TW200638816A - Circuit wiring composite substrate - Google Patents

Circuit wiring composite substrate

Info

Publication number
TW200638816A
TW200638816A TW094139923A TW94139923A TW200638816A TW 200638816 A TW200638816 A TW 200638816A TW 094139923 A TW094139923 A TW 094139923A TW 94139923 A TW94139923 A TW 94139923A TW 200638816 A TW200638816 A TW 200638816A
Authority
TW
Taiwan
Prior art keywords
circuit
circuit wiring
overlapped
rigid
composite substrate
Prior art date
Application number
TW094139923A
Other languages
Chinese (zh)
Other versions
TWI308038B (en
Inventor
Yoshihito Seki
Yoshiharu Unami
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200638816A publication Critical patent/TW200638816A/en
Application granted granted Critical
Publication of TWI308038B publication Critical patent/TWI308038B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a circuit wiring composite substrate thinned by decreasing the total thickness of a composite structure of an RPC and an FPC. SOLUTION: The circuit wiring composite substrate comprises at least one of rigid circuit board 1a in which a circuit wiring layer is formed on a rigid insulating substrate 2a, and a first and a second flexible circuit boards 11a and 11b in which circuit wiring layers are formed on flexible insulating substrates 12a and 12b, respectively. The first and the second flexible circuit boards 11a and 11b, respectively, have overlapped part Xa1 and Xb1 which is overlapped and fixed on respective sides of the board surfaces of the rigid circuit board, and deformable parts Ya and Yb which are not overlapped with the board surfaces. In the position where the rigid circuit board is overlapped with the flexible circuit boards, at least one of interlayer conduction path for electrically connecting circuit wiring layers of these circuit boards is made to go through.
TW094139923A 2004-11-25 2005-11-14 Circuit wiring composite substrate TW200638816A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004340064 2004-11-25
JP2005276522A JP2006179863A (en) 2004-11-25 2005-09-22 Circuit wiring composite substrate

Publications (2)

Publication Number Publication Date
TW200638816A true TW200638816A (en) 2006-11-01
TWI308038B TWI308038B (en) 2009-03-21

Family

ID=36733635

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139923A TW200638816A (en) 2004-11-25 2005-11-14 Circuit wiring composite substrate

Country Status (3)

Country Link
JP (1) JP2006179863A (en)
KR (1) KR100665244B1 (en)
TW (1) TW200638816A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI840176B (en) * 2023-03-21 2024-04-21 大陸商慶鼎精密電子（淮安）有限公司 Flexible circuit board and method of fabricating the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100771310B1 (en) 2006-08-22 2007-10-29 삼성전기주식회사 Rigid flexible printed circuit board and fabricating method of the same
TWI384913B (en) * 2009-07-20 2013-02-01 Unimicron Technology Corp Flex-rigid circuit board and process the same
KR20220021976A (en) 2020-08-14 2022-02-23 삼성디스플레이 주식회사 Circuit board and display device comprising thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2514849B2 (en) * 1990-03-12 1996-07-10 日本アビオニクス株式会社 Multilayer flex / rigid printed wiring board and manufacturing method thereof
JPH07170029A (en) * 1993-12-15 1995-07-04 Nippon Avionics Co Ltd Flexible printed wiring board and its manufacture
JPH0837380A (en) * 1994-07-21 1996-02-06 Hitachi Chem Co Ltd Multilayred wiring board with terminal
JP3744383B2 (en) * 2000-06-09 2006-02-08 松下電器産業株式会社 Composite wiring board and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI840176B (en) * 2023-03-21 2024-04-21 大陸商慶鼎精密電子（淮安）有限公司 Flexible circuit board and method of fabricating the same

Also Published As

Publication number Publication date
TWI308038B (en) 2009-03-21
KR20060058660A (en) 2006-05-30
JP2006179863A (en) 2006-07-06
KR100665244B1 (en) 2007-01-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees