TW200640318A - Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus - Google Patents
Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatusInfo
- Publication number
- TW200640318A TW200640318A TW095102840A TW95102840A TW200640318A TW 200640318 A TW200640318 A TW 200640318A TW 095102840 A TW095102840 A TW 095102840A TW 95102840 A TW95102840 A TW 95102840A TW 200640318 A TW200640318 A TW 200640318A
- Authority
- TW
- Taiwan
- Prior art keywords
- film pattern
- electro
- electronic apparatus
- forming film
- optical device
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G1/00—Mirrors; Picture frames or the like, e.g. provided with heating, lighting or ventilating means
- A47G1/06—Picture frames
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005040126 | 2005-02-17 | ||
JP2005328485A JP2006259687A (ja) | 2005-02-17 | 2005-11-14 | 膜パターンの形成方法及びデバイスの製造方法、電気光学装置及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200640318A true TW200640318A (en) | 2006-11-16 |
Family
ID=36816035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102840A TW200640318A (en) | 2005-02-17 | 2006-01-25 | Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060183036A1 (zh) |
JP (1) | JP2006259687A (zh) |
KR (1) | KR100735951B1 (zh) |
TW (1) | TW200640318A (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008016226A (ja) * | 2006-07-03 | 2008-01-24 | Canon Inc | 電子源、画像表示装置、画像再生装置、配線基板、及び電子デバイス |
JP4356740B2 (ja) * | 2006-11-29 | 2009-11-04 | セイコーエプソン株式会社 | 配線パターン形成方法、デバイスおよび電子機器 |
JP2009000600A (ja) * | 2007-06-20 | 2009-01-08 | Seiko Epson Corp | パターン形成方法及び電気光学装置製造方法並びに電子機器製造方法 |
FR2929864B1 (fr) * | 2008-04-09 | 2020-02-07 | Commissariat A L'energie Atomique | Auto-assemblage de puces sur un substrat |
KR100997185B1 (ko) * | 2008-09-17 | 2010-11-29 | 삼성전기주식회사 | 인쇄회로기판 수지의 표면 처리 방법 및 상기 방법에 의해처리된 인쇄회로기판 수지 |
KR101097330B1 (ko) * | 2010-01-19 | 2011-12-23 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 및 이를 제조 하는 방법 |
US20110318503A1 (en) * | 2010-06-29 | 2011-12-29 | Christian Adams | Plasma enhanced materials deposition system |
US20140000101A1 (en) * | 2012-06-29 | 2014-01-02 | Johnson & Johnson Vision Care, Inc. | Methods and apparatus to form printed batteries on ophthalmic devices |
CN108693573A (zh) * | 2017-03-31 | 2018-10-23 | 恒颢科技股份有限公司 | 防眩耐磨盖板及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
US5270256A (en) * | 1991-11-27 | 1993-12-14 | Intel Corporation | Method of forming a guard wall to reduce delamination effects |
JPH116911A (ja) | 1997-06-17 | 1999-01-12 | Canon Inc | カラーフィルタ基板とその製造方法、及び該基板を用いた液晶素子 |
KR100370314B1 (ko) * | 2000-06-02 | 2003-01-30 | 주식회사 비아텍 | 빌드업 다층 인쇄회로판 제조방법 |
KR20030075783A (ko) * | 2002-03-20 | 2003-09-26 | 삼성에스디아이 주식회사 | 고효율 태양전지 및 그 제조방법 |
JP4440524B2 (ja) | 2002-10-09 | 2010-03-24 | 大日本印刷株式会社 | 有機el素子の製造方法 |
JP4344270B2 (ja) * | 2003-05-30 | 2009-10-14 | セイコーエプソン株式会社 | 液晶表示装置の製造方法 |
-
2005
- 2005-11-14 JP JP2005328485A patent/JP2006259687A/ja not_active Withdrawn
-
2006
- 2006-01-25 TW TW095102840A patent/TW200640318A/zh unknown
- 2006-02-08 US US11/350,372 patent/US20060183036A1/en not_active Abandoned
- 2006-02-15 KR KR1020060014565A patent/KR100735951B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20060183036A1 (en) | 2006-08-17 |
KR100735951B1 (ko) | 2007-07-06 |
JP2006259687A (ja) | 2006-09-28 |
KR20060092108A (ko) | 2006-08-22 |
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