TW200633088A - Solder bump manufacturing method of avoiding wafer warpage - Google Patents

Solder bump manufacturing method of avoiding wafer warpage

Info

Publication number
TW200633088A
TW200633088A TW094106733A TW94106733A TW200633088A TW 200633088 A TW200633088 A TW 200633088A TW 094106733 A TW094106733 A TW 094106733A TW 94106733 A TW94106733 A TW 94106733A TW 200633088 A TW200633088 A TW 200633088A
Authority
TW
Taiwan
Prior art keywords
layer
bonding pads
wafer
several
solder bump
Prior art date
Application number
TW094106733A
Other languages
Chinese (zh)
Other versions
TWI259545B (en
Inventor
Jiunn Chen
Chi-Long Tsai
Min-Lung Huang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094106733A priority Critical patent/TWI259545B/en
Application granted granted Critical
Publication of TWI259545B publication Critical patent/TWI259545B/en
Publication of TW200633088A publication Critical patent/TW200633088A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

A solder bump manufacturing method of avoiding wafer warpage. A wafer having upper and lower surfaces is first provided, and several bonding pads are formed on the upper surface of the wafer. Then, a passivation layer covers the upper surface and several bonding pads but exposes the surfaces of the bonding pads. After that, an under-bump metallic layer is formed on the passivation layer and the exposed surfaces of the bonding pads. A photo resist layer having several openings is disposed on theunder-bump metallic layer. Subsequently, a supporting layer is laminated on the lower surface of the wafer. Several solders are then filled into the openings of the photo resist layer. At last, the photo resist layer is stripped away.
TW094106733A 2005-03-04 2005-03-04 Solder bump manufacturing method of avoiding wafer warpage TWI259545B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094106733A TWI259545B (en) 2005-03-04 2005-03-04 Solder bump manufacturing method of avoiding wafer warpage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106733A TWI259545B (en) 2005-03-04 2005-03-04 Solder bump manufacturing method of avoiding wafer warpage

Publications (2)

Publication Number Publication Date
TWI259545B TWI259545B (en) 2006-08-01
TW200633088A true TW200633088A (en) 2006-09-16

Family

ID=37873446

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106733A TWI259545B (en) 2005-03-04 2005-03-04 Solder bump manufacturing method of avoiding wafer warpage

Country Status (1)

Country Link
TW (1) TWI259545B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626460B (en) 2017-10-25 2018-06-11 財團法人工業技術研究院 Method of yield prejudgment and bump re-assignment and computer readable storage medium

Also Published As

Publication number Publication date
TWI259545B (en) 2006-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees