TW200700898A - Pattern forming method, manufacturing method of photomask, manufacturing method of semiconductor device and program - Google Patents

Pattern forming method, manufacturing method of photomask, manufacturing method of semiconductor device and program

Info

Publication number
TW200700898A
TW200700898A TW095102074A TW95102074A TW200700898A TW 200700898 A TW200700898 A TW 200700898A TW 095102074 A TW095102074 A TW 095102074A TW 95102074 A TW95102074 A TW 95102074A TW 200700898 A TW200700898 A TW 200700898A
Authority
TW
Taiwan
Prior art keywords
pattern
region
manufacturing
substrate
exposure dose
Prior art date
Application number
TW095102074A
Other languages
English (en)
Chinese (zh)
Other versions
TWI304916B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Hideaki Sakurai
Tooru Shibata
Masato Saito
Masamitsu Itoh
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200700898A publication Critical patent/TW200700898A/zh
Application granted granted Critical
Publication of TWI304916B publication Critical patent/TWI304916B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143—Electron beam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
TW095102074A 2005-01-31 2006-01-19 Pattern forming method, manufacturing method of photomask, manufacturing method of semiconductor device and program TW200700898A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005024142A JP4834310B2 (ja) 2005-01-31 2005-01-31 パターン形成方法、フォトマスクの製造方法、半導体装置の製造方法およびプログラム

Publications (2)

Publication Number Publication Date
TW200700898A true TW200700898A (en) 2007-01-01
TWI304916B TWI304916B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2009-01-01

Family

ID=36756965

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102074A TW200700898A (en) 2005-01-31 2006-01-19 Pattern forming method, manufacturing method of photomask, manufacturing method of semiconductor device and program

Country Status (3)

Country Link
US (1) US7608368B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP4834310B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW200700898A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479280B (zh) * 2010-05-06 2015-04-01 Tokyo Electron Ltd A substrate processing apparatus and a liquid medicine supply method

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5034410B2 (ja) * 2006-09-25 2012-09-26 凸版印刷株式会社 現像ローディング測定方法および現像ローディング測定基板
JP5079408B2 (ja) * 2007-07-02 2012-11-21 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP2009295840A (ja) * 2008-06-06 2009-12-17 Toshiba Corp 基板処理方法及びマスク製造方法
EP2960059B1 (en) 2014-06-25 2018-10-24 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US11220737B2 (en) 2014-06-25 2022-01-11 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US11267012B2 (en) * 2014-06-25 2022-03-08 Universal Display Corporation Spatial control of vapor condensation using convection
CN105116694B (zh) * 2015-09-25 2017-12-22 京东方科技集团股份有限公司 一种掩膜版、曝光装置及曝光方法
US10566534B2 (en) 2015-10-12 2020-02-18 Universal Display Corporation Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP)
CN114077153B (zh) * 2021-11-19 2025-06-20 泉意光罩光电科技(济南)有限公司 一种芯片的制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642234A (en) * 1979-09-14 1981-04-20 Dainippon Printing Co Ltd Photomask preparation
JPH09199391A (ja) * 1996-01-16 1997-07-31 Fujitsu Ltd 電子ビーム露光方法
JP3817107B2 (ja) * 2000-03-07 2006-08-30 三菱電機株式会社 半導体装置の製造装置、液晶表示装置の製造装置、半導体装置の製造方法、液晶表示装置の製造方法
JP4189141B2 (ja) * 2000-12-21 2008-12-03 株式会社東芝 基板処理装置及びこれを用いた基板処理方法
JP4098502B2 (ja) * 2001-07-30 2008-06-11 株式会社東芝 マスクの製造方法とｌｓｉの製造方法
KR100429879B1 (ko) * 2001-09-19 2004-05-03 삼성전자주식회사 포토마스크 제조시 현상 단계에서 발생하는 선폭 변화를보정하여 노광하는 방법 및 이를 기록한 기록매체
JP4005879B2 (ja) * 2002-08-30 2007-11-14 株式会社東芝 現像方法、基板処理方法、及び基板処理装置
JP4543614B2 (ja) * 2003-03-18 2010-09-15 凸版印刷株式会社 フォトマスクの製造方法および半導体集積回路の製造方法
US7354869B2 (en) * 2004-04-13 2008-04-08 Kabushiki Kaisha Toshiba Substrate processing method, substrate processing apparatus, and semiconductor device manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479280B (zh) * 2010-05-06 2015-04-01 Tokyo Electron Ltd A substrate processing apparatus and a liquid medicine supply method

Also Published As

Publication number Publication date
US20060172205A1 (en) 2006-08-03
TWI304916B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2009-01-01
US7608368B2 (en) 2009-10-27
JP4834310B2 (ja) 2011-12-14
JP2006210840A (ja) 2006-08-10

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