TW200702690A - Methods and apparatus for unpowered testing of open connections on power and ground nodes of circuit devices - Google Patents

Methods and apparatus for unpowered testing of open connections on power and ground nodes of circuit devices

Info

Publication number
TW200702690A
TW200702690A TW095109646A TW95109646A TW200702690A TW 200702690 A TW200702690 A TW 200702690A TW 095109646 A TW095109646 A TW 095109646A TW 95109646 A TW95109646 A TW 95109646A TW 200702690 A TW200702690 A TW 200702690A
Authority
TW
Taiwan
Prior art keywords
node
signal
grounded
unpowered
testing
Prior art date
Application number
TW095109646A
Other languages
English (en)
Inventor
Kenneth P Parker
Chris R Jacobsen
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200702690A publication Critical patent/TW200702690A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
TW095109646A 2005-07-12 2006-03-21 Methods and apparatus for unpowered testing of open connections on power and ground nodes of circuit devices TW200702690A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/179,978 US7307426B2 (en) 2005-07-12 2005-07-12 Methods and apparatus for unpowered testing of open connections on power and ground nodes of circuit devices

Publications (1)

Publication Number Publication Date
TW200702690A true TW200702690A (en) 2007-01-16

Family

ID=37609312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109646A TW200702690A (en) 2005-07-12 2006-03-21 Methods and apparatus for unpowered testing of open connections on power and ground nodes of circuit devices

Country Status (4)

Country Link
US (1) US7307426B2 (zh)
CN (1) CN100523844C (zh)
SG (1) SG129344A1 (zh)
TW (1) TW200702690A (zh)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN103792429A (zh) * 2012-11-05 2014-05-14 华邦电子股份有限公司 测试系统
TWI449933B (zh) * 2012-10-16 2014-08-21 Winbond Electronics Corp 晶片之測試系統

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US20080246491A1 (en) * 2007-04-06 2008-10-09 Texas Instruments Incorporated Scalable method for identifying cracks and fractures under wired or ball bonded bond pads
GB0709893D0 (en) * 2007-05-23 2007-07-04 Onzo Ltd Apparatus for monitoring rescue consumption
DE102008030545A1 (de) * 2008-06-27 2010-01-07 Siemens Aktiengesellschaft Vorrichtung und Verfahren zur berührungslosen Ankontaktierung von leitfähigen Strukturen, insbesondere von Dünnschicht-Transistor-Flüssigkristallanzeigen (Thin Film Transistor Liquid Crystal Displays)
EP2344897B1 (en) * 2008-11-14 2015-06-17 Teradyne, Inc. Method and apparatus for testing electrical connections on a printed circuit board
US8760183B2 (en) * 2008-11-14 2014-06-24 Teradyne, Inc. Fast open circuit detection for open power and ground pins
US7868608B2 (en) 2009-04-08 2011-01-11 International Business Machines Corporation Detecting open ground connections in surface mount connectors
JP5206571B2 (ja) * 2009-04-22 2013-06-12 富士通セミコンダクター株式会社 グランドオープン検出回路を有する集積回路装置
US8648616B2 (en) 2009-12-22 2014-02-11 Ltx-Credence Corporation Loaded printed circuit board test fixture and method for manufacturing the same
US8933722B2 (en) 2011-08-31 2015-01-13 Infineon Technologies Ag Measuring device and a method for measuring a chip-to-chip-carrier connection
US8896320B2 (en) * 2011-08-31 2014-11-25 Infineon Technologies Ag Measuring device and a method for measuring a chip-to-chip-carrier connection
US9250293B2 (en) 2012-07-09 2016-02-02 Infineon Technologies Ag Capacitive test device and method for capacitive testing a component
WO2017091591A1 (en) * 2015-11-25 2017-06-01 Formfactor, Inc. Floating nest for a test socket
CN107782944A (zh) * 2017-09-26 2018-03-09 信利光电股份有限公司 一种万用表和检测线路开路位置的设备及方法

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US5498694A (en) * 1989-05-25 1996-03-12 La Jolla Cancer Research Foundation Peptides of the cytoplasmic domain of integrin
US5557209A (en) * 1990-12-20 1996-09-17 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5125660A (en) 1991-11-22 1992-06-30 Frederick Stahl Six-sided game dice with playing card indicia
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
US5420500A (en) * 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies
US5391993A (en) * 1994-01-27 1995-02-21 Genrad, Inc. Capacitive open-circuit test employing threshold determination
JP4450143B2 (ja) * 2001-05-24 2010-04-14 オー・エイチ・ティー株式会社 回路パターン検査装置並びに回路パターン検査方法及び記録媒体
US6734683B2 (en) * 2001-09-27 2004-05-11 Intel Corporation Method and apparatus for in-circuit testing of sockets
US6960917B2 (en) * 2003-11-06 2005-11-01 Agilent Technologies, Inc. Methods and apparatus for diagnosing defect locations in electrical paths of connectors of circuit assemblies
US7057395B1 (en) * 2005-03-04 2006-06-06 Agilent Technologies, Inc. Method for diagnosing open defects on non-contacted nodes of an electronic device from measurements of capacitively coupled nodes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449933B (zh) * 2012-10-16 2014-08-21 Winbond Electronics Corp 晶片之測試系統
CN103792429A (zh) * 2012-11-05 2014-05-14 华邦电子股份有限公司 测试系统
CN103792429B (zh) * 2012-11-05 2016-08-10 华邦电子股份有限公司 测试系统

Also Published As

Publication number Publication date
CN1896754A (zh) 2007-01-17
CN100523844C (zh) 2009-08-05
US20070013383A1 (en) 2007-01-18
US7307426B2 (en) 2007-12-11
SG129344A1 (en) 2007-02-26

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