TW200639241A - Composite for polishing copper wiring, method of polishing surface of semiconductor integrated circuit, and method of manufacturing copper wiring for semiconductor integrated circuit - Google Patents
Composite for polishing copper wiring, method of polishing surface of semiconductor integrated circuit, and method of manufacturing copper wiring for semiconductor integrated circuitInfo
- Publication number
- TW200639241A TW200639241A TW094115253A TW94115253A TW200639241A TW 200639241 A TW200639241 A TW 200639241A TW 094115253 A TW094115253 A TW 094115253A TW 94115253 A TW94115253 A TW 94115253A TW 200639241 A TW200639241 A TW 200639241A
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- integrated circuit
- semiconductor integrated
- copper wiring
- polishing
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
To provide a technology for realizing a very precise surface flatness when using copper for a metal for wiring. A composite for polishing contains a chemical compound which contains water and hydrogen peroxide and has a chemical construction expressed by a formula (1), at least one first chelating agent selected among a group of tatraric acid, malonic acid, malic acid, citric acid, maleic acid, and fumaric acid, and at least one second chelating agent selected from among a group of triethylenetetramine, ethylenediaminediacetic acid, ethylenediaminetetraacetic acid, and their derivatives. In the formula (1), R is a hydrogen atom, an alkyl group including 1 to 4 carbon atoms, an alkoxyl group including 1 to 4 carbon atoms, or a carboxylic acid group.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003384103A JP4464111B2 (en) | 2003-11-13 | 2003-11-13 | Copper wiring polishing composition, semiconductor integrated circuit surface polishing method, and semiconductor integrated circuit copper wiring manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200639241A true TW200639241A (en) | 2006-11-16 |
Family
ID=34692633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094115253A TW200639241A (en) | 2003-11-13 | 2005-05-11 | Composite for polishing copper wiring, method of polishing surface of semiconductor integrated circuit, and method of manufacturing copper wiring for semiconductor integrated circuit |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4464111B2 (en) |
| TW (1) | TW200639241A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5412706B2 (en) * | 2005-11-01 | 2014-02-12 | 日立化成株式会社 | Polishing material and polishing method for copper film and insulating material film |
| US20090215266A1 (en) * | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| US9633865B2 (en) * | 2008-02-22 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-stain polishing composition |
| JP2016056254A (en) * | 2014-09-08 | 2016-04-21 | 株式会社フジミインコーポレーテッド | Polishing composition |
-
2003
- 2003-11-13 JP JP2003384103A patent/JP4464111B2/en not_active Expired - Fee Related
-
2005
- 2005-05-11 TW TW094115253A patent/TW200639241A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP4464111B2 (en) | 2010-05-19 |
| JP2005150306A (en) | 2005-06-09 |
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