TW200642014A - Wafer structure having bumps made of different material and fabricating method thereof - Google Patents

Wafer structure having bumps made of different material and fabricating method thereof

Info

Publication number
TW200642014A
TW200642014A TW094116978A TW94116978A TW200642014A TW 200642014 A TW200642014 A TW 200642014A TW 094116978 A TW094116978 A TW 094116978A TW 94116978 A TW94116978 A TW 94116978A TW 200642014 A TW200642014 A TW 200642014A
Authority
TW
Taiwan
Prior art keywords
several
metal layer
ubm
layers
conductors
Prior art date
Application number
TW094116978A
Other languages
Chinese (zh)
Other versions
TWI267154B (en
Inventor
Mon-Chin Tsai
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094116978A priority Critical patent/TWI267154B/en
Application granted granted Critical
Publication of TWI267154B publication Critical patent/TWI267154B/en
Publication of TW200642014A publication Critical patent/TW200642014A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

A method of manufacturing bumps includes steps stated below. First, a substrate of which active surface having several pads is provided. Then, a metal layer and several first under bump metallurgy (UBM) layers are formed on the active surface, and the first and the second portions of pads are relatively covered by the metal layer and first UBM layers Next, several first conductors are printed on the first UBM layers. Then, several second conductors are electroplated on the metal layer, and located relatively to the second portion of pads. Then, the first and second conductors are reflowed to form the first and second bumps. Finally, several second under bump metallurgy (UBM) layers are formed by selectively removing the metal layer.
TW094116978A 2005-05-24 2005-05-24 Wafer structure having bumps made of different material and fabricating method thereof TWI267154B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094116978A TWI267154B (en) 2005-05-24 2005-05-24 Wafer structure having bumps made of different material and fabricating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094116978A TWI267154B (en) 2005-05-24 2005-05-24 Wafer structure having bumps made of different material and fabricating method thereof

Publications (2)

Publication Number Publication Date
TWI267154B TWI267154B (en) 2006-11-21
TW200642014A true TW200642014A (en) 2006-12-01

Family

ID=38191767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116978A TWI267154B (en) 2005-05-24 2005-05-24 Wafer structure having bumps made of different material and fabricating method thereof

Country Status (1)

Country Link
TW (1) TWI267154B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498968B (en) * 2010-05-06 2015-09-01 Ineffable Cellular Ltd Liability Company Semiconductor process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498968B (en) * 2010-05-06 2015-09-01 Ineffable Cellular Ltd Liability Company Semiconductor process

Also Published As

Publication number Publication date
TWI267154B (en) 2006-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees