TW200716785A - Method and apparatus for the application of twin wire arc spray coatings - Google Patents

Method and apparatus for the application of twin wire arc spray coatings

Info

Publication number
TW200716785A
TW200716785A TW095127610A TW95127610A TW200716785A TW 200716785 A TW200716785 A TW 200716785A TW 095127610 A TW095127610 A TW 095127610A TW 95127610 A TW95127610 A TW 95127610A TW 200716785 A TW200716785 A TW 200716785A
Authority
TW
Taiwan
Prior art keywords
application
twin wire
arc spray
wire arc
spray coatings
Prior art date
Application number
TW095127610A
Other languages
English (en)
Other versions
TWI402374B (zh
Inventor
John Gilbert Deem
Robert Manuel Coyne
Original Assignee
Boc Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boc Group Inc filed Critical Boc Group Inc
Publication of TW200716785A publication Critical patent/TW200716785A/zh
Application granted granted Critical
Publication of TWI402374B publication Critical patent/TWI402374B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32871—Means for trapping or directing unwanted particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06—Metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/131—Wire arc spraying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134—Plasma spraying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Spray Control Apparatus (AREA)
  • Nozzles (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW095127610A 2005-07-29 2006-07-28 用於雙絲電弧噴塗塗層之應用的方法及裝置 TWI402374B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/192,600 US7554052B2 (en) 2005-07-29 2005-07-29 Method and apparatus for the application of twin wire arc spray coatings

Publications (2)

Publication Number Publication Date
TW200716785A true TW200716785A (en) 2007-05-01
TWI402374B TWI402374B (zh) 2013-07-21

Family

ID=37307244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127610A TWI402374B (zh) 2005-07-29 2006-07-28 用於雙絲電弧噴塗塗層之應用的方法及裝置

Country Status (7)

Country Link
US (1) US7554052B2 (zh)
EP (1) EP1749899B1 (zh)
JP (1) JP5197935B2 (zh)
KR (1) KR101497985B1 (zh)
CN (1) CN1904124B (zh)
SG (1) SG129408A1 (zh)
TW (1) TWI402374B (zh)

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* Cited by examiner, † Cited by third party
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US7579067B2 (en) * 2004-11-24 2009-08-25 Applied Materials, Inc. Process chamber component with layered coating and method
US20060237043A1 (en) * 2005-04-25 2006-10-26 Applied Materials, Inc. Method and apparatus for cleaning semiconductor substrates
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers
CN101538697B (zh) * 2008-03-20 2013-04-10 林淑清 无燃烧熔射的喷覆方法
CN102465248B (zh) * 2010-11-16 2014-01-08 无锡华润上华半导体有限公司 防护罩的表面处理方法及防护罩
US20130011569A1 (en) * 2010-12-23 2013-01-10 Jochen Schein Method and device for arc spraying
AU2012362827B2 (en) 2011-12-30 2016-12-22 Scoperta, Inc. Coating compositions
US9144841B1 (en) * 2012-11-15 2015-09-29 The Boeing Company In-mold metallization of composite structures
GB2529608B (en) * 2014-06-10 2018-07-18 Monitor Coatings Ltd A method of coating a sheet of steel
KR101790394B1 (ko) * 2014-06-11 2017-10-26 (주)코미코 박막 증착 장치용 내부재 및 이의 제조 방법
CN108350528B (zh) 2015-09-04 2020-07-10 思高博塔公司 无铬和低铬耐磨合金
CA3003048C (en) * 2015-11-10 2023-01-03 Scoperta, Inc. Oxidation controlled twin wire arc spray materials
US11380557B2 (en) * 2017-06-05 2022-07-05 Applied Materials, Inc. Apparatus and method for gas delivery in semiconductor process chambers
US11239058B2 (en) 2018-07-11 2022-02-01 Applied Materials, Inc. Protective layers for processing chamber components
JP2022505878A (ja) 2018-10-26 2022-01-14 エリコン メテコ（ユーエス）インコーポレイテッド 耐食性かつ耐摩耗性のニッケル系合金

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JPS6425965A (en) * 1987-07-20 1989-01-27 Nippon Kokan Kk Arc thermal spraying method
US5135629A (en) 1989-06-12 1992-08-04 Nippon Mining Co., Ltd. Thin film deposition system
JPH10183328A (ja) * 1996-12-19 1998-07-14 Mitsubishi Heavy Ind Ltd アーク溶射方法
JP4551561B2 (ja) * 1999-12-28 2010-09-29 株式会社東芝 真空成膜装置用部品とそれを用いた真空成膜装置、およびターゲット装置
TW503449B (en) * 2000-04-18 2002-09-21 Ngk Insulators Ltd Halogen gas plasma-resistive members and method for producing the same, laminates, and corrosion-resistant members
DE60139406D1 (de) * 2000-11-17 2009-09-10 Nippon Mining Co Sputtering-target, das wenig partikel produziert, belagträgerplatte mit dem target und verfahren zur herstellung des targets
US6398125B1 (en) 2001-02-10 2002-06-04 Nanotek Instruments, Inc. Process and apparatus for the production of nanometer-sized powders
JP4825366B2 (ja) * 2001-05-31 2011-11-30 株式会社東芝 真空成膜装置用部品とそれを用いた真空成膜装置
JP2003049260A (ja) * 2001-08-03 2003-02-21 Tosoh Corp 成膜装置用部材およびその製造方法
US6465052B1 (en) 2001-11-30 2002-10-15 Nanotek Instruments, Inc. Method for production of nano-porous coatings
US6899798B2 (en) 2001-12-21 2005-05-31 Applied Materials, Inc. Reusable ceramic-comprising component which includes a scrificial surface layer
US6656535B2 (en) * 2001-12-21 2003-12-02 Applied Materials, Inc Method of fabricating a coated process chamber component
US7026009B2 (en) * 2002-03-27 2006-04-11 Applied Materials, Inc. Evaluation of chamber components having textured coatings
US7250220B1 (en) * 2002-10-03 2007-07-31 Tosoh Set, Inc. Bond strength of coatings to ceramic components
JP3996039B2 (ja) * 2002-11-05 2007-10-24 アプライドマテリアルズジャパン株式会社 金属の溶射膜を形成したセラミック母材の製造方法
US6797131B2 (en) * 2002-11-12 2004-09-28 Applied Materials, Inc. Design of hardware features to facilitate arc-spray coating applications and functions
US20050028838A1 (en) * 2002-11-25 2005-02-10 Karl Brueckner Cleaning tantalum-containing deposits from process chamber components
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US7182816B2 (en) * 2003-08-18 2007-02-27 Tokyo Electron Limited Particulate reduction using temperature-controlled chamber shield
US7097713B2 (en) 2003-08-19 2006-08-29 The Boc Group, Inc. Method for removing a composite coating containing tantalum deposition and arc sprayed aluminum from ceramic substrates
US20050238807A1 (en) * 2004-04-27 2005-10-27 Applied Materials, Inc. Refurbishment of a coated chamber component
US7579067B2 (en) * 2004-11-24 2009-08-25 Applied Materials, Inc. Process chamber component with layered coating and method
US20060292310A1 (en) * 2005-06-27 2006-12-28 Applied Materials, Inc. Process kit design to reduce particle generation

Also Published As

Publication number Publication date
CN1904124A (zh) 2007-01-31
CN1904124B (zh) 2012-08-15
KR101497985B1 (ko) 2015-03-03
US7554052B2 (en) 2009-06-30
JP2007105721A (ja) 2007-04-26
TWI402374B (zh) 2013-07-21
EP1749899B1 (en) 2019-09-04
US20070026159A1 (en) 2007-02-01
SG129408A1 (en) 2007-02-26
EP1749899A1 (en) 2007-02-07
JP5197935B2 (ja) 2013-05-15
KR20070015037A (ko) 2007-02-01

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