TW200701333A - Substrate processing apparatus and substrate processing method - Google Patents
Substrate processing apparatus and substrate processing methodInfo
- Publication number
- TW200701333A TW200701333A TW095108998A TW95108998A TW200701333A TW 200701333 A TW200701333 A TW 200701333A TW 095108998 A TW095108998 A TW 095108998A TW 95108998 A TW95108998 A TW 95108998A TW 200701333 A TW200701333 A TW 200701333A
- Authority
- TW
- Taiwan
- Prior art keywords
- displacement
- change
- vacuum pressure
- substrate
- substrate processing
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C27/00—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas
- A47C27/14—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas with foamed material inlays
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G27/00—Floor fabrics; Fastenings therefor
- A47G27/02—Carpets; Stair runners; Bedside rugs; Foot mats
Abstract
If change arises to the vacuum pressure of the vacuum mechanism in which it is used in order to stabilize surfacing power, the control circuit of a nozzle height position compensation part detects change of the vacuum pressure through a pressure sensor, the control signal which has the fixed response characteristic to change of such vacuum pressure is generated, and drive control of piezo-electric actuator is carried out, and variable control of the height position of a resist nozzle is carried out by the displacement generated from piezo-electric actuator. When the surfacing height of the substrate G is displaced upwards rather than the setting surfacing height Hb according to change of the vacuum pressure of a vacuum mechanism, the displacement of the resist nozzle 78 is carried out the almost same displacement at the same timing as the displacement of the substrate G, and the gap S of the resist nozzle 78 and Substrate G is kept consequent to a setting value.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005076879A JP4429943B2 (en) | 2005-03-17 | 2005-03-17 | Substrate processing apparatus and substrate processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200701333A true TW200701333A (en) | 2007-01-01 |
TWI305933B TWI305933B (en) | 2009-02-01 |
Family
ID=37100296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095108998A TWI305933B (en) | 2005-03-17 | 2006-03-16 | Substrate processing apparatus and substrate processing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4429943B2 (en) |
KR (1) | KR101061615B1 (en) |
TW (1) | TWI305933B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI412407B (en) * | 2008-02-12 | 2013-10-21 | Koyo Thermo Sys Co Ltd | Reduced pressure drying apparatus |
TWI459495B (en) * | 2010-07-14 | 2014-11-01 | Dainippon Screen Mfg | Substrate processing apparatus, and substrate transport method |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4407970B2 (en) * | 2006-11-28 | 2010-02-03 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
KR100834145B1 (en) | 2006-12-27 | 2008-06-02 | 세메스 주식회사 | Apparatus for coating photoresist including a weight supporter |
JP5188759B2 (en) * | 2007-08-07 | 2013-04-24 | 東京応化工業株式会社 | Coating apparatus and coating method |
JP4942589B2 (en) * | 2007-08-30 | 2012-05-30 | 東京応化工業株式会社 | Coating apparatus and coating method |
JP5029486B2 (en) | 2008-05-13 | 2012-09-19 | 東京エレクトロン株式会社 | Coating apparatus, coating method, and storage medium |
JP5012651B2 (en) | 2008-05-14 | 2012-08-29 | 東京エレクトロン株式会社 | Coating device, coating method, coating, developing device and storage medium |
KR101071583B1 (en) | 2009-08-21 | 2011-10-10 | 주식회사 케이씨텍 | Inline type substrate coater apparatus |
JP5081261B2 (en) * | 2010-02-24 | 2012-11-28 | 東京エレクトロン株式会社 | Coating device |
KR101543882B1 (en) * | 2013-12-17 | 2015-08-11 | 세메스 주식회사 | Apparatus for transferring substrate and apparatus for inspecting substrate including the same |
JP6518891B2 (en) * | 2014-08-01 | 2019-05-29 | 株式会社ブイ・テクノロジー | Transport device |
JP6595276B2 (en) * | 2015-09-18 | 2019-10-23 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
JP6890438B2 (en) * | 2017-03-03 | 2021-06-18 | 株式会社Screenホールディングス | Floating amount calculation device, coating device and coating method |
CN108620288B (en) * | 2017-03-22 | 2020-02-14 | 深圳市腾盛精密装备股份有限公司 | Glue dispensing height compensation method and device |
CN113955485B (en) * | 2021-10-25 | 2023-05-23 | 博众精工科技股份有限公司 | Product circle pasting device and product circle pasting method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004294926A (en) | 2003-03-27 | 2004-10-21 | Kyocera Corp | Apparatus and method for rubbing alignment film |
JP2004345814A (en) | 2003-05-23 | 2004-12-09 | Murata Mach Ltd | Floatation transport device |
-
2005
- 2005-03-17 JP JP2005076879A patent/JP4429943B2/en not_active Expired - Fee Related
-
2006
- 2006-03-16 TW TW095108998A patent/TWI305933B/en not_active IP Right Cessation
- 2006-03-16 KR KR1020060024236A patent/KR101061615B1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI412407B (en) * | 2008-02-12 | 2013-10-21 | Koyo Thermo Sys Co Ltd | Reduced pressure drying apparatus |
TWI459495B (en) * | 2010-07-14 | 2014-11-01 | Dainippon Screen Mfg | Substrate processing apparatus, and substrate transport method |
Also Published As
Publication number | Publication date |
---|---|
TWI305933B (en) | 2009-02-01 |
JP2006261394A (en) | 2006-09-28 |
JP4429943B2 (en) | 2010-03-10 |
KR20060101311A (en) | 2006-09-22 |
KR101061615B1 (en) | 2011-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |