TW200707095A - Photoresist composition, method for forming film pattern using the same, and method for manufacturing thin film transistor array panel using the same - Google Patents
Photoresist composition, method for forming film pattern using the same, and method for manufacturing thin film transistor array panel using the sameInfo
- Publication number
- TW200707095A TW200707095A TW095124831A TW95124831A TW200707095A TW 200707095 A TW200707095 A TW 200707095A TW 095124831 A TW095124831 A TW 095124831A TW 95124831 A TW95124831 A TW 95124831A TW 200707095 A TW200707095 A TW 200707095A
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- photoresist composition
- thin film
- film transistor
- transistor array
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Thin Film Transistor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050061606A KR101240643B1 (ko) | 2005-07-08 | 2005-07-08 | 포토레지스트 조성물, 상기 포토레지스트 조성물을 이용한 패턴의 형성 방법 및 이를 이용한 박막 트랜지스터표시판의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200707095A true TW200707095A (en) | 2007-02-16 |
TWI395056B TWI395056B (zh) | 2013-05-01 |
Family
ID=37597413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095124831A TWI395056B (zh) | 2005-07-08 | 2006-07-07 | 光阻組成物,使用該光阻組成物形成薄膜圖案之方法以及使用該光阻組成物製造薄膜電晶體陣列面板之方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7291439B2 (zh) |
JP (1) | JP4996886B2 (zh) |
KR (1) | KR101240643B1 (zh) |
CN (1) | CN1892426B (zh) |
TW (1) | TWI395056B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI465842B (zh) * | 2008-03-04 | 2014-12-21 | Dongjin Semichem Co Ltd | 光阻組成物以及使用該組成物製造陣列基材之方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100495454B1 (ko) * | 2002-03-27 | 2005-06-14 | 주식회사 코리아나화장품 | 피토라이트를 포함하는 미백 화장료 조성물 |
KR101157148B1 (ko) * | 2005-08-08 | 2012-06-22 | 삼성전자주식회사 | 반도체 장치의 제조방법 |
KR101298940B1 (ko) * | 2005-08-23 | 2013-08-22 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 및 이를 이용한 박막 트랜지스터기판의 제조방법 |
KR101268424B1 (ko) * | 2005-10-31 | 2013-05-28 | 에이지이엠코리아 주식회사 | 포토레지스트 조성물 및 이를 이용한 박막 트랜지스터기판의 제조방법 |
JP2007142388A (ja) * | 2005-11-17 | 2007-06-07 | Samsung Electronics Co Ltd | 薄膜トランジスタ表示板及びその製造方法 |
KR101293155B1 (ko) * | 2006-02-01 | 2013-08-12 | 주식회사 동진쎄미켐 | 패턴 형성용 포토레지스트 조성물 및 이를 이용한 표시장치 패턴 형성 방법 |
KR101392291B1 (ko) * | 2007-04-13 | 2014-05-07 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 및 이를 이용한 박막트랜지스터기판의 제조방법 |
JP5155389B2 (ja) * | 2008-04-10 | 2013-03-06 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及びそれを用いた感光性樹脂積層体 |
US8623231B2 (en) * | 2008-06-11 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for etching an ultra thin film |
KR101632965B1 (ko) * | 2008-12-29 | 2016-06-24 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 박막 트랜지스터 기판의 제조 방법 |
KR20130017615A (ko) * | 2011-08-11 | 2013-02-20 | 삼성디스플레이 주식회사 | 포토레지스트 조성물, 이를 이용한 패턴의 형성 방법 및 표시 기판의 제조 방법 |
CN102610564B (zh) * | 2012-02-07 | 2014-06-25 | 深圳市华星光电技术有限公司 | Tft阵列基板的制作方法 |
JP2022038484A (ja) * | 2020-08-26 | 2022-03-10 | 東京応化工業株式会社 | エッチング方法、及び感光性樹脂組成物 |
Family Cites Families (25)
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JPS5731179A (en) * | 1980-07-31 | 1982-02-19 | Sharp Corp | Formation of thin-film transistor |
JP3052330B2 (ja) * | 1990-04-17 | 2000-06-12 | ジェイエスアール株式会社 | 半導体製造用感放射線性樹脂組成物 |
JP3466218B2 (ja) * | 1992-06-04 | 2003-11-10 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
KR950004908B1 (ko) * | 1992-09-09 | 1995-05-15 | 삼성전자주식회사 | 포토 레지스트 조성물 및 이를 이용한 패턴형성방법 |
KR100334484B1 (ko) * | 1994-12-28 | 2002-12-06 | 제온 코포레이션 | 포지티브형레지스트조성물 |
JP3209058B2 (ja) * | 1995-10-18 | 2001-09-17 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
KR100209425B1 (ko) | 1996-10-29 | 1999-07-15 | 전주범 | 오버행 구조 형성 방법 |
JP3105459B2 (ja) * | 1996-10-31 | 2000-10-30 | 東京応化工業株式会社 | ポジ型ホトレジスト組成物およびこれを用いた多層レジスト材料 |
US6177226B1 (en) * | 1997-05-01 | 2001-01-23 | Tokyo Ohka Kogyo Co., Ltd. | Positive photoresist composition and process for forming contact hole |
KR100237684B1 (ko) | 1997-01-28 | 2000-01-15 | 윤종용 | 박막 트랜지스터 기판 및 그 제조 방법 |
JPH10221846A (ja) * | 1997-01-31 | 1998-08-21 | Shin Etsu Chem Co Ltd | 感光剤の製造方法およびこの感光剤を含有するポジ型フォトレジスト組成物 |
JPH1115151A (ja) * | 1997-05-01 | 1999-01-22 | Tokyo Ohka Kogyo Co Ltd | コンタクトホール形成用ポジ型ホトレジスト組成物およびコンタクトホールの形成方法 |
JP3600713B2 (ja) * | 1997-08-06 | 2004-12-15 | 東京応化工業株式会社 | ポジ型ホトレジスト組成物 |
KR100341122B1 (ko) | 1998-12-29 | 2002-10-25 | 주식회사 현대 디스플레이 테크놀로지 | 박막트랜지스터의게이트전극형성방법 |
US6461886B1 (en) | 2000-05-13 | 2002-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
JP3616584B2 (ja) * | 2000-06-12 | 2005-02-02 | 鹿児島日本電気株式会社 | パターン形成方法及びそれを用いた表示装置の製造方法 |
TW511147B (en) * | 2000-06-12 | 2002-11-21 | Nec Corp | Pattern formation method and method of manufacturing display using it |
JP3507771B2 (ja) * | 2000-07-03 | 2004-03-15 | 鹿児島日本電気株式会社 | パターン形成方法及び薄膜トランジスタの製造方法 |
KR100704510B1 (ko) | 2001-02-12 | 2007-04-09 | 엘지.필립스 엘시디 주식회사 | 횡전계형 액정표시장치용 하부 기판 및 그의 제조방법 |
KR100769162B1 (ko) | 2001-03-07 | 2007-10-23 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 및 그 제조방법 |
JP4673513B2 (ja) * | 2001-08-01 | 2011-04-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR100816342B1 (ko) * | 2001-10-19 | 2008-03-24 | 삼성전자주식회사 | 고내열성 포토레지스트 조성물 |
JP3875544B2 (ja) | 2001-11-29 | 2007-01-31 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 液晶表示装置の製造方法及び液晶表示装置 |
JP2004177683A (ja) | 2002-11-27 | 2004-06-24 | Clariant (Japan) Kk | 超高耐熱ポジ型感光性組成物を用いたパターン形成方法 |
JP2005049667A (ja) | 2003-07-30 | 2005-02-24 | Quanta Display Japan Inc | 液晶表示装置とその製造方法 |
-
2005
- 2005-07-08 KR KR1020050061606A patent/KR101240643B1/ko active IP Right Grant
-
2006
- 2006-07-07 US US11/483,794 patent/US7291439B2/en active Active
- 2006-07-07 TW TW095124831A patent/TWI395056B/zh active
- 2006-07-10 CN CN2006100987396A patent/CN1892426B/zh not_active Expired - Fee Related
- 2006-07-10 JP JP2006189573A patent/JP4996886B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI465842B (zh) * | 2008-03-04 | 2014-12-21 | Dongjin Semichem Co Ltd | 光阻組成物以及使用該組成物製造陣列基材之方法 |
Also Published As
Publication number | Publication date |
---|---|
US7291439B2 (en) | 2007-11-06 |
JP2007017987A (ja) | 2007-01-25 |
US20070009833A1 (en) | 2007-01-11 |
KR20070006346A (ko) | 2007-01-11 |
KR101240643B1 (ko) | 2013-03-08 |
JP4996886B2 (ja) | 2012-08-08 |
TWI395056B (zh) | 2013-05-01 |
CN1892426B (zh) | 2011-12-21 |
CN1892426A (zh) | 2007-01-10 |
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