TW200709933A - Structured phosphor tape article - Google Patents

Structured phosphor tape article

Info

Publication number
TW200709933A
TW200709933A TW095123572A TW95123572A TW200709933A TW 200709933 A TW200709933 A TW 200709933A TW 095123572 A TW095123572 A TW 095123572A TW 95123572 A TW95123572 A TW 95123572A TW 200709933 A TW200709933 A TW 200709933A
Authority
TW
Taiwan
Prior art keywords
phosphor
layer
structured surface
pressure sensitive
tape article
Prior art date
Application number
TW095123572A
Other languages
English (en)
Inventor
Craig Russell Schardt
David Scott Thompson
Larry Allan Meixner
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200709933A publication Critical patent/TW200709933A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02Use of particular materials as binders, particle coatings or suspension media therefor
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774Aluminates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/508Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
TW095123572A 2005-06-30 2006-06-29 Structured phosphor tape article TW200709933A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/171,933 US20070001182A1 (en) 2005-06-30 2005-06-30 Structured phosphor tape article

Publications (1)

Publication Number Publication Date
TW200709933A true TW200709933A (en) 2007-03-16

Family

ID=37588393

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123572A TW200709933A (en) 2005-06-30 2006-06-29 Structured phosphor tape article

Country Status (3)

Country Link
US (1) US20070001182A1 (zh)
TW (1) TW200709933A (zh)
WO (1) WO2007005417A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8481144B2 (en) 2009-10-16 2013-07-09 Wintek Corporation Complex sheet structure and cover lens assembly

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005034582A1 (ja) * 2003-10-01 2005-04-14 Idemitsu Kosan Co., Ltd. 色変換層及び発光素子
DE102005041064B4 (de) * 2005-08-30 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102005046450A1 (de) * 2005-09-28 2007-04-05 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip, Verfahren zu dessen Herstellung und optoelektronisches Bauteil
WO2007122543A2 (en) * 2006-04-26 2007-11-01 Philips Intellectual Property & Standards Gmbh Light delivery device with improved conversion element
US20080173886A1 (en) * 2006-05-11 2008-07-24 Evident Technologies, Inc. Solid state lighting devices comprising quantum dots
US8941293B2 (en) 2006-05-11 2015-01-27 Samsung Electronics Co., Ltd. Solid state lighting devices comprising quantum dots
US9024349B2 (en) * 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9196799B2 (en) 2007-01-22 2015-11-24 Cree, Inc. LED chips having fluorescent substrates with microholes and methods for fabricating
US9944031B2 (en) 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
US8330176B2 (en) * 2007-02-13 2012-12-11 3M Innovative Properties Company LED devices having lenses and methods of making same
DE102007010755A1 (de) * 2007-03-06 2008-10-30 Osram Opto Semiconductors Gmbh Anordnung mit einem Halbleiterchip und einer Lichtleiterschicht
KR100862532B1 (ko) * 2007-03-13 2008-10-09 삼성전기주식회사 발광 다이오드 패키지 제조방법
US20100110728A1 (en) * 2007-03-19 2010-05-06 Nanosys, Inc. Light-emitting diode (led) devices comprising nanocrystals
US20080283864A1 (en) * 2007-05-16 2008-11-20 Letoquin Ronan P Single Crystal Phosphor Light Conversion Structures for Light Emitting Devices
US20090023234A1 (en) * 2007-07-17 2009-01-22 Hung-Tsung Hsu Method for manufacturing light emitting diode package
US7737457B2 (en) * 2007-09-27 2010-06-15 Lumination Llc Phosphor down converting element for an LED package and fabrication method
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
KR101432236B1 (ko) * 2008-08-26 2014-08-27 삼성디스플레이 주식회사 유기 발광 표시 장치
US7955875B2 (en) * 2008-09-26 2011-06-07 Cree, Inc. Forming light emitting devices including custom wavelength conversion structures
JP5440064B2 (ja) * 2008-10-21 2014-03-12 東芝ライテック株式会社 照明装置
US20100123386A1 (en) 2008-11-13 2010-05-20 Maven Optronics Corp. Phosphor-Coated Light Extraction Structures for Phosphor-Converted Light Emitting Devices
US20100209670A1 (en) * 2009-02-17 2010-08-19 Nitto Denko Corporation Sheet for photosemiconductor encapsulation
CN102318091A (zh) * 2009-03-10 2012-01-11 株式会社纳沛斯Led Led引线框封装、使用led引线框封装的led封装及制造led封装的方法
US20100328923A1 (en) * 2009-06-25 2010-12-30 Bridgelux, Inc. Multiple layer phosphor bearing film
US20100327733A1 (en) * 2009-06-25 2010-12-30 Bridgelux, Inc. Multiple layer phosphor bearing film
US20110248299A1 (en) * 2010-04-08 2011-10-13 Park Na-Na Light emitting diode package and method of fabricating the same
WO2011130648A2 (en) * 2010-04-16 2011-10-20 Solais Lighting, Inc. Miniature cellular structure for retrofit led lamp secondary optics
KR101039880B1 (ko) * 2010-04-28 2011-06-09 엘지이노텍 주식회사 발광소자 및 발광소자 패키지
US20130334956A1 (en) * 2010-05-05 2013-12-19 Next Lighting Coro. Remote phosphor tape lighting units
JP5511524B2 (ja) * 2010-06-07 2014-06-04 日東電工株式会社 光半導体用封止シート
JP5566785B2 (ja) * 2010-06-22 2014-08-06 日東電工株式会社 複合シート
JP2012009696A (ja) * 2010-06-25 2012-01-12 Panasonic Electric Works Co Ltd 発光装置およびそれを用いたled照明器具
EP2400569B1 (en) * 2010-06-28 2018-10-24 LG Innotek Co., Ltd. Light-emitting diode package
DE102010034923A1 (de) * 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht
WO2012039168A1 (ja) * 2010-09-21 2012-03-29 日本電気株式会社 蛍光体発光装置
US8362507B2 (en) * 2010-11-01 2013-01-29 Tyco Electronics Corporation Optic assembly utilizing quantum dots
KR20130128444A (ko) 2010-12-29 2013-11-26 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광대력 출력 및 제어가능한 색을 갖는 원격 형광체 led 디바이스
US9028083B2 (en) 2010-12-29 2015-05-12 3M Innovative Properties Company Phosphor reflector assembly for remote phosphor LED device
WO2012091971A1 (en) 2010-12-29 2012-07-05 3M Innovative Properties Company Remote phosphor led constructions
TWM417366U (en) * 2011-05-04 2011-12-01 Johnphil Technology Corp Light module and adhesive member thereof
KR20120131712A (ko) * 2011-05-26 2012-12-05 엘지이노텍 주식회사 발광소자 패키지
GB201109054D0 (en) * 2011-05-31 2011-07-13 Nanoco Technologies Ltd Semiconductor nanoparticle-based materials for use in light emitting diodes, optoelectronic displays and the like
CN102376859A (zh) * 2011-06-09 2012-03-14 吉永科技股份有限公司 光源模组及其黏性构件
JP5800640B2 (ja) * 2011-08-30 2015-10-28 日東電工株式会社 発光ダイオード装置の製造方法
KR102091994B1 (ko) 2012-12-21 2020-03-23 다우 실리콘즈 코포레이션 층상 중합체 구조물 및 방법
US9778510B2 (en) * 2013-10-08 2017-10-03 Samsung Electronics Co., Ltd. Nanocrystal polymer composites and production methods thereof
CN103943753A (zh) * 2014-03-06 2014-07-23 京东方科技集团股份有限公司 发光二极管光源及其制作方法、背光源及显示装置
CN104993038B (zh) * 2015-05-26 2018-06-12 武汉华星光电技术有限公司 发光装置
JP6602111B2 (ja) * 2015-08-28 2019-11-06 三星電子株式会社 半導体発光装置
KR102499548B1 (ko) * 2015-11-06 2023-03-03 엘지이노텍 주식회사 발광패키지 및 이를 포함하는 차량용 헤드램프
CN105867026A (zh) * 2016-06-03 2016-08-17 青岛海信电器股份有限公司 量子点光源器件、背光模组及液晶显示装置
US10559507B1 (en) * 2018-02-06 2020-02-11 Facebook Technologies, Llc Direct wafer mapping and selective elastomer deposition
KR20210048975A (ko) * 2019-10-24 2021-05-04 현대모비스 주식회사 자동차용 램프 및 그 램프를 포함하는 자동차

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58200200A (ja) * 1982-05-18 1983-11-21 富士写真フイルム株式会社 放射線像変換パネルおよびその製造法
US5272562A (en) * 1993-02-05 1993-12-21 Minnesota Mining And Manufacturing Company Cube-corner retroreflective articles
KR100314563B1 (ko) * 1993-10-29 2002-04-24 스프레이그 로버트 월터 미세구조표면을갖는압감접착제
BR9609314A (pt) * 1995-06-26 1999-07-06 Minnesota Mining & Mfg Película de multicamadas
US6600175B1 (en) * 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
US5897727A (en) * 1996-09-20 1999-04-27 Minnesota Mining And Manufacturing Company Method for assembling layers with a transfer process using a crosslinkable adhesive layer
US6197397B1 (en) * 1996-12-31 2001-03-06 3M Innovative Properties Company Adhesives having a microreplicated topography and methods of making and using same
US6617784B1 (en) * 1998-06-08 2003-09-09 3M Innovative Properties Company Electroluminescent device and method for producing the same
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6670207B1 (en) * 1999-03-15 2003-12-30 Gentex Corporation Radiation emitter device having an integral micro-groove lens
US6280822B1 (en) * 1999-01-11 2001-08-28 3M Innovative Properties Company Cube corner cavity based retroeflectors with transparent fill material
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
KR20010027835A (ko) * 1999-09-16 2001-04-06 김춘호 후막형 전계 발광 소자 및 그 제조 방법
JP4246887B2 (ja) * 2000-05-29 2009-04-02 富士フイルム株式会社 放射線像変換パネルの製造方法
US6655810B2 (en) * 2000-06-21 2003-12-02 Fujitsu Display Technologies Corporation Lighting unit
US6635363B1 (en) * 2000-08-21 2003-10-21 General Electric Company Phosphor coating with self-adjusting distance from LED chip
US6727313B2 (en) * 2001-01-17 2004-04-27 3M Innovative Properties Company Polymeric compositions and articles with anisotropic light scattering and methods of making and using
US6819486B2 (en) * 2001-01-17 2004-11-16 3M Innovative Properties Company Projection screen having elongated structures
JP2002279929A (ja) * 2001-03-19 2002-09-27 Applied Materials Inc イオン注入装置の絶縁ブッシングおよびイオン注入装置
US6686676B2 (en) * 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
US6610598B2 (en) * 2001-11-14 2003-08-26 Solidlite Corporation Surface-mounted devices of light-emitting diodes with small lens
JP2003197978A (ja) * 2001-12-27 2003-07-11 Okaya Electric Ind Co Ltd 発光ダイオード
JP2003234509A (ja) * 2002-02-08 2003-08-22 Citizen Electronics Co Ltd 発光ダイオード
US6623142B1 (en) * 2002-02-15 2003-09-23 Delphi Technologies, Inc. Method and apparatus for correcting optical non-uniformities in a light emitting diode
JP2003298115A (ja) * 2002-04-05 2003-10-17 Citizen Electronics Co Ltd 発光ダイオード
US6991695B2 (en) * 2002-05-21 2006-01-31 3M Innovative Properties Company Method for subdividing multilayer optical film cleanly and rapidly
US6755878B2 (en) * 2002-08-02 2004-06-29 3M Innovative Properties Company Abrasive articles and methods of making and using the same
JP4201167B2 (ja) * 2002-09-26 2008-12-24 シチズン電子株式会社 白色発光装置の製造方法
JP4280050B2 (ja) * 2002-10-07 2009-06-17 シチズン電子株式会社 白色発光装置
JP5138145B2 (ja) * 2002-11-12 2013-02-06 日亜化学工業株式会社 蛍光体積層構造及びそれを用いる光源
US20040159900A1 (en) * 2003-01-27 2004-08-19 3M Innovative Properties Company Phosphor based light sources having front illumination
US20040145289A1 (en) * 2003-01-27 2004-07-29 3M Innovative Properties Company Phosphor based light sources having a non-planar short pass reflector and method of making
US7927703B2 (en) * 2003-04-11 2011-04-19 3M Innovative Properties Company Adhesive blends, articles, and methods
US7157745B2 (en) * 2004-04-09 2007-01-02 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
JP4491213B2 (ja) * 2003-09-29 2010-06-30 岡谷電機産業株式会社 発光ダイオード及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8481144B2 (en) 2009-10-16 2013-07-09 Wintek Corporation Complex sheet structure and cover lens assembly

Also Published As

Publication number Publication date
WO2007005417A1 (en) 2007-01-11
US20070001182A1 (en) 2007-01-04

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