TW200640027A - Highly heat-dissipating light-emitting diode - Google Patents
Highly heat-dissipating light-emitting diodeInfo
- Publication number
- TW200640027A TW200640027A TW094114090A TW94114090A TW200640027A TW 200640027 A TW200640027 A TW 200640027A TW 094114090 A TW094114090 A TW 094114090A TW 94114090 A TW94114090 A TW 94114090A TW 200640027 A TW200640027 A TW 200640027A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- emitting diode
- highly heat
- chip
- porous material
- Prior art date
Links
- 239000011148 porous material Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094114090A TWI260798B (en) | 2005-05-02 | 2005-05-02 | Highly heat-dissipating light-emitting diode |
US11/415,150 US7598533B2 (en) | 2005-05-02 | 2006-05-02 | High heat dissipating LED having a porous material layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094114090A TWI260798B (en) | 2005-05-02 | 2005-05-02 | Highly heat-dissipating light-emitting diode |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI260798B TWI260798B (en) | 2006-08-21 |
TW200640027A true TW200640027A (en) | 2006-11-16 |
Family
ID=37233598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094114090A TWI260798B (en) | 2005-05-02 | 2005-05-02 | Highly heat-dissipating light-emitting diode |
Country Status (2)
Country | Link |
---|---|
US (1) | US7598533B2 (zh) |
TW (1) | TWI260798B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102655128A (zh) * | 2011-03-03 | 2012-09-05 | 硕恩科技股份有限公司 | 多孔性石墨散热器及多孔性石墨的制备方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090007741A (ko) | 2006-05-02 | 2009-01-20 | 슈퍼불브스, 인크. | Led 전구를 위한 열제거 설계 |
CN101484964A (zh) | 2006-05-02 | 2009-07-15 | 舒伯布尔斯公司 | 用于发光二极管及其构成的灯泡分散光并优先散射某些波长的光的方法 |
BRPI0711150A2 (pt) | 2006-05-02 | 2011-08-23 | Superbulbs Inc | bulbo de led de plástico |
US20090040418A1 (en) * | 2007-08-10 | 2009-02-12 | E. I. Dupont De Nemours And Company | LED device and back panel of liquid crystal display |
WO2009045438A1 (en) | 2007-10-03 | 2009-04-09 | Superbulbs, Inc. | Glass led light bulbs |
CA2706975A1 (en) | 2007-10-24 | 2009-04-30 | Superbulbs, Inc. | Diffuser for led light sources |
US20090107951A1 (en) * | 2007-10-30 | 2009-04-30 | Ming-Che Wu | Method of packaging an LED array module |
US20100006886A1 (en) * | 2008-07-10 | 2010-01-14 | Brilliant Technology Co., Ltd. | High power light emitting diode chip package carrier structure |
TWM351450U (en) * | 2008-07-24 | 2009-02-21 | Yi-Min Lin | Integrated circuit having porous ceramic heat dissipation plate |
DE102010038405A1 (de) * | 2010-07-26 | 2012-01-26 | Osram Opto Semiconductors Gmbh | Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements |
TWI442014B (zh) * | 2010-11-24 | 2014-06-21 | Ind Tech Res Inst | 散熱元件及散熱元件的處理方法 |
US8591069B2 (en) | 2011-09-21 | 2013-11-26 | Switch Bulb Company, Inc. | LED light bulb with controlled color distribution using quantum dots |
US9634214B2 (en) * | 2012-11-05 | 2017-04-25 | Ledengin, Inc. | Graphite-containing substrates for LED packages |
CN106662415B (zh) * | 2014-08-07 | 2018-11-30 | 夏普株式会社 | 热交换器、金属构件、电热水器、饮料供应器和饭盒盖 |
US10676815B1 (en) * | 2018-12-07 | 2020-06-09 | Trusval Technology Co., Ltd. | Method for manufacturing device for heat transmission, dissipation and highly efficient capillary siphoning action |
CN116165834A (zh) | 2021-11-24 | 2023-05-26 | 中强光电股份有限公司 | 波长转换元件及投影机 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9102513D0 (en) | 1991-02-06 | 1991-03-27 | Exxon Chemical Patents Inc | Hydrocarbon production |
JPH11103097A (ja) * | 1997-07-30 | 1999-04-13 | Rohm Co Ltd | 半導体発光素子 |
US5919329A (en) * | 1997-10-14 | 1999-07-06 | Gore Enterprise Holdings, Inc. | Method for assembling an integrated circuit chip package having at least one semiconductor device |
US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
US6518502B2 (en) * | 2001-05-10 | 2003-02-11 | Lamina Ceramics, In | Ceramic multilayer circuit boards mounted on a patterned metal support substrate |
US6637921B2 (en) * | 2001-09-28 | 2003-10-28 | Osram Sylvania Inc. | Replaceable LED bulb with interchangeable lens optic |
JP4182467B2 (ja) * | 2001-12-27 | 2008-11-19 | セイコーエプソン株式会社 | 回路基板、電気光学装置及び電子機器 |
US6936855B1 (en) * | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
CA2466141C (en) * | 2002-01-28 | 2012-12-04 | Nichia Corporation | Nitride semiconductor device having support substrate and its manufacturing method |
JP2003234509A (ja) * | 2002-02-08 | 2003-08-22 | Citizen Electronics Co Ltd | 発光ダイオード |
US6830496B2 (en) * | 2003-01-22 | 2004-12-14 | Kaylu Industrial Corporation | Method of fabricating light emitting diode device with multiple encapsulants |
US6705393B1 (en) * | 2003-02-25 | 2004-03-16 | Abc Taiwan Electronics Corp. | Ceramic heat sink with micro-pores structure |
EP1603170B1 (en) * | 2003-03-10 | 2018-08-01 | Toyoda Gosei Co., Ltd. | Method for manufacturing a solid-state optical element device |
JP4415941B2 (ja) * | 2003-09-12 | 2010-02-17 | 日本電気株式会社 | チップとそのチップを用いた装置およびその使用方法 |
KR100623024B1 (ko) * | 2004-06-10 | 2006-09-19 | 엘지전자 주식회사 | 고출력 led 패키지 |
-
2005
- 2005-05-02 TW TW094114090A patent/TWI260798B/zh not_active IP Right Cessation
-
2006
- 2006-05-02 US US11/415,150 patent/US7598533B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102655128A (zh) * | 2011-03-03 | 2012-09-05 | 硕恩科技股份有限公司 | 多孔性石墨散热器及多孔性石墨的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI260798B (en) | 2006-08-21 |
US7598533B2 (en) | 2009-10-06 |
US20060243997A1 (en) | 2006-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200640027A (en) | Highly heat-dissipating light-emitting diode | |
TW200620710A (en) | Light-emitting device with improved heatsinking | |
EP2315264A4 (en) | LIGHT EMITTING DEVICE | |
WO2007044472A3 (en) | Led with light transmissive heat sink | |
EP2458266A3 (en) | Light emitting diode (LED) lamp | |
TW200733436A (en) | Light emitting diode package structure and fabrication method thereof | |
WO2008105428A1 (ja) | 発光装置 | |
WO2003065775A3 (en) | Heat-sink with large fins-to-air contact area | |
TW200725210A (en) | LED with temperature control function | |
TW201204989A (en) | LED bulb | |
ATE467236T1 (de) | Beleuchtungsvorrichtung | |
MX2012011434A (es) | Disipadores de calor ligeros y lamparas de led que los emplean. | |
US20090052171A1 (en) | Heat-dispensing structure for the led's lamp | |
TW200715547A (en) | Illumination device | |
TW200641472A (en) | Backlight module | |
WO2012095584A3 (fr) | Ampoule a diode avec dissipateur | |
TW200620697A (en) | Light emitting device | |
TW200701492A (en) | Semiconductor package structure | |
TW200625573A (en) | Heat spreader and package structure | |
WO2011162969A3 (en) | Heat transfer system for a light emitting diode (led) lamp | |
TW200714838A (en) | Thermal mechanism design for LED | |
TW200726384A (en) | Radiator and manufacture method thereof (I) | |
CN203628574U (zh) | Led散热模组 | |
WO2017091970A1 (zh) | 高散热led模组 | |
TW200731557A (en) | Light emitting diode package structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |