06-21 Brown Fintube Co Electric resistance welding method
JPS4723988Y1 (zh) * 1968-03-01 1972-07-31
JPS5018169U (zh) * 1973-06-15 1975-02-27
JPS5159567U (zh) * 1974-11-01 1976-05-11
JPS52113166A (en) * 1977-03-25 1977-09-22 Hitachi Ltd Radiating fin for power transistor
JPS5955283U (ja) * 1982-10-05 1984-04-11 松下電器産業株式会社 放熱器
JPS6452246U (zh) * 1987-09-28 1989-03-31
JPH0359685U (zh) * 1989-10-13 1991-06-12
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
JP3030526B2 (ja) * 1991-12-09 2000-04-10 株式会社日立製作所 半導体冷却構造
US5311928A (en) * 1993-06-28 1994-05-17 Marton Louis L Heat dissipator
JPH0750494A (ja) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp 冷却装置
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
JPH08195452A (ja) * 1995-01-18 1996-07-30 Fuji Electric Co Ltd ヒートシンク
JPH1065076A (ja) * 1996-08-23 1998-03-06 Matsushita Electric Ind Co Ltd 半導体発熱素子の放熱器
JP3669792B2 (ja) * 1996-10-24 2005-07-13 松下電器産業株式会社 ヒートシンク及びその製造方法
US5794684A (en) * 1996-11-08 1998-08-18 Jacoby; John Stacked fin heat sink construction and method of manufacturing the same
JPH10189847A (ja) * 1996-12-26 1998-07-21 Matsushita Electric Ind Co Ltd ヒートシンク連結装置
JPH11297907A (ja) * 1998-04-08 1999-10-29 Toshiba Corp 冷却装置
TW477437U (en) * 1998-06-23 2002-02-21 Foxconn Prec Components Co Ltd Assembled-type CPU heat sink
US6301779B1 (en) * 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
US5964285A (en) * 1999-02-12 1999-10-12 Yung-Tsai Chu Heat sink
JP3699290B2 (ja) * 1999-02-26 2005-09-28 コーセル株式会社 放熱装置
US6205662B1 (en) * 1999-05-14 2001-03-27 Yun-Ching Chen Method of producing a built-up heat exchanger and product thereof
KR20010004648A (ko) * 1999-06-29 2001-01-15 유병권 전자기기용 방열판의 조립방법 및 그 장치
JP2002093966A (ja) * 2000-09-18 2002-03-29 Toshiba Corp 放熱器、放熱器を用いた放熱モジュール、及び放熱モジュールを用いた電子機器
US20020181203A1 (en) * 2001-06-04 2002-12-05 Wen-Chen Wei Heat sink device retainer
KR200319226Y1 (ko) * 2003-04-23 2003-07-04 서머솔루션 주식회사 방사형 방열핀을 갖는 히트파이프용 방열판
US6829144B1 (en) * 2003-08-05 2004-12-07 International Business Machines Corporation Flip chip package with heat spreader allowing multiple heat sink attachment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI785778B (zh) * 2021-09-06 2022-12-01 可成科技股份有限公司 散熱機構與其製造方法

Also Published As

Publication number Publication date
JP4011598B2 (ja) 2007-11-21
CN1992242A (zh) 2007-07-04
CN100568494C (zh) 2009-12-09
US20070144706A1 (en) 2007-06-28
KR100826039B1 (ko) 2008-04-28
JP2007180369A (ja) 2007-07-12
KR20070070020A (ko) 2007-07-03

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