TW200708725A - System for measuring heat-conducting performance of heat-conducting component and screening method thereof - Google Patents

System for measuring heat-conducting performance of heat-conducting component and screening method thereof

Info

Publication number
TW200708725A
TW200708725A TW094128929A TW94128929A TW200708725A TW 200708725 A TW200708725 A TW 200708725A TW 094128929 A TW094128929 A TW 094128929A TW 94128929 A TW94128929 A TW 94128929A TW 200708725 A TW200708725 A TW 200708725A
Authority
TW
Taiwan
Prior art keywords
heat
conducting
performance
conducting component
component
Prior art date
Application number
TW094128929A
Other languages
English (en)
Other versions
TWI277727B (en
Inventor
Ke-Chin Lee
Chen-Chuan Lin
Chi-Te Chin
Li-Kai Wu
Original Assignee
Yeh Chiang Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yeh Chiang Technology Corp filed Critical Yeh Chiang Technology Corp
Priority to TW094128929A priority Critical patent/TWI277727B/zh
Priority to US11/317,120 priority patent/US7581878B2/en
Publication of TW200708725A publication Critical patent/TW200708725A/zh
Application granted granted Critical
Publication of TWI277727B publication Critical patent/TWI277727B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
TW094128929A 2005-08-24 2005-08-24 Measuring system for heat conductance performance of heat conductance device TWI277727B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094128929A TWI277727B (en) 2005-08-24 2005-08-24 Measuring system for heat conductance performance of heat conductance device
US11/317,120 US7581878B2 (en) 2005-08-24 2005-12-22 Measuring system and screening method for thermal conductive efficiencies of thermal conductive devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094128929A TWI277727B (en) 2005-08-24 2005-08-24 Measuring system for heat conductance performance of heat conductance device

Publications (2)

Publication Number Publication Date
TW200708725A true TW200708725A (en) 2007-03-01
TWI277727B TWI277727B (en) 2007-04-01

Family

ID=37804031

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128929A TWI277727B (en) 2005-08-24 2005-08-24 Measuring system for heat conductance performance of heat conductance device

Country Status (2)

Country Link
US (1) US7581878B2 (zh)
TW (1) TWI277727B (zh)

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CN104807851A (zh) * 2015-04-21 2015-07-29 东莞市卡尔文塑胶科技有限公司 标样导散热系数点对点检测方法及检测设备
CN107621474A (zh) * 2016-07-15 2018-01-23 神讯电脑(昆山)有限公司 热导管检测装置
CN115597744A (zh) * 2022-12-14 2023-01-13 蜂巢传动科技邳州有限公司（Cn） 温度测量方法、芯片温度检测方法、装置、设备及车辆

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JP4673647B2 (ja) * 2005-03-22 2011-04-20 出光興産株式会社 金属の表面温度測定装置
CN100498313C (zh) * 2005-05-14 2009-06-10 富准精密工业(深圳)有限公司 热导管性能检测方法及检测设备
JP2009047600A (ja) * 2007-08-21 2009-03-05 Fujitsu Ltd 温度試験装置、温度試験方法
TW200921066A (en) * 2007-11-02 2009-05-16 Foxconn Tech Co Ltd Detecting device for heat pipes
US8042993B2 (en) * 2007-12-21 2011-10-25 GM Global Technology Operations LLC Air-cooled power electronics service algorithm
FR2925693B1 (fr) * 2007-12-21 2009-12-04 Thales Sa Procede de test de caloduc et dispositif de test correspondant.
TW200928340A (en) * 2007-12-21 2009-07-01 Foxconn Tech Co Ltd Detecting device for heat pipes
CN101498676B (zh) * 2008-01-30 2011-06-22 富准精密工业(深圳)有限公司 热管性能检测装置
CN101498677B (zh) * 2008-02-01 2011-06-22 富准精密工业(深圳)有限公司 热管性能检测装置
US7883266B2 (en) * 2008-03-24 2011-02-08 International Business Machines Corporation Method and apparatus for defect detection in a cold plate
KR20110051792A (ko) * 2009-11-11 2011-05-18 광주과학기술원 접촉열전도재 특성 측정 장치 및 방법
TW201118372A (en) * 2009-11-25 2011-06-01 Inventec Corp Method for testing heat pipe
US8985847B2 (en) 2011-11-21 2015-03-24 International Business Machines Corporation Thermal resistance-based monitoring of cooling of an electronic component
US9347898B1 (en) * 2013-08-08 2016-05-24 The United States Of America As Represented By The Secretary Of The Army Measuring thermal properties of layered structure in situ
CN103499605A (zh) * 2013-10-15 2014-01-08 太仓市计量测试检定所 管道热损智能同步测量系统
CN104330277B (zh) * 2014-11-14 2017-02-08 昆山海益博散热器有限公司 一种致冷芯片式热管性能测试设备
JP6191586B2 (ja) * 2014-12-02 2017-09-06 トヨタ自動車株式会社 モータコントローラ、電動車両、及び、スイッチング素子の熱ストレス推定方法
CN108614004B (zh) * 2016-12-09 2020-03-27 上海大学 一种冷却曲线的拟合方法和系统
CN108732204B (zh) * 2018-05-02 2020-11-27 上海工程技术大学 一种动力电池的比热容测试方法与装置
CN108693208B (zh) * 2018-06-08 2021-03-16 广东工业大学 一种新型材料换热性能测试装置
CN109799258B (zh) * 2019-03-18 2020-04-28 中认英泰检测技术有限公司 产品性能测试方法及系统
CN109839406B (zh) * 2019-03-27 2022-08-09 桂林电子科技大学 一种界面接触热阻的高精度测试方法
CN110095498B (zh) * 2019-04-10 2024-03-29 浙江华电器材检测研究所有限公司 一种检测电缆导管散热性能的方法
TWI785526B (zh) * 2021-03-11 2022-12-01 長聖儀器股份有限公司 均溫板測量系統與方法
CN113740378A (zh) * 2021-09-15 2021-12-03 山东多星电器有限公司 一种电热管热能转换效率测试方法
CN115184404B (zh) * 2022-09-08 2022-12-02 合肥司南金属材料有限公司 一种钼铜合金导热性能测试装置
CN115524362B (zh) * 2022-11-29 2023-03-10 中国科学院合肥物质科学研究院 一种高温热管传热能力测试装置

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US20060045165A1 (en) * 2004-08-30 2006-03-02 Chan Gary K Thermal interface material characterization system and method
CN100498313C (zh) * 2005-05-14 2009-06-10 富准精密工业(深圳)有限公司 热导管性能检测方法及检测设备
CN100552444C (zh) * 2005-08-19 2009-10-21 富准精密工业(深圳)有限公司 热源模拟装置
JP4812017B2 (ja) * 2006-07-26 2011-11-09 エスアイアイ・ナノテクノロジー株式会社 熱分析装置及びその乾燥方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104807851A (zh) * 2015-04-21 2015-07-29 东莞市卡尔文塑胶科技有限公司 标样导散热系数点对点检测方法及检测设备
CN107621474A (zh) * 2016-07-15 2018-01-23 神讯电脑(昆山)有限公司 热导管检测装置
CN107621474B (zh) * 2016-07-15 2020-09-25 神讯电脑(昆山)有限公司 热导管检测装置
CN115597744A (zh) * 2022-12-14 2023-01-13 蜂巢传动科技邳州有限公司（Cn） 温度测量方法、芯片温度检测方法、装置、设备及车辆
CN115597744B (zh) * 2022-12-14 2023-03-14 蜂巢传动科技邳州有限公司 温度测量方法、芯片温度检测方法、装置、设备及车辆

Also Published As

Publication number Publication date
TWI277727B (en) 2007-04-01
US7581878B2 (en) 2009-09-01
US20070047614A1 (en) 2007-03-01

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