TW200725793A - Batch wafer handling system - Google Patents

Batch wafer handling system

Info

Publication number
TW200725793A
TW200725793A TW095135878A TW95135878A TW200725793A TW 200725793 A TW200725793 A TW 200725793A TW 095135878 A TW095135878 A TW 095135878A TW 95135878 A TW95135878 A TW 95135878A TW 200725793 A TW200725793 A TW 200725793A
Authority
TW
Taiwan
Prior art keywords
batch
support
support member
substrate
handling system
Prior art date
Application number
TW095135878A
Other languages
English (en)
Inventor
Adam A Brailove
Aaron Webb
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200725793A publication Critical patent/TW200725793A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095135878A 2005-09-30 2006-09-27 Batch wafer handling system TW200725793A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/242,301 US20080257260A9 (en) 2005-09-30 2005-09-30 Batch wafer handling system

Publications (1)

Publication Number Publication Date
TW200725793A true TW200725793A (en) 2007-07-01

Family

ID=37900708

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135878A TW200725793A (en) 2005-09-30 2006-09-27 Batch wafer handling system

Country Status (3)

Country Link
US (1) US20080257260A9 (zh)
TW (1) TW200725793A (zh)
WO (1) WO2007041012A2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI760024B (zh) * 2020-12-23 2022-04-01 台灣積體電路製造股份有限公司 用於處理晶圓的設備以及處理晶圓的方法
TWI825295B (zh) * 2019-03-28 2023-12-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 門體開關器、基板處理設備及打開門體之方法

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US7351656B2 (en) * 2005-01-21 2008-04-01 Kabushiki Kaihsa Toshiba Semiconductor device having oxidized metal film and manufacture method of the same
US7989360B2 (en) 2008-01-07 2011-08-02 Micron Technology, Inc. Semiconductor processing methods, and methods for forming silicon dioxide
JP5276387B2 (ja) * 2008-09-04 2013-08-28 東京エレクトロン株式会社 成膜装置、基板処理装置、成膜方法及びこの成膜方法を実行させるためのプログラムを記録した記録媒体
US8852693B2 (en) * 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
EP2740026A4 (en) 2011-08-03 2015-06-24 Ingenuity Systems Inc METHOD AND SYSTEMS FOR BIOLOGICAL DATA ANALYSIS
US9493874B2 (en) * 2012-11-15 2016-11-15 Cypress Semiconductor Corporation Distribution of gas over a semiconductor wafer in batch processing
WO2014143846A1 (en) 2013-03-15 2014-09-18 Applied Materials, Inc Multi-position batch load lock apparatus and systems and methods including same
CN111373519B (zh) * 2017-11-16 2021-11-23 应用材料公司 高压蒸气退火处理设备

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JP3177035B2 (ja) * 1992-11-26 2001-06-18 東京エレクトロン株式会社 縦型熱処理装置
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US5664925A (en) * 1995-07-06 1997-09-09 Brooks Automation, Inc. Batchloader for load lock
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US5895530A (en) * 1996-02-26 1999-04-20 Applied Materials, Inc. Method and apparatus for directing fluid through a semiconductor processing chamber
US5944940A (en) * 1996-07-09 1999-08-31 Gamma Precision Technology, Inc. Wafer transfer system and method of using the same
TW344847B (en) * 1996-08-29 1998-11-11 Tokyo Electron Co Ltd Substrate treatment system, substrate transfer system, and substrate transfer method
KR100461292B1 (ko) * 1996-10-31 2005-02-28 동경 엘렉트론 주식회사 수직형열처리장치,수직형열처리장치의분해방법및수직형열처리장치의유지보수방법
JP3225431B2 (ja) * 1996-12-25 2001-11-05 住友イートンノバ株式会社 イオン注入装置におけるウエハ搬送装置
TW589391B (en) * 1997-07-08 2004-06-01 Unaxis Trading Ag Process for vacuum treating workpieces, and corresponding process equipment
US6057662A (en) * 1998-02-25 2000-05-02 Applied Materials, Inc. Single motor control for substrate handler in processing system
JP3863671B2 (ja) * 1998-07-25 2006-12-27 株式会社ダイヘン 搬送用ロボット装置
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
US6413037B1 (en) * 2000-03-14 2002-07-02 Applied Materials, Inc. Flexibly mounted contact cup
US6457199B1 (en) * 2000-10-12 2002-10-01 Lam Research Corporation Substrate processing in an immersion, scrub and dry system
US20020061248A1 (en) * 2000-07-07 2002-05-23 Applied Materials, Inc. High productivity semiconductor wafer processing system
US6630053B2 (en) * 2000-08-22 2003-10-07 Asm Japan K.K. Semiconductor processing module and apparatus
US20030045098A1 (en) * 2001-08-31 2003-03-06 Applied Materials, Inc. Method and apparatus for processing a wafer
JP2003077974A (ja) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US6808589B2 (en) * 2002-06-14 2004-10-26 Taiwan Semiconductor Manufacturing Co. Ltd Wafer transfer robot having wafer blades equipped with sensors
US20040018070A1 (en) * 2002-07-25 2004-01-29 Applied Materials, Inc. Compact and high throughput semiconductor fabrication system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825295B (zh) * 2019-03-28 2023-12-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 門體開關器、基板處理設備及打開門體之方法
TWI760024B (zh) * 2020-12-23 2022-04-01 台灣積體電路製造股份有限公司 用於處理晶圓的設備以及處理晶圓的方法

Also Published As

Publication number Publication date
WO2007041012A2 (en) 2007-04-12
WO2007041012A3 (en) 2007-11-01
US20070074663A1 (en) 2007-04-05
US20080257260A9 (en) 2008-10-23

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