TW200641055A - Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet - Google Patents

Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet

Info

Publication number
TW200641055A
TW200641055A TW095104939A TW95104939A TW200641055A TW 200641055 A TW200641055 A TW 200641055A TW 095104939 A TW095104939 A TW 095104939A TW 95104939 A TW95104939 A TW 95104939A TW 200641055 A TW200641055 A TW 200641055A
Authority
TW
Taiwan
Prior art keywords
addition
sensitive adhesive
pressure
curable silicone
silicone rubber
Prior art date
Application number
TW095104939A
Other languages
English (en)
Chinese (zh)
Other versions
TWI379870B (ko
Inventor
Noriyuki Meguriya
Tsutomu Nakamura
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200641055A publication Critical patent/TW200641055A/zh
Application granted granted Critical
Publication of TWI379870B publication Critical patent/TWI379870B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW095104939A 2005-02-15 2006-02-14 Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet TW200641055A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005037444A JP4525914B2 (ja) 2005-02-15 2005-02-15 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Publications (2)

Publication Number Publication Date
TW200641055A true TW200641055A (en) 2006-12-01
TWI379870B TWI379870B (ko) 2012-12-21

Family

ID=36987076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104939A TW200641055A (en) 2005-02-15 2006-02-14 Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet

Country Status (3)

Country Link
JP (1) JP4525914B2 (ko)
KR (1) KR101225391B1 (ko)
TW (1) TW200641055A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102341469A (zh) * 2009-03-04 2012-02-01 德莎欧洲公司 胶带、特别是粘合光伏层合体的胶带
CN109863207A (zh) * 2016-10-28 2019-06-07 信越化学工业株式会社 耐热性混炼型硅橡胶组合物

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839780B1 (ko) 2006-01-18 2008-06-19 주식회사 엘지화학 유연성 기판 반송용 점착제
KR100831562B1 (ko) 2006-03-23 2008-05-21 주식회사 엘지화학 유연성 기판 반송용 점착제 조성물
KR100804359B1 (ko) * 2006-12-04 2008-02-15 엘에스전선 주식회사 자동차용 고무호스
JP2008247812A (ja) * 2007-03-30 2008-10-16 Gc Corp シリコーン組成物
JP5243775B2 (ja) * 2007-11-14 2013-07-24 東海ゴム工業株式会社 誘電膜およびそれを用いたアクチュエータ、センサ、トランスデューサ
JP6024839B2 (ja) 2014-01-31 2016-11-16 信越化学工業株式会社 オルガノポリシロキサン化合物及びその製造方法並びに付加硬化型シリコーン組成物
JP6733241B2 (ja) 2016-03-18 2020-07-29 信越化学工業株式会社 付加硬化性シリコーンゴム組成物、その製造方法及び硬化物
EP3835389A4 (en) 2018-08-10 2022-05-18 Dow Toray Co., Ltd. ORGANOPOLYSILOXA COMPOSITION FOR FORMING A PSA COATING AND USE THEREOF
JP7046197B2 (ja) 2018-08-10 2022-04-01 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
CN112654687B (zh) 2018-08-10 2023-08-25 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
WO2020039372A1 (en) * 2018-08-23 2020-02-27 3M Innovative Properties Company Tackified and filled silicone adhesive compositions
JPWO2021029413A1 (ko) 2019-08-13 2021-02-18
WO2021029412A1 (ja) 2019-08-13 2021-02-18 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
KR20220046581A (ko) 2019-08-13 2022-04-14 다우 도레이 캄파니 리미티드 감압 접착층 형성성 오가노폴리실록산 조성물 및 그의 사용

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082886A (en) * 1989-08-28 1992-01-21 General Electric Company Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber
JP3712054B2 (ja) * 2001-04-13 2005-11-02 信越化学工業株式会社 固体高分子型燃料電池セパレータ用シール材料
JP4140758B2 (ja) * 2002-08-08 2008-08-27 大日本印刷株式会社 オフセット印刷用ブランケット及びオフセット印刷方法
JP3912525B2 (ja) * 2002-12-12 2007-05-09 信越化学工業株式会社 付加硬化型シリコーンゴム組成物及び粘着ゴムシート

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102341469A (zh) * 2009-03-04 2012-02-01 德莎欧洲公司 胶带、特别是粘合光伏层合体的胶带
CN109863207A (zh) * 2016-10-28 2019-06-07 信越化学工业株式会社 耐热性混炼型硅橡胶组合物
US10954385B2 (en) 2016-10-28 2021-03-23 Shin-Etsu Chemical Co., Ltd. Heat-resistant millable silicone rubber composition

Also Published As

Publication number Publication date
KR20060092089A (ko) 2006-08-22
JP2006225420A (ja) 2006-08-31
TWI379870B (ko) 2012-12-21
KR101225391B1 (ko) 2013-01-22
JP4525914B2 (ja) 2010-08-18

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