TW200639241A - Composite for polishing copper wiring, method of polishing surface of semiconductor integrated circuit, and method of manufacturing copper wiring for semiconductor integrated circuit - Google Patents
Composite for polishing copper wiring, method of polishing surface of semiconductor integrated circuit, and method of manufacturing copper wiring for semiconductor integrated circuitInfo
- Publication number
- TW200639241A TW200639241A TW094115253A TW94115253A TW200639241A TW 200639241 A TW200639241 A TW 200639241A TW 094115253 A TW094115253 A TW 094115253A TW 94115253 A TW94115253 A TW 94115253A TW 200639241 A TW200639241 A TW 200639241A
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- integrated circuit
- semiconductor integrated
- copper wiring
- polishing
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003384103A JP4464111B2 (ja) | 2003-11-13 | 2003-11-13 | 銅配線研磨用組成物、半導体集積回路表面の研磨方法および半導体集積回路用銅配線の作製方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200639241A true TW200639241A (en) | 2006-11-16 |
Family
ID=34692633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094115253A TW200639241A (en) | 2003-11-13 | 2005-05-11 | Composite for polishing copper wiring, method of polishing surface of semiconductor integrated circuit, and method of manufacturing copper wiring for semiconductor integrated circuit |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4464111B2 (ja) |
TW (1) | TW200639241A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5412706B2 (ja) * | 2005-11-01 | 2014-02-12 | 日立化成株式会社 | 銅膜及び絶縁材料膜用研磨材及び研磨方法 |
US20090215266A1 (en) * | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
US9633865B2 (en) * | 2008-02-22 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-stain polishing composition |
JP2016056254A (ja) * | 2014-09-08 | 2016-04-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
-
2003
- 2003-11-13 JP JP2003384103A patent/JP4464111B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-11 TW TW094115253A patent/TW200639241A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP4464111B2 (ja) | 2010-05-19 |
JP2005150306A (ja) | 2005-06-09 |
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