TW200643616A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200643616A
TW200643616A TW095115730A TW95115730A TW200643616A TW 200643616 A TW200643616 A TW 200643616A TW 095115730 A TW095115730 A TW 095115730A TW 95115730 A TW95115730 A TW 95115730A TW 200643616 A TW200643616 A TW 200643616A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
lcd
production
imidazole dimer
Prior art date
Application number
TW095115730A
Other languages
Chinese (zh)
Inventor
Chan-Seok Park
Bong-Gi Kim
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200643616A publication Critical patent/TW200643616A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

To provide a photosensitive resin composition in which the absorption region of an imidazole dimer photoinitiator is shifted to ≥ 410 nm, so that the composition exhibits uniform photosensitivity even to laser exposure at 355-405 nm and can form a pattern of a uniform line width, regardless of illuminance variation of a semiconductor laser light source, and which is developable with an alkaline aqueous solution and excels in resolution, adhesion to a substrate and storage stability. The photosensitive resin composition contains the imidazole dimer photoinitiator, an acridine or xanthin auxiliary initiator and a triarylmethane photosensitizer. The photosensitive resin composition can be used in a process of producing the LCD of a mobile-phone, a notebook computer, a monitor, TV or the like and can be used in production of any LCD such as a transmissive, reflective or semi-transparent LCD irrespectively of a system such as a TFT or STN system. The photosensitive resin composition can be used in all of semiconductor processes as well as in the production of the liquid crystal display.
TW095115730A 2005-05-03 2006-05-03 Photosensitive resin composition TW200643616A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20050037024 2005-05-03

Publications (1)

Publication Number Publication Date
TW200643616A true TW200643616A (en) 2006-12-16

Family

ID=37534842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115730A TW200643616A (en) 2005-05-03 2006-05-03 Photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP4874707B2 (en)
KR (1) KR100858254B1 (en)
TW (1) TW200643616A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931533B2 (en) * 2005-09-28 2012-05-16 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and laminate thereof
CN101558356B (en) * 2006-12-19 2013-09-25 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board
US8778575B2 (en) 2007-01-15 2014-07-15 Fujifilm Corporation Curable composition, color filter using the same and manufacturing method therefor, and solid image pickup element
JP5178081B2 (en) * 2007-01-15 2013-04-10 富士フイルム株式会社 Curable composition for forming color filter, color filter using the same, method for producing the same, and solid-state imaging device
JP5200591B2 (en) * 2007-03-14 2013-06-05 東レ株式会社 Photosensitive paste
JP5293934B2 (en) * 2007-06-13 2013-09-18 Ｊｓｒ株式会社 Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display element
JP5266958B2 (en) * 2008-08-22 2013-08-21 凸版印刷株式会社 Color filter for liquid crystal display
JP2010197831A (en) * 2009-02-26 2010-09-09 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the composition, method for forming resist pattern and method for manufacturing printed wiring board
JPWO2021065322A1 (en) * 2019-09-30 2021-04-08
CN112835261B (en) * 2019-11-25 2022-06-07 常州强力电子新材料股份有限公司 EO/PO modified 9-phenylacridine photosensitizer and application thereof
CN112433445B (en) * 2020-11-06 2023-12-26 福斯特(安吉)新材料有限公司 Photosensitive resin composition for UV LED light source marking and dry film resist

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3445234A (en) * 1962-10-31 1969-05-20 Du Pont Leuco dye/hexaarylbiimidazole imageforming composition
US3479185A (en) * 1965-06-03 1969-11-18 Du Pont Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers
JPH0728231A (en) * 1993-07-14 1995-01-31 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive film using the same
JPH10161309A (en) * 1996-11-26 1998-06-19 Fuji Photo Film Co Ltd Photosensitive resin composition, photosensitive sheet and production of metallic circuit board
CA2252240C (en) * 1997-12-01 2002-02-26 Daniel E. Lundy Photoimageable compositions
JPH11167203A (en) * 1997-12-01 1999-06-22 Nichigoo Mooton Kk Photosensitive resin composition and photosensitive element using same
JPH11209613A (en) 1998-01-30 1999-08-03 Hitachi Chem Co Ltd Photosensitive polyimide precursor composition and production of pattern by using same
JP3967825B2 (en) * 1998-05-08 2007-08-29 日本合成化学工業株式会社 Photosensitive resin composition
JP2000019727A (en) 1998-06-30 2000-01-21 Hitachi Chemical Dupont Microsystems Ltd Photosensitive polyimide precursor composition and manufacture of pattern using it
JP2001125266A (en) 1999-10-29 2001-05-11 Hitachi Chemical Dupont Microsystems Ltd Photosensitive resin composition, method for producing pattern and electronic parts
TWI255393B (en) * 2000-03-21 2006-05-21 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the same, process for producing resist pattern and process for producing printed wiring board
JP4609824B2 (en) * 2001-07-02 2011-01-12 太陽ホールディングス株式会社 Photosensitive resin composition
JP2003091067A (en) 2002-06-17 2003-03-28 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the same
JP4581387B2 (en) * 2003-02-21 2010-11-17 三菱化学株式会社 Photosensitive resin composition, and photosensitive image forming material and photosensitive image forming material using the same
KR100903356B1 (en) * 2003-05-07 2009-06-23 주식회사 동진쎄미켐 Photosensitive resin composition and dry film resist using the same
JP2005070767A (en) * 2003-08-04 2005-03-17 Fuji Photo Film Co Ltd Photosensitive transfer sheet
JP4546276B2 (en) * 2005-02-09 2010-09-15 富士フイルム株式会社 Pattern forming material, pattern forming apparatus and pattern forming method

Also Published As

Publication number Publication date
JP4874707B2 (en) 2012-02-15
JP2006313348A (en) 2006-11-16
KR100858254B1 (en) 2008-09-11
KR20060115344A (en) 2006-11-08

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