TW200715548A - Integrated inductor - Google Patents
Integrated inductorInfo
- Publication number
- TW200715548A TW200715548A TW094135491A TW94135491A TW200715548A TW 200715548 A TW200715548 A TW 200715548A TW 094135491 A TW094135491 A TW 094135491A TW 94135491 A TW94135491 A TW 94135491A TW 200715548 A TW200715548 A TW 200715548A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer pattern
- integrated inductor
- metal layer
- electrically connected
- stacked
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094135491A TWI304261B (en) | 2005-10-12 | 2005-10-12 | Integrated inductor |
JP2006277978A JP2007110129A (ja) | 2005-10-12 | 2006-10-11 | 集積インダクター |
US11/548,687 US7612645B2 (en) | 2005-10-12 | 2006-10-11 | Integrated inductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094135491A TWI304261B (en) | 2005-10-12 | 2005-10-12 | Integrated inductor |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715548A true TW200715548A (en) | 2007-04-16 |
TWI304261B TWI304261B (en) | 2008-12-11 |
Family
ID=38035676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094135491A TWI304261B (en) | 2005-10-12 | 2005-10-12 | Integrated inductor |
Country Status (3)
Country | Link |
---|---|
US (1) | US7612645B2 (zh) |
JP (1) | JP2007110129A (zh) |
TW (1) | TWI304261B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8717137B2 (en) * | 2006-05-31 | 2014-05-06 | Broadcom Corporation | On-chip inductor using redistribution layer and dual-layer passivation |
KR100904594B1 (ko) * | 2007-08-27 | 2009-06-25 | 주식회사 동부하이텍 | 반도체 소자용 인덕터 및 그 제조 방법 |
US7956715B2 (en) * | 2008-04-21 | 2011-06-07 | University Of Dayton | Thin film structures with negative inductance and methods for fabricating inductors comprising the same |
US8143952B2 (en) | 2009-10-08 | 2012-03-27 | Qualcomm Incorporated | Three dimensional inductor and transformer |
US8816810B2 (en) * | 2011-07-06 | 2014-08-26 | Mediatek Inc. | Integrated circuit transformer |
KR101508812B1 (ko) * | 2012-05-08 | 2015-04-06 | 삼성전기주식회사 | 코일 부품 제조방법 및 코일 부품 |
US9001031B2 (en) | 2012-07-30 | 2015-04-07 | Qualcomm Mems Technologies, Inc. | Complex passive design with special via implementation |
KR20140125150A (ko) * | 2013-04-18 | 2014-10-28 | 삼성전기주식회사 | 공통모드필터 및 이의 제조방법 |
US9177709B2 (en) * | 2013-09-05 | 2015-11-03 | Globalfoundries Inc. | Structure and method for high performance multi-port inductor |
KR101539879B1 (ko) * | 2014-01-02 | 2015-07-27 | 삼성전기주식회사 | 칩 전자부품 |
KR101598295B1 (ko) * | 2014-09-22 | 2016-02-26 | 삼성전기주식회사 | 다층 시드 패턴 인덕터, 그 제조방법 및 그 실장 기판 |
US10068699B1 (en) | 2017-03-01 | 2018-09-04 | Realtek Semiconductor Corp. | Integrated inductor and fabrication method thereof |
US10522282B2 (en) | 2017-04-07 | 2019-12-31 | Realtek Semiconductor Corp. | High isolation integrated inductor and method thereof |
US11152151B2 (en) | 2017-05-26 | 2021-10-19 | Nucurrent, Inc. | Crossover coil structure for wireless transmission |
US10896780B2 (en) * | 2018-03-02 | 2021-01-19 | Intel IP Corporation | Resonant LC tank package and method of manufacture |
US11283303B2 (en) | 2020-07-24 | 2022-03-22 | Nucurrent, Inc. | Area-apportioned wireless power antenna for maximized charging volume |
US11695302B2 (en) | 2021-02-01 | 2023-07-04 | Nucurrent, Inc. | Segmented shielding for wide area wireless power transmitter |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5545916A (en) | 1994-12-06 | 1996-08-13 | At&T Corp. | High Q integrated inductor |
JPH09162354A (ja) | 1995-07-07 | 1997-06-20 | Northern Telecom Ltd | 集積インダクタ構造およびその製造方法 |
TW396594B (en) * | 1998-07-13 | 2000-07-01 | Winbond Electronics Corp | High quality inductor device and its manufacturing method |
TW386279B (en) * | 1998-08-07 | 2000-04-01 | Winbond Electronics Corp | Inductor structure with air gap and method of manufacturing thereof |
US6566731B2 (en) * | 1999-02-26 | 2003-05-20 | Micron Technology, Inc. | Open pattern inductor |
US6924725B2 (en) * | 2002-03-21 | 2005-08-02 | Infineon Technologies Ag | Coil on a semiconductor substrate and method for its production |
JP2004119489A (ja) * | 2002-09-24 | 2004-04-15 | Mitsubishi Electric Corp | 半導体装置 |
US6852605B2 (en) * | 2003-05-01 | 2005-02-08 | Chartered Semiconductor Manufacturing Ltd. | Method of forming an inductor with continuous metal deposition |
TWI362098B (en) | 2003-09-30 | 2012-04-11 | Agere Systems Inc | Method for forming an inductor in a semiconductor integrated circuit and integrated circuit therefor |
US7207096B2 (en) * | 2004-01-22 | 2007-04-24 | International Business Machines Corporation | Method of manufacturing high performance copper inductors with bond pads |
JP2006173145A (ja) * | 2004-12-10 | 2006-06-29 | Sharp Corp | インダクタ、共振回路、半導体集積回路、発振器、通信装置 |
KR100598113B1 (ko) * | 2005-01-03 | 2006-07-07 | 삼성전자주식회사 | 인덕터 및 인덕터 형성 방법 |
-
2005
- 2005-10-12 TW TW094135491A patent/TWI304261B/zh active
-
2006
- 2006-10-11 US US11/548,687 patent/US7612645B2/en active Active
- 2006-10-11 JP JP2006277978A patent/JP2007110129A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI304261B (en) | 2008-12-11 |
JP2007110129A (ja) | 2007-04-26 |
US7612645B2 (en) | 2009-11-03 |
US20070126543A1 (en) | 2007-06-07 |
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