TW200717865A - Light emitting diode package and lighting apparatus - Google Patents

Light emitting diode package and lighting apparatus

Info

Publication number
TW200717865A
TW200717865A TW095125944A TW95125944A TW200717865A TW 200717865 A TW200717865 A TW 200717865A TW 095125944 A TW095125944 A TW 095125944A TW 95125944 A TW95125944 A TW 95125944A TW 200717865 A TW200717865 A TW 200717865A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
led element
diode package
central wavelength
Prior art date
Application number
TW095125944A
Other languages
English (en)
Inventor
Ryuji Tsuchiya
Masami Takagi
Original Assignee
Harison Toshiba Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harison Toshiba Lighting Corp filed Critical Harison Toshiba Lighting Corp
Publication of TW200717865A publication Critical patent/TW200717865A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
TW095125944A 2005-07-15 2006-07-14 Light emitting diode package and lighting apparatus TW200717865A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005207602A JP2007027421A (ja) 2005-07-15 2005-07-15 Ledパッケージ及び照明装置

Publications (1)

Publication Number Publication Date
TW200717865A true TW200717865A (en) 2007-05-01

Family

ID=37787796

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125944A TW200717865A (en) 2005-07-15 2006-07-14 Light emitting diode package and lighting apparatus

Country Status (4)

Country Link
JP (1) JP2007027421A (zh)
KR (1) KR20070009453A (zh)
CN (1) CN1937222B (zh)
TW (1) TW200717865A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458074B (zh) * 2009-02-16 2014-10-21 Semi Photonics Co Ltd 具有複合螢光體層之發光二極體的發光裝置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251230A (ja) * 2007-03-29 2008-10-16 Harison Toshiba Lighting Corp 中空式面照明装置
KR100919518B1 (ko) * 2007-09-28 2009-09-28 (주) 이지닉스 고연색성 백색광원 및 그것을 이용한 조명장치
JP4525767B2 (ja) * 2008-02-14 2010-08-18 ソニー株式会社 照明装置及び表示装置
CN102790164B (zh) 2008-03-03 2016-08-10 Ge磷光体技术有限责任公司 发光装置
JP5005712B2 (ja) * 2009-02-03 2012-08-22 三菱電機株式会社 発光装置
WO2010107239A2 (ko) * 2009-03-18 2010-09-23 ㈜알텍테크놀로지스 발광 다이오드 장치의 제조방법과 발광 다이오드 패키지 및 발광 다이오드 모듈, 그리고 이를 구비한 조명등기구
JP2011192704A (ja) * 2010-03-12 2011-09-29 Toshiba Lighting & Technology Corp 発光装置及び照明装置
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
CN101958316B (zh) 2010-07-20 2013-01-16 上海亚明灯泡厂有限公司 Led集成封装光源模块
CN102810533A (zh) * 2011-05-31 2012-12-05 亿广科技(上海)有限公司 白光发光装置
CN103363334B (zh) * 2012-04-05 2015-02-11 扬州艾笛森光电有限公司 灯具及其发光二极管模块
JP6287204B2 (ja) * 2013-12-27 2018-03-07 日亜化学工業株式会社 半導体光源装置
JP2019054098A (ja) * 2017-09-14 2019-04-04 株式会社グリーンウェル ブルーライトを低減した白色led素子および該白色led素子を複数個、配線基板上に配列・搭載した白色ledユニット
CN109830474B (zh) * 2018-12-17 2023-07-11 江西省晶能半导体有限公司 彩光led芯片制备方法及彩光led灯珠制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3627478B2 (ja) * 1997-11-25 2005-03-09 松下電工株式会社 光源装置
JP2004055772A (ja) * 2002-07-18 2004-02-19 Citizen Electronics Co Ltd Led発光装置
JP4274843B2 (ja) * 2003-04-21 2009-06-10 シャープ株式会社 Ledデバイスおよびそれを用いた携帯電話機器、デジタルカメラおよびlcd表示装置
JP4458804B2 (ja) * 2003-10-17 2010-04-28 シチズン電子株式会社 白色led
CN1610134A (zh) * 2003-10-23 2005-04-27 郑子淇 发光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458074B (zh) * 2009-02-16 2014-10-21 Semi Photonics Co Ltd 具有複合螢光體層之發光二極體的發光裝置

Also Published As

Publication number Publication date
CN1937222B (zh) 2010-04-21
CN1937222A (zh) 2007-03-28
JP2007027421A (ja) 2007-02-01
KR20070009453A (ko) 2007-01-18

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