TW200715930A - Method for manufacturing a substrate embedded with an electronic component and device from the same - Google Patents
Method for manufacturing a substrate embedded with an electronic component and device from the sameInfo
- Publication number
- TW200715930A TW200715930A TW094135860A TW94135860A TW200715930A TW 200715930 A TW200715930 A TW 200715930A TW 094135860 A TW094135860 A TW 094135860A TW 94135860 A TW94135860 A TW 94135860A TW 200715930 A TW200715930 A TW 200715930A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- manufacturing
- substrate embedded
- same
- metal foil
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94135860A TWI295912B (en) | 2005-10-14 | 2005-10-14 | Method for manufacturing a substrate embedded with an electronic component and device from the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94135860A TWI295912B (en) | 2005-10-14 | 2005-10-14 | Method for manufacturing a substrate embedded with an electronic component and device from the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715930A true TW200715930A (en) | 2007-04-16 |
TWI295912B TWI295912B (en) | 2008-04-11 |
Family
ID=45068579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94135860A TWI295912B (en) | 2005-10-14 | 2005-10-14 | Method for manufacturing a substrate embedded with an electronic component and device from the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI295912B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI413475B (zh) * | 2011-03-09 | 2013-10-21 | Subtron Technology Co Ltd | 電氣結構製程及電氣結構 |
TWI419630B (zh) * | 2010-02-12 | 2013-12-11 | Lg Innotek Co Ltd | 嵌入式印刷電路板及其製造方法 |
TWI428070B (zh) * | 2011-12-24 | 2014-02-21 | Zhen Ding Technology Co Ltd | 具有內埋元件之電路板之製作方法 |
CN104684254A (zh) * | 2013-11-27 | 2015-06-03 | Tdk株式会社 | Ic内置基板及其制造方法 |
CN105530765A (zh) * | 2014-09-29 | 2016-04-27 | 富葵精密组件(深圳)有限公司 | 具有内埋元件的电路板及其制作方法 |
EP3478033A1 (en) | 2017-10-25 | 2019-05-01 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Embedding component with pre-connected pillar in component carrier |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201023219A (en) * | 2008-12-09 | 2010-06-16 | Kinsus Interconnect Tech Corp | Buried capacitor structure |
TW201431448A (zh) | 2013-01-23 | 2014-08-01 | Unimicron Technology Corp | 嵌埋有電子元件的線路板結構及其製法 |
CN103972203A (zh) * | 2013-02-06 | 2014-08-06 | 欣兴电子股份有限公司 | 嵌埋有电子组件的线路板结构及其制法 |
-
2005
- 2005-10-14 TW TW94135860A patent/TWI295912B/zh active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI419630B (zh) * | 2010-02-12 | 2013-12-11 | Lg Innotek Co Ltd | 嵌入式印刷電路板及其製造方法 |
TWI413475B (zh) * | 2011-03-09 | 2013-10-21 | Subtron Technology Co Ltd | 電氣結構製程及電氣結構 |
US9137899B2 (en) | 2011-03-09 | 2015-09-15 | Subtron Technology Co., Ltd. | Process of electronic structure and electronic structure |
TWI428070B (zh) * | 2011-12-24 | 2014-02-21 | Zhen Ding Technology Co Ltd | 具有內埋元件之電路板之製作方法 |
CN104684254A (zh) * | 2013-11-27 | 2015-06-03 | Tdk株式会社 | Ic内置基板及其制造方法 |
CN104684254B (zh) * | 2013-11-27 | 2017-12-19 | Tdk株式会社 | Ic内置基板及其制造方法 |
CN105530765A (zh) * | 2014-09-29 | 2016-04-27 | 富葵精密组件(深圳)有限公司 | 具有内埋元件的电路板及其制作方法 |
EP3478033A1 (en) | 2017-10-25 | 2019-05-01 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Embedding component with pre-connected pillar in component carrier |
US10765005B2 (en) | 2017-10-25 | 2020-09-01 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Embedding component with pre-connected pillar in component carrier |
Also Published As
Publication number | Publication date |
---|---|
TWI295912B (en) | 2008-04-11 |
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