1308038 ⑴ 九、發明說明 【發明所屬之技術領域】 本發明是關於組合剛性配線基板與撓性配線複 ’尤其是，關於適用在裝設於攜帶電話機或數位相 小型電子機器的電路配線複合基板。 【先前技術】 例如攜帶式電話機或數位相機等的小型電子機 更加薄型化及輕量化，而連動於此，電路功能元件 配線基板等的電子零件，是爲了裝設於小空間的機 朝精緻化或輕量化的方向進行著技術開發。 電路配線基板是隨著增加對於功能的要求’增 能化，而被要求收納於更小空間的機器上有利的機 知，作爲適用於此種構造的配線基板的一例，有組 剛性的剛性配線基板（以下稱爲RPC )，及具柔軟 性配線基板（以下稱爲FPC )的電路配線複合基板 RPC是主要安裝積體電路元件等的電路功能元件， FPC是主要負擔內部電路連接路或傳送路等的作用 FPC是具有柔軟性之故，因而加以變形而有助於收 空間。 該習知的電路配線複合基板是對於其厚度方向 具有上述FPC，而於某一部分的兩面分別具有RPC 之，在重疊上述FPC與上述RPC的部分中，上述 成成爲芯的內層，而上述RPC構成外層。 合基板 機等的 器，是 或電路 器，而 進多功 器。習 合較高 性的撓 。上述 而上述 。上述 納於小 於中央 。換言 FPC構 (2) 1308038 又，在此些R P C與F P C相重疊的部分，爲了互相地 電性地連接R P C及F P C的各配線層，例如利用鑽頭形成 有貫通孔，於該貫通孔施以如鍍金屬而形成有對於上述各 配線層的層間導通路（例如，參照日本國特公2003 -1 3 3 728號公報的第4圖的可撓剛性構造印刷電路基板）。 【發明內容】 可是，在上述習知技術中，被廣泛地使用於上述RPC 及FPC的絕緣基板是分別如以玻璃環氧樹脂材及聚醯亞胺 樹脂材所構成。各絕緣基板的厚度是分別爲約0.8mm及約 數十/z m，亦即RPC比FPC更厚。 如此地在較厚的上述RPC重疊於FPC的兩面的構造 中，該部分是在複合基板整體中具有最大厚度，該厚度決 定複合基板的線厚度。又，若該厚度過大，則爲了確保層 間的導通可靠性，必須增加對於上述貫通孔內壁的上述鍍 金屬的厚度。 一般，在將厚鍍金施加以貫通孔的工程中，同時地對 於位於RPC的最外面的配線層也會施以電鍍。結果，位於 最外面的配線層的厚度變厚而降低RPC外表面的整體平;士曰 度，而欲進行下一配線圖案時，有很難形成精細圖案的胃 題。 又，因重疊RPC與FPC的部分變厚，而使依鑽頭的 貫通孔的形成上的加工時間變久，而鑽頭更換頻度變$， 且對貫通孔的厚鍍金屬形成工程會長時間化。此爲f @力卩 -5 - (3) 1308038 電路配線複合基板的製造整體上的處理時間，而會增加製 品成本。 本發明是爲了解決上述問題點而創作者，提供減低 RPC與FPC的複合構造體的綜合性厚度而被薄型化的電路 配線複合基板。 依照本發明的一局面，一種電路配線複合基板，屬於 具有：包含剛性絕緣基板與電路配線層的至少一種的剛，注 配線基板，及包含撓性絕緣基板與電路配線層的薄膜狀胃 一及第二撓性配線基板的電路配線複合基板，其特徵爲： 上述第一及第二撓性配線基板是分別具有分別重疊於上述 剛性配線基板的兩面加以固定的重疊部分及未重疊於上述 兩面的可變形部分，且上述重疊部分是具有電性地連接此 些各配線基板的各電路配線層所貫通的至少一個層間導通 路。 較理想爲，上述層間導通路是貫通上述第一，第二撓 性配線基板及上述剛性配線基板。 又較理想爲，上述剛性配線基板是包含對於上述剛性 配線基板的厚度方向於正交的方向互相地隔開並置的第一 及第二剛性配線基板，上述第一及第二撓性配線基板是架 橋地配置上述第一及第二剛性配線基板。 又，較理想爲，上述剛性配線基板是包含對於複合基 板的厚度方向於正交方向互相隔開並置的第一及第二剛性 配線基板，上述第一撓性配線基板是架橋地配置上述第一 及第二剛性配線基板的各第一面，上述第二撓性配線基板 -6 - (4) 1308038 重疊於上述第一及第二剛性配線基板的僅任一的第二面。 又’較理想爲在電路配線複合基板中，將對於上述複 合基板的厚度方向正交的方向互相地隔開並置的第一及第 二剛性配線基板以及架橋地配置上述第一及第二剛性配線 基板的上述第一及第二撓性配線基板所構成的電路配線複 合基板作爲第一單位體，將對於上述複合基板的厚度方向 正交的方向互相地隔開並置的第一及第二剛性配線基板， 架橋地配置上述第一及第二剛性配線基板的各一方側的一 面的上述第一撓性配線基板及重疊於上述第二剛性配線基 板的另一方側的一面，且未重疊於上述第一剛性配線基板 的另一方側的一面的上述第二撓性配線基板所構成的電路 配線複合基板作爲第二單位體，重疊從上述第一及第二單 位體任意地選擇的複數單位體所構成，上述撓性配線基板 的上述重疊部分的至少一個配置於最外層。 又依照本發明的其他局面，一種電路配線複合基板， 其特徵爲：包含剛性絕緣基板與電路配線層的剛性配線基 板，及具有僅重疊於上述剛性配線基板的第一面加以固定 的重疊部分及未重疊於上述板面的可變形部分的撓性配線 基板，及將電性地連接上述撓性配線基板及上述撓性配線 基板的電路配線層的上述重疊部分加以貫通的至少一個層 間導電路。 較理想爲，上述層間導電路的貫通上述撓性配線基板 及上述剛性配線基板。 在上述任一局面中，於上述撓性配線基板的上述可變 (5) 1308038 形部分的一部分層積有其他的剛性配線基板。又 ，上述剛性配線基板成爲層積複數剛性配線基板 成的多層層積構造。又較理想爲，重疊於上述剛 板的撓性配線基板的至少一部分是包含層積的複 線基板單板。又較理想爲，上述撓性配線基板的 在基板的厚度方向僅一層。又較理想爲在上述撓 板與上述剛性配線基板重疊部分的至少一曝出面 有電子零件裝設用的凸軌部的配線層圖案。 依照本發明，以剛性配線基板（RPC )來構 線複合基板的核心部分，於具剛性配線基板的兩 重疊複數撓性配線基板（FPC )的接觸部而加以 的構造，藉此成爲電路配線複合基板中的最大厚 與FPC的重疊部的厚度以及複合基板的綜合性厚 技術大幅度地減低。 爲此，該複合基板與習知相比較作成薄型化 於愈狹小化的電子機器殻空間的收納性，可將層 形成用的貫通孔的深度及其鍍層厚度變小，藉此 易得到縮短其加工處理時間或對於電路配線複合 一配線圖案化的精細圖案形成等的效果。 【實施方式】 以下，分別參照第1圖至第6圖來說明依本 路配線複合基板的第1圖至第6圖的實施形態。 較理想爲 單板所構 性配線基 數撓性配 配線層是 性配線基 ，包含具 成電路配 板面分別 固定支持 度的 RPC 度比習知 而改善對 間導電路 ，發揮容 基板的下 發明的電 (6) 1308038 第1實施形態 第1圖是表示圖示於本發明的第1實施形態的電路配 線複合基板的一部分縱斷面的立體圖。該電路配線複合基 板是具有組合較高剛性的複數剛性配線基板（RPC )例如 第一 RPC la及第二RPC 1 lb及具柔軟性的薄膜狀複數撓 性配線基板（FPC )例如第一FPC 1 la及第二FPC 1 lb。 上述RPC是安裝電路功能元件，上述FPC是主要負擔內 部電路連接路或傳送路等的作用。上述FPC是柔軟性，因 此經變形而可收納於小空間。 上述第一，第二RPC是位於該複合基板的厚度方向的 中央構成成爲複合基板的核心部分的內層。上述各FPC是 重疊配置於上述RPC的兩面，以構成複合基板的外層。 上述第一，第二RPC la及lb，是於對於複合基板的 厚度方向正交的方向互相地隔開而被並置。於均使用如玻 璃環氧樹脂材的剛性絕緣基材2a及2b的各該兩面，具有 藉由印刷電路配線技術所致的銅箔的配線圖案化所形成的 複數電路配線層3a及3b，亦即具有兩面配線構造。 上述第一及第二FPC1 la及lib是例如對面的位置關 係，均架橋上述RPC la與lb般地，分別配置於各RPC 的上下兩面。於上述第一及第二FPC是於撓性絕緣基板 1 2a及1 2b的單面，具有藉由印刷電路配線技術所致的銅 箔的配線圖案化所形成的各該複數電路配線層13a及13b ，亦即具有單面的配線構造。 此些配線層1 3 a及1 3 b是於撓性絕緣基板上沿著基板 - 1308038 ⑺ 面的橫方向，換言之，並行於板面的方向， 性絕緣基板2 a，2 b的配置方向正交的方向 線層互相地並置。一方面，此些配線層1 3 a 交於撓性絕緣基板的板面方向，亦即在厚度 層配線構造。 在此，配線層是層積複數導電性材料層 成者，也可發揮同一功能者，實質上可視爲 〇 上述FPC的撓性絕緣基板12a及12b是 的如聚醯亞胺樹脂材的高表面平滑度的薄膜 具有柔軟性的絕緣性覆蓋薄膜1 4a，1 4b整 配線層1 3 a，1 3 b及具此些配線層的一側的 1 2a，1 2b 表面。 在該覆蓋薄膜14a，14b例如使用聚醯 護上述配線層13a，13b的表面者。覆蓋薄聘 外表面，是於其上面藉由配線圖案化又形成 ，爲了容易形成精細圖案，形成平滑且平坦ί 上述第一及第二FPC 1 la及1 lb是具有 ’ Xa2及Xbl，Xb2，在該部分中上述第一及 及lib與第一及第二RPC la，lb重疊而分 又，上述第一及第二FPC 1 la及1 lb是分 RPC未重疊部分Ya及Yb，該部分是可變形 線複合基板收納或組裝於電子機器之際，則 述FPC的可變形部分Ya及Yb而可自由地 於對於上述剛 ，作爲複數配 及1 3b是在正 方向均作爲一 而一體化所形 一層配線構造 使用具柔軟性 所形成，使用 體地覆蓋上述 撓性絕緣基板 亞胺樹脂，保 I 14a > 14b 的 電路配線層時 flJ 面。 重疊部分X a 1 第二 FPC 11 a 別加以固定。 別具有與上述 。欲將電路配 彎曲或折曲上 變形形狀。尤 10 - (8) 1308038 其是，如本實施形態地上述FPC 1 la及1 lb作成架橋RPC 1 a，1 b間的構造，是上述可變形部分Y a與Yb之間成爲 與中空的構造同樣的構造，由此成爲折曲性優異者。 上述第一及第二FPC的重疊部分Xal，Xa2及Xbl， Xb2與第一及第二RPC la，lb的互相固定是藉由此些構 件的熱壓機所進行，而藉由包含於上述RPC的剛性絕緣基 板2 a，2b的熱硬化性環氧樹脂被互相黏接而被固定。又 ，該互相黏接是並不被限定於上述熱壓機，而藉由黏接材 所進行也可以。 可是，被組裝於機器的資訊量變多，則負擔資訊傳送 路的作用的FPC上的配線層層數必需增加。在上述習知技 術，爲了因應於資訊量的增加，作爲核心部分的單一的 FPC上的配線層是不僅設於絕緣基板的單面而不得不設在 兩面，因而FPC的剛性會增加。亦即，會降低FPC的變 形自如性，惟與此相比較，本實施形態的FPC是具有架橋 剛性配線基板1 a與1 b而互相相對的複數（例如兩枚）的 FPC 11a及lib，而在上述單面配線構造也可具有很多條 的配線層。 因此，藉由將本實施形態的各FPC 11a及lib的作爲 單面配線的一配線層構造，成爲可保持可高折曲的柔軟性 ，而可維持或提高複合基板對於殻空間的收納的容易性， 同時成爲確保更多層數的配線層。如此，上述FPC是因其 高折曲性而可提高作爲配線材的可靠性。 又，因上述FPC 11a及lib是位於構成電路配線複合 -11 - (9) 1308038 基板的最外層的配置關係之故’因此欲在對應於 的位置形成其他配線層時，則於重疊於其RPC的 的重疊部分Xal，Xa2上，藉由配線圖案化可形 他的配線層。 上述第一，第二RPC la’ lb的玻璃環氧製 板，是環氧樹脂浸在所編織的玻璃纖維者，藉由 的網孔所製作的凹凸使得絕緣基板表面及配線層 不好。如此地，如習知技術地將RPC作爲最外層 難形成配線層的精細圖案。在本實施形態中， FPC的重疊部分Xal，Xa2的表面呈平坦且平滑 作爲最外層的上述FPC的重疊部分的配線層是容 細圖案，而可微細化複數配線間的間距。 如上所述地，本實施形態的電路配線複合基 爲構成其複合基板內層的核心部分在基板的厚度 央具有第一，第二RPC la，lb而從兩面夾著此! 構成複合基板的外層般地具有薄厚的第一，第二 ，：Hb。爲此，成爲電路配線複合基板中的最 RPC與FPC的重疊部厚度及複合基板的綜合性厚 知技術相比較大幅度地減低。 以數値來比較厚度，則使用厚約〇.8mm的玻 脂的RPC與使用厚約25 的聚醯亞胺薄膜的 形，僅在絕緣基板的厚度上來看，上述重疊部的 約1.63mm (習知技術）大約減半至約0.85mm ( 態）。 上述 RPC 上述FPC 成上述其 的絕緣基 玻璃纖維 的平坦性 配置時很 爲了上述 ，形成於 易形成精 板，是作 方向的中 里RPC以 FPC 11a 大厚度的 度，與習 璃環氧樹 FPC的情 厚度是從 本實施形 -12 - (10) 1308038 如此地被薄型化的複合基板是對於愈被小型化的電子 機器內部的小空間的收納，與習知相比較顯著有利。尤其 是，上述電路配線複合基板是高折曲FP C而經折疊被裝設 在機器殼內時，可得到更大的收納有利性。 一般’在重疊基板的部分，爲了電性訊號或電力供給 必須採取基板間的導通。具體上，於重疊部設置貫通孔， 而於貫通孔內施以電鍍而進行形成層間導電路。 於上述RPC與FPC的重疊部設置貫通孔，而於貫通 孔內施以電鍍來形成層間導電路時，藉由該重疊部的全厚 度較大’而成爲谷易形成貫通孔’雖將該電鏡層厚度作成 比習知還小，層間的導通可靠性也可充分地得到。 因此，形成其層間導電路所用的處理時間與習知相比 較顯著地縮短。又，對於貫通孔的電鍍層厚度較薄就可以 ，因此在電鍍工程中所派生的電路配線複合基板對於最外 層的配線層的電鍍層厚度也變薄，而容易得到下一所形成 的配線層的配線圖案化的精細圖案形成。 還有，可得到縮短貫通孔加工時間，鑽頭的長壽命化 ，縮短電鍍時間等的效果，藉由此些效果的相輔相乘，而 可減低製品成本。 第2實施形態 第2圖是表示本發明的第2實施形態的電路配線複合 基板的縱斷面圖；在與上述第1實施形態的電路配線複合 基板的構成構件實質上功能同一的構件賦予同一符號而省 -13 - (11) (11)1308038 略其說明。 在本實施形態中，對於第一 RPC 1 a在圖中隔開於圖 中朝右邊所表示的方向，並置著第三RPC lc。該第三 R P C 1 c是成爲多層配線構造。亦即，本實施形態的電路 配線複合基板是具有：於兩面分別印刷配線有複數配線層 3c 1的第一層的剛性絕緣基板2c 1，及層積於其上面的第 二層剛性絕緣基板2c2。第二層剛性絕緣基板2c2，是在 圖中表示於上面的表面印刷配線有配線層3c2。 上述下方的第二FPC lib是具有：分別對應於第一及 第三RPC la及lc的重疊部分Xbl及Xb3，及對於此些第 —’第三FPC la、lc未重疊的可變形部分Yb。上述第三 RPC lc的下面是局部地重疊於上述第二FPC lib的一方 重疊部分Xb3而加以固定，而其上面是均與任何FPC.位 於非接觸狀態。 配置於上述第一及第二RPC la及lb上方的第一 FPC 1 1 a，是與第1實施形態同樣地，具有：與上述 RPC la及lb的重疊部分Xal及Xa2，及對於此些RPC未 重疊的可變形部分Ya。上述第二RPC lb的上面是重疊於 —方的上述接觸部分Xa2而加以固定。上述第二RPC lb 的下面是與上述第二FPC 1 lb未重疊，而與任何FPC均位 於非接觸狀態。 又，在與表示於第2圖的中央部的上述第一 RPC la 與上述各FPC的接觸部分Xal及Xbl的重疊部設有貫通 此些的貫通孔TH，而層間導電路4藉由施以鍍金屬形成 -14- (12) 1308038 於該貫通孔ΤΗ內。 如此地，因上述第二RPC lb及第三RPC lc是此些的 一方的一面從各F P C 1 1 a及1 1 b空間地被開放’因此可自 由地選擇使用基板厚度薄的FPC或厚的RPC。爲此，作爲 一例如上述地，可組裝形成較厚的多層配線構造的第三 RPC lc，藉由組裝各種構造的RPC’成爲可作成複合基板 的更多型式的品牌。 又，對於成爲複合基板的核心部分的上述第一 RPC la (第2圖的大約中央），在圖中表示於上方一側的 第一FPC 11a及表示於下方一側的第二FPC 1 lb是配置於 互相不相同的方向（在第2圖爲左右方向）等’可配置在 各種方面。亦即，FPC與RPC的組合方式’是與習知相比 較可成爲豐富多彩。 又，安裝於第二RPC lb上面的功能元件或配線等電 路要素，及安裝於上述第三RPC lc下面的電路要素’是 經上述上面側的第一 FPC 1 1 a，上述層間導電路4及上述 下面側的第二FPC 1 1 b而可電性地連接。如此地’尤其是 三維地安裝於FPC的表背兩面的各電路要素互相間的電性 連接是容易地進行。 亦即，藉由採用RPC的一方的一面重疊於FPC，而另 一方成爲接觸狀態的構造，可確保在重疊部的兩基板配線 層互相間的導通，同時有關於配線圖案可提高設計自由度 〇 又，在本實施形態中，也因RPC與FPC的重疊部的 -15- (13) 1308038 厚度較薄’因此與上述第一實施形態同樣地，電路配線複 合基板是收納在電子機器內部的小空間上有利，具有縮短 貫通孔加工時間，鑽頭的長壽命化，縮短電鍍時間，減低 成本及下一次形成的配線層的精細圖案形成等的效果。 可是，在印刷配線技術領域中，最近期望R P C彼此間 ’ FPC彼此間或是組合rpc與FPC，而進行對於此些各種 組合的基板間連接的技術開發。對應於此，將表示於上述 第一及第二實施形態的電路配線複合基板分別作爲單位體 ’層積複數單位體來構成多層配線構造也可以（第3實施 形態）。又，這時候於各單位體之間介由其他的RPC也可 以（第4實施形態）。還有，對於上述複合基板的單位體 僅層積其他單位體的一部分而局部地構成多層配線構造也 可以（第5實施形態）。 以下，說明有關於適用在上述基板間連接的上述第3 至第5實施形態的本發明的電路配線複合基板的具體例。 第3實施形態 在本實施形態中，將表示於有關於上述第一實施形態 的第1圖的電路配線複合基板作爲第一單位體，藉由重疊 複數的上述單位體，來構成多層層積構造的電路配線複合 基板。各單位體的一方的第一 RPC 1 a彼此間位於重疊的 位置’而且另一方的第二RPC lb彼此間位於重疊的位置 〇 又，在上述層積構造的上下兩面最外層分別配置有 -16- (14) 1308038 FPC，而在上下中間位置重疊第一 FCP 1 lc與第二 1 1 b。亦即，FPC彼此間被連接。 又，同樣地，將表示於有關於上述第二實施形態 2圖的電路配線複合基板作爲第二單位體，藉由對圖 紙面朝上下方向依次重疊複數的單位體，也可以成多 積構造的電路配線複合基板。 還有同樣地，藉由朝紙面上下方向依次重疊表示 1圖的電路配線複合基板所構成的上述第一單位體， 示於第2圖的電路配線複合基板所構成的上述第二單 ，也可形成多層層積構造的電路配線複合基板。 亦即，本實施形態的電路配線複合基板，是組合 述第一及第二單位體任意地選擇的複數單位體加以重 ，容許各種組合的方法。 第4實施形態 參照第3圖說明有關於第4實施形態的電路配線 基板。配置於基板的厚度方向（在圖中爲上下方向） 央的層積構造的第一RPC 31及第二RPC 32，是互相 所定間隔被並置於對於基板的厚度方向交叉的方向（ 中爲左右方向）。 上述第一 RPC 31是將RPC單板31b及31c藉由 接材黏貼於中央RPC單板3 1 a的兩面所構成，而上述 RPC 32是將RPC單板32b及32c藉由如黏接材黏貼 央RPC單板32a的兩面。針對於上述各RPC的厚度 FPC 的第 面的 層層 於第 及表 位體 從上 疊者 複合 的中 具有 在圖 如黏 第二 於中 來比 -17- (15) 1308038 較互相的關係，則RPC 31a與RPC 32a、RPC 31b與 RPC 3 2b、RPC 3 1c與RPC 3 2c，是分別具相同的厚度。 上述第一 RPC 31及上述第二RPC 32是分別具有都層 積的複數RPC彼此間的基板間連接。 在上述第一RPC 31及第二RPC 32的上下兩面，架橋 此些RPC彼此間地配置黏貼有第一FPC 1 1 a及第二 FPC 1 lb。在此第一 FPC 11a及第二FPC lib是將與表示 於第1圖的各FPC同樣的FPC表示作爲例子，而對於與 第1圖同樣的部分賦予同一符號而省略其說明。當然，上 述各FPC是也可使用與第一實施形態者不相同的形狀的 FPC。 因此，上述第一 RPC 3 1及第二RPC 32是分別相當於 第一實施形態的第一及第二R PC la及lb，該第4實施形 態的電路配線複合基板是基本上與上述第1實施形態的電 路配線複合基板類似的構成也可以。 又，在本實施形態中，第一 FPC 11a與上述第一 RPC 31的重疊部分Xal的表面，第二FPC lib與上述第 二RPC 32的重疊部分Xb 2的表面是均被露出。在被露出 的上述各表面可形成其他配線層圖案，而從上述重疊部分 Xal、Xa2、Xbl及Xb2所選擇的至少一以上的表面可作成 此種露出面。 爲了確保上述選擇性的“露出面，而且如在第一 FPC 11a與上述第二RPC 32之重疊部分Xa2，第二 FPC lib與上述第一RPC 31的重疊部分Xbl的位置等， -18 - (16) 1308038 因應於電路所要求的功能，附加性地分別黏貼第四 RPC 33，第五RpC 34也可以。 又，在FPC lib中，於上述第一及第二RPC 31， 的中間，亦即於可變形部分 Yb的一部分兩面，再附加 層積第六RPC 34、第七RPC 36也可以。在上述第六及 七RPC 35、36，可具有上述第一 R PC 31的電路功能與 述第二RPC 3 2的電路功能之間的例如電性中繼功能。 ，將上述RPC 35、36中任一方，僅層積於上述可變形 分Yb的一部分也可以。 可是，組合多數上述RPC或FPC進行裝配電路配 複合基板時，則可事先區分成各種單位體，而組合此些 數單位體加以裝配。以下說明其具體例。 (裝配方法例1 ) 第1步驟： 準備由上述第一FPC 11a，上述RPC 31b，32b及 四RPC 33產生的複合基板所構成的第一單位體。 第2步驟： 準備由第二FPC lib，上述RPC 31c’ 32c、第五至 七RPC 34至36產生的複合基板所構成的第二單位體。 第3步驟： 在同一平面上以所定間隔並置上述RPC 31a及32a 3 2 地 第 上 又 部 線 複 第 第 -19- (17) 1308038 而於其上下層積上述第一及第二單位體成爲如第3圖的構 成，進行裝配電路配線複合基板。 (裝配方法例2 )： 第1步驟： 準備由上述第一 FPC 11a及上述第四RPC 33產生的 複合基板所構成的第三單位體。 第2步驟： 準備由上述第二FPC lib’上述第五至第七RPC 34 至3 6產生的複合基板所構成的第四單位體。 第3步驟： 準備將上述第一RPC 31 (RPC 31a、31b、3 1c的層積 構造）作爲第五單位體，並將上述第二RPC 32( RPC 3 1a 、3 2b、3 2c的層積構造）作爲第六單位體。 第4步驟： 在同一平面上以所定間隔並置上述第五單位體（上述 第一RPC 31)及第六單位體（第二RPC 32)，而於其上 下層積上述第三及第四單位體成爲如第3圖的構成進行裝 配電路配線複合基板。 另外也可將上述第一 FPC 11a，上述第二RPC 32上 面的RPC 32b及第四RPC 33作爲單位體，或是可將上述 -20- (18) (18)1308038 第二FPC lib，上述第一RPC 31下面的RPC 31c’第五至 第七RPC 34至36作爲單位體。可選擇適用於裝配工程線 的合理化，處理成本的減低化等的單位體的構成的組合。 又，上述各步驟的順序是可任意地選擇。 本實施形態的電路配線複合基板’是具有與上述各實 施形態的場合同樣的效果’又’可進行各種形態的基板間 連接。 又，在本實施形態的圖式中，針對對FPC或RPC等 的層積構造的層間導電路的構造省略圖示’惟層間導電路 是與下述的第6及第7實施形態同樣地被形成。各上述 RPC絕緣基板或配線層等的構造或RPC彼此間或FPC彼 此間等的黏貼，是利用通常技術就可得到。所以在此，其 圖示及說明是被簡化。 第5實施形態 第5實施形態的電路配線複合基板，是將表示於第1 圖的上述第1實施形態所致的電路配線複合基板的複數單 位體，朝圖中左右移動，使得一方的單位體的第一 RPC la與另一方的單位體的第二RPC lb成爲重疊的位置 關係，而局部地重疊者。 又，本實施形態的電路配線複合基板，是將表示於有 關於上述第二實施形態的電路配線複合基板的複數單位體 ，朝圖中左右移動，使得一方的單位體的第一 RPC la與 其他單位體的第二RPC lb成爲重疊的位置關係，而局部 -21 - (19) 1308038 地重疊者也可以。[Technical Field] The present invention relates to a combination of a rigid wiring board and a flexible wiring. In particular, the present invention relates to a circuit wiring composite substrate that is applied to a cellular phone or a digital phase small electronic device. [Prior Art] For example, a small electronic device such as a portable telephone or a digital camera is thinner and lighter, and in this case, electronic components such as circuit functional component wiring boards are refined for installation in a small space. Or technical development in the direction of lightweight. The circuit wiring board is advantageous in that it is required to be accommodated in a smaller space as the function of the function is increased. As an example of a wiring board to which such a structure is applied, a rigid wiring board having a rigid structure is provided. (hereinafter referred to as RPC), and a circuit wiring composite substrate RPC having a flexible wiring board (hereinafter referred to as FPC) is a circuit function element in which an integrated circuit element or the like is mainly mounted, and the FPC mainly bears an internal circuit connection path or a transmission path. The role of FPC is soft, so it is deformed to help the space. The conventional circuit wiring composite substrate has the above-mentioned FPC in the thickness direction and RPC on both sides of a certain portion, and the inner layer formed as a core in the portion where the FPC and the RPC are superposed, and the RPC is formed. Form the outer layer. A device such as a base unit is a circuit or a multi-function device. A higher level of flexibility. Above and above. The above is less than the central. In other words, in the portion where the RPC overlaps with the FPC, in order to electrically connect the wiring layers of the RPC and the FPC to each other, for example, a through hole is formed by a drill, and the through hole is provided as The interlayer conduction path for each of the above-mentioned wiring layers is formed by metal plating (for example, the flexible rigid structure printed circuit board of FIG. 4 of Japanese Patent Publication No. 2003-133703). SUMMARY OF THE INVENTION However, in the above-described conventional techniques, the insulating substrates widely used in the above RPC and FPC are composed of a glass epoxy resin material and a polyimide resin material, respectively. The thickness of each of the insulating substrates is about 0.8 mm and about several tens/z m, respectively, that is, the RPC is thicker than the FPC. Thus, in the configuration in which the thick RPC overlaps both sides of the FPC, the portion has the maximum thickness in the entire composite substrate, and the thickness determines the line thickness of the composite substrate. Further, if the thickness is too large, in order to secure the conduction reliability between the layers, it is necessary to increase the thickness of the metal plating to the inner wall of the through hole. Generally, in the case where thick gold plating is applied to the through hole, plating is also applied to the outermost wiring layer located at the RPC. As a result, the thickness of the outermost wiring layer becomes thicker and the overall flatness of the outer surface of the RPC is lowered, and the next wiring pattern is difficult to form a fine pattern. Further, since the portion where the RPC and the FPC are overlapped is thickened, the processing time for forming the through hole by the drill is made longer, the frequency of the bit replacement is changed to $, and the thick metal plating forming process for the through hole is prolonged. This is f @力卩 -5 - (3) 1308038 The overall processing time of the circuit wiring composite substrate manufacturing increases the cost of the product. In order to solve the above problems, the creator of the present invention provides a circuit wiring composite substrate which is thinned by reducing the overall thickness of the composite structure of RPC and FPC. According to one aspect of the present invention, a circuit wiring composite substrate includes a rigid-lined wiring board including at least one of a rigid insulating substrate and a circuit wiring layer, and a film-shaped stomach including a flexible insulating substrate and a circuit wiring layer. A circuit wiring composite substrate of a second flexible wiring board, wherein the first and second flexible wiring boards have overlapping portions that are respectively superposed on both surfaces of the rigid wiring substrate and are not overlapped on the both surfaces The deformable portion is at least one interlayer conduction path through which each of the circuit wiring layers electrically connecting the wiring substrates is electrically connected. Preferably, the interlayer conduction path penetrates the first, second flexible wiring substrate and the rigid wiring substrate. Further, it is preferable that the rigid wiring board includes first and second rigid wiring boards which are spaced apart from each other in a direction orthogonal to a thickness direction of the rigid wiring board, wherein the first and second flexible wiring boards are The first and second rigid wiring boards are placed in a bridging manner. Furthermore, it is preferable that the rigid wiring board includes first and second rigid wiring boards that are spaced apart from each other in a direction perpendicular to a thickness direction of the composite substrate, and the first flexible wiring board is arranged to be bridged And the first surface of the second rigid wiring board, the second flexible wiring board -6 - (4) 1308038 is superposed on only one of the first surfaces of the first and second rigid wiring boards. Further, in the circuit wiring composite substrate, the first and second rigid wiring boards which are disposed to face each other in the direction perpendicular to the thickness direction of the composite substrate, and the first and second rigid wirings are disposed in a bridging manner. The circuit wiring composite substrate including the first and second flexible wiring boards of the substrate is a first unit body, and the first and second rigid wirings which are spaced apart from each other in a direction orthogonal to a thickness direction of the composite substrate The first flexible wiring board on one side of each of the first and second rigid wiring boards and the other side of the second rigid wiring board are disposed on the substrate, and are not overlapped with the first A circuit wiring composite substrate including the second flexible wiring substrate on the other side of the rigid wiring substrate is a second unit body, and a plurality of unit bodies arbitrarily selected from the first and second unit bodies are stacked At least one of the overlapping portions of the flexible wiring board is disposed on the outermost layer. According to still another aspect of the present invention, a circuit wiring composite substrate characterized by comprising: a rigid wiring substrate including a rigid insulating substrate and a circuit wiring layer; and an overlapping portion which is fixed only on a first surface of the rigid wiring substrate A flexible wiring board that does not overlap the deformable portion of the plate surface, and at least one interlayer conductive circuit that penetrates the overlapping portion of the circuit wiring layer electrically connected to the flexible wiring board and the flexible wiring board. Preferably, the interlayer conductive circuit penetrates the flexible wiring board and the rigid wiring board. In any of the above aspects, another rigid wiring board is laminated on a part of the variable (5) 1308038-shaped portion of the flexible wiring board. Further, the rigid wiring board has a multilayer laminated structure in which a plurality of rigid wiring boards are laminated. Further, it is preferable that at least a part of the flexible wiring board superposed on the rigid plate is a laminated multi-layer substrate. Further, it is preferable that the flexible wiring board has only one layer in the thickness direction of the substrate. Further, it is preferable that a wiring layer pattern of a convex rail portion for mounting an electronic component is provided on at least one of the exposed surfaces of the portion where the flexible plate and the rigid wiring substrate overlap. According to the present invention, the core portion of the composite substrate is formed by a rigid wiring board (RPC), and the structure of the two overlapping flexible wiring boards (FPC) having the rigid wiring board is used to form a circuit wiring composite. The maximum thickness of the substrate and the thickness of the overlapping portion of the FPC and the comprehensive thickness of the composite substrate are greatly reduced. Therefore, the composite substrate can be made thinner in the narrower size of the electronic housing space than the conventional one, and the depth of the through hole for layer formation and the thickness of the plating layer can be reduced, thereby making it easy to shorten The processing time or the effect of patterning and patterning fine pattern formation on the circuit wiring. [Embodiment] Hereinafter, embodiments of Figs. 1 to 6 of the main wiring composite substrate will be described with reference to Figs. 1 to 6 . It is preferable that the flexible wiring layer of the wiring structure of the single board is a functional wiring layer, and the RPC degree having a fixed supporting degree of the circuit board surface is improved, and the interleaving circuit is improved. (6) 1308038 First Embodiment FIG. 1 is a perspective view showing a part of a vertical cross section of a circuit wiring composite substrate according to a first embodiment of the present invention. The circuit wiring composite substrate is a plurality of rigid wiring substrates (RPC) having a combination of high rigidity, for example, a first RPC la and a second RPC 1 lb and a flexible film-shaped complex flexible wiring substrate (FPC) such as the first FPC 1 La and the second FPC 1 lb. The above RPC is a functional component for mounting a circuit, and the above-mentioned FPC mainly functions as an internal circuit connection path or a transmission path. The FPC described above is flexible, and thus can be accommodated in a small space by being deformed. The first and second RPCs are an inner layer which is a core portion of the composite substrate at the center in the thickness direction of the composite substrate. Each of the FPCs described above is disposed on both sides of the RPC so as to overlap the outer layer of the composite substrate. The first and second RPCs la and lb are juxtaposed to each other in a direction orthogonal to the thickness direction of the composite substrate. Each of the two sides of the rigid insulating base materials 2a and 2b, such as a glass epoxy resin material, has a plurality of circuit wiring layers 3a and 3b formed by wiring patterning of copper foil by a printed circuit wiring technique. That is, it has a double-sided wiring structure. The first and second FPCs 1a and 1b are, for example, opposite positions, and are disposed on the upper and lower sides of each RPC, such as RPC la and lb. The first and second FPCs are each of the plurality of circuit wiring layers 13a formed by wiring patterning of copper foil by a printed circuit wiring technique on one surface of the flexible insulating substrates 1 2a and 1 2b. 13b, that is, has a single-sided wiring structure. The wiring layers 1 3 a and 1 3 b are on the flexible insulating substrate along the lateral direction of the substrate - 1308038 (7) plane, in other words, in the direction parallel to the board surface, the arrangement direction of the insulating substrate 2 a, 2 b is positive The intersecting direction line layers are juxtaposed to each other. On the one hand, the wiring layers 1 3 a are applied to the board surface direction of the flexible insulating substrate, that is, in the thickness layer wiring structure. Here, the wiring layer is formed by laminating a plurality of layers of a conductive material, and may have the same function, and may be substantially regarded as a high surface of a flexible insulating substrate 12a and 12b of the FPC such as a polyimide resin material. The smooth film has a flexible insulating cover film 14a, 14b, a wiring layer 13a, 1 3b, and a surface of the 1 2a, 1 2b side of the wiring layer. The cover films 14a, 14b are used, for example, to cover the surfaces of the wiring layers 13a, 13b. Covering the outer surface of the thin surface is formed by wiring patterning thereon, and is formed to be smooth and flat in order to easily form a fine pattern. The first and second FPCs 1 la and 1 lb have 'Xa2 and Xbl, Xb2, In the portion, the first and the lib overlap with the first and second RPC la, lb, and the first and second FPCs 1 la and 1 lb are sub-RPC non-overlapping portions Ya and Yb, and the portion is When the deformable wire composite substrate is housed or assembled in an electronic device, the deformable portions Ya and Yb of the FPC can be freely integrated into the above-mentioned rigid, and the plurality 1b is integrated in the positive direction. The layer-shaped wiring structure is formed by using a flexible material, and covers the flexible wiring substrate imide resin to cover the circuit wiring layer of I 14a > 14b. The overlapping portion X a 1 and the second FPC 11 a are not fixed. Don't have the same as above. To bend or bend the circuit to deform the shape. In particular, in the present embodiment, the FPC 1 la and the 1 lb are formed as a bridge between the RPCs 1 a and 1 b, and the structure between the deformable portions Ya and Yb is hollow. The same structure is thus excellent in flexibility. The overlapping portions Xal, Xa2 and Xb1, Xb2 of the first and second FPCs and the first and second RPC la, lb are fixed to each other by the hot press of the members, and are included in the RPC described above. The thermosetting epoxy resins of the rigid insulating substrates 2a, 2b are bonded to each other and fixed. Further, the mutual bonding is not limited to the above-described hot press, but may be carried out by means of a bonding material. However, the amount of information to be assembled on the machine is increased, and the number of wiring layers on the FPC that is responsible for the information transmission path must be increased. In the above-mentioned conventional technique, in order to increase the amount of information, the wiring layer on a single FPC as a core portion is not only provided on one side of the insulating substrate but has to be provided on both sides, so that the rigidity of the FPC is increased. In other words, the FPC of the present embodiment is a plurality of (for example, two) FPCs 11a and lib having the bridge rigid wiring boards 1a and 1b facing each other, and the FPC 11A and lib of the present embodiment are reduced. The single-sided wiring structure described above may have a plurality of wiring layers. Therefore, by using the wiring layer structure of the FPCs 11a and 11b of the present embodiment as a single-sided wiring, it is possible to maintain flexibility that can be highly flexed, and it is possible to maintain or improve the storage of the composite substrate in the case space. Sex, and at the same time become a wiring layer that ensures more layers. As described above, the above FPC is improved in reliability as a wiring member because of its high flexibility. Further, since the FPCs 11a and lib are disposed in the outermost layer of the circuit wiring composite -11 - (9) 1308038 substrate, when the other wiring layers are to be formed at the corresponding positions, the FPCs 11a and lib are superimposed on the RPC. On the overlapping portion Xal, Xa2, the wiring layer can be shaped by wiring patterning. The glass epoxy board of the first and second RPC la' lb is an epoxy resin impregnated with the woven glass fiber, and the unevenness of the mesh made by the mesh makes the surface of the insulating substrate and the wiring layer not good. Thus, it is difficult to form a fine pattern of the wiring layer by using RPC as the outermost layer as in the prior art. In the present embodiment, the surface of the overlap portion Xal, Xa2 of the FPC is flat and smooth. The wiring layer which is the overlapping portion of the FPC which is the outermost layer is a fine pattern, and the pitch between the plurality of wirings can be made fine. As described above, the circuit wiring composite base of the present embodiment has the core portion constituting the inner layer of the composite substrate having the first and second RPC la, lb at the thickness of the substrate, and the outer layer of the composite substrate is formed. Generally, it has a thick first, second, and: Hb. For this reason, the thickness of the overlap between the most RPC and FPC in the circuit wiring composite substrate and the comprehensive knowledge of the composite substrate are greatly reduced. When the thickness is compared by several turns, the RPC of a glass frit having a thickness of about 8 mm and the shape of a polyimide film having a thickness of about 25 are used, and the overlap portion is about 1.63 mm only in view of the thickness of the insulating substrate ( The prior art is halved to about 0.85 mm (state). In the above-mentioned RPC, the above-mentioned FPC is arranged in the flatness of the insulating glass fiber as described above, and is formed in the above-mentioned easy-to-form fine plate, which is the direction of the middle RPC with a large thickness of the FPC 11a, and the thickness of the FPC 11 The composite substrate which is thinned in this manner from the present embodiment -12 - (10) 1308038 is a storage space for a small space inside the electronic device which is miniaturized, and is remarkably advantageous as compared with the prior art. In particular, when the above-mentioned circuit wiring composite substrate is a high-folded FP C and is folded and mounted in the casing, a greater storage advantage can be obtained. Generally, in the portion where the substrate is overlapped, conduction between the substrates must be taken for electrical signals or power supply. Specifically, a through hole is provided in the overlapping portion, and an interlayer conduction circuit is formed by plating in the through hole. A through hole is formed in the overlapping portion between the RPC and the FPC, and when an interlayer conduction circuit is formed by plating in the through hole, the entire thickness of the overlapping portion is large, and the through hole is formed in the valley. The layer thickness is made smaller than conventionally, and the conduction reliability between layers can be sufficiently obtained. Therefore, the processing time for forming the interlayer conductive circuit is significantly shortened as compared with the conventional one. Further, since the thickness of the plating layer of the through hole is thin, the thickness of the plating layer of the wiring layer which is derived in the plating process is thinner for the wiring layer of the outermost layer, and the wiring layer formed next is easily obtained. The wiring pattern is formed by a fine pattern. Further, it is possible to obtain an effect of shortening the processing time of the through hole, increasing the life of the drill, shortening the plating time, and the like, and by multiplying the effects, the cost of the product can be reduced. 2nd Embodiment is a longitudinal cross-sectional view of a circuit wiring composite substrate according to a second embodiment of the present invention, and is substantially the same as a member having substantially the same function as the constituent members of the circuit wiring composite substrate according to the first embodiment. Symbol and save -13 (11) (11) 1308038 for a brief description. In the present embodiment, the first RPC 1 a is placed in the direction indicated by the right side in the figure, and the third RPC lc is placed. This third R P C 1 c is a multilayer wiring structure. In other words, the circuit wiring composite substrate of the present embodiment has a rigid insulating substrate 2c1 on which a first wiring layer having a plurality of wiring layers 3c1 is printed on both sides, and a second rigid insulating substrate 2c2 laminated thereon. . The second rigid insulating substrate 2c2 is a wiring layer 3c2 having a surface printed wiring shown on the upper surface. The lower second FPC lib has the overlapping portions Xb1 and Xb3 corresponding to the first and third RPCs la and lc, respectively, and the deformable portion Yb which does not overlap with the first-th third FPC la, lc. The lower surface of the third RPC lc is partially overlapped with the one overlapping portion Xb3 of the second FPC lib and fixed, and the upper surface thereof is in a non-contact state with any FPC. The first FPC 1 1 a disposed above the first and second RPCs 1a and 1b has the overlapping portions Xal and Xa2 with respect to the RPC la and lb, and for such RPCs, as in the first embodiment. Non-overlapping deformable portion Ya. The upper surface of the second RPC lb is fixed by being overlapped with the above-mentioned contact portion Xa2. The lower side of the second RPC lb described above is not overlapped with the second FPC 1 lb described above, and is in a non-contact state with any FPC. Further, a through hole TH penetrating therethrough is provided in an overlapping portion with the contact portions Xa1 and Xb1 of the first RPC la and the FPC shown in the central portion of the second drawing, and the interlayer conduction circuit 4 is applied. The metallization forms -14-(12) 1308038 in the through-hole. In this way, since one of the second RPC lb and the third RPC lc is spatially opened from each of the FPCs 1 1 a and 1 1 b, it is possible to freely select an FPC having a small substrate thickness or a thick one. RPC. For this reason, as described above, for example, the third RPC lc having a thick multilayer wiring structure can be assembled, and the RPC' of various structures can be assembled to become a brand of a more type of composite substrate. Further, the first RPC la (about the center of FIG. 2) which is the core portion of the composite substrate, the first FPC 11a on the upper side and the second FPC 1 lb on the lower side are shown in the figure. They are arranged in different directions from each other (in the left and right directions in Fig. 2), etc., and can be arranged in various aspects. That is, the combination of the FPC and the RPC is more colorful than the conventional one. Further, a circuit element such as a functional element or a wiring mounted on the second RPC lb, and a circuit element 'mounted under the third RPC lc' are the first FPC 1 1 a on the upper surface side, and the interlayer conduction circuit 4 and The second FPC 1 1 b on the lower side is electrically connected. In this way, the electrical connection between the circuit elements mounted on the front and back sides of the FPC in three dimensions is particularly easy. In other words, by adopting a structure in which one side of the RPC is superposed on the FPC and the other is in a contact state, conduction between the two substrate wiring layers in the overlapping portion can be ensured, and the design freedom can be improved with respect to the wiring pattern. In addition, in the present embodiment, the thickness of -15-(13) 1308038 of the overlapping portion of the RPC and the FPC is thin. Therefore, the circuit wiring composite substrate is small inside the electronic device as in the first embodiment. It is advantageous in space, and has an effect of shortening the processing time of the through hole, prolonging the life of the drill, shortening the plating time, reducing the cost, and forming a fine pattern of the wiring layer to be formed next time. However, in the field of printed wiring technology, it has recently been desired to develop Rp C between each other, or to combine rpc and FPC with each other, and to develop a technique for inter-substrate connection for such various combinations. In the circuit wiring composite substrate according to the first and second embodiments, the multilayer wiring structure may be formed by arranging a plurality of unit cells as a unit body (the third embodiment). Further, at this time, other RPCs may be interposed between the respective unit bodies (fourth embodiment). In addition, it is also possible to partially form a multilayer wiring structure by arranging a part of another unit body in the unit body of the composite substrate (the fifth embodiment). Hereinafter, a specific example of the circuit wiring composite substrate of the present invention in the third to fifth embodiments to which the inter-substrate connection is applied will be described. In the third embodiment, the circuit wiring composite substrate according to the first embodiment of the first embodiment is a first unit body, and a plurality of stacked unit bodies are stacked to form a multilayer laminated structure. Circuit wiring composite substrate. The first RPC 1 a of each unit body is located at an overlapping position with each other and the other second RPC lb are located at an overlapping position with each other, and the outermost layers of the upper and lower surfaces of the laminated structure are respectively arranged - 16 - (14) 1308038 FPC, with the first FCP 1 lc and the second 1 1 b overlapping at the upper and lower intermediate positions. That is, the FPCs are connected to each other. In the same manner, the circuit wiring composite substrate according to the second embodiment 2 is a second unit body, and a plurality of unit bodies can be stacked in the vertical direction on the drawing surface. Circuit wiring composite substrate. In the same manner, the first unit body including the circuit wiring composite substrate shown in FIG. 1 is superposed on the paper surface in the up-down direction, and the second unit formed on the circuit wiring composite substrate shown in FIG. 2 may be used. A circuit wiring composite substrate having a multilayer laminated structure is formed. In other words, the circuit wiring composite substrate of the present embodiment is a method in which a plurality of unit cells arbitrarily selected in combination with the first and second unit bodies are combined and weighted, and various combinations are allowed. Fourth Embodiment A circuit wiring board according to a fourth embodiment will be described with reference to Fig. 3. The first RPC 31 and the second RPC 32 which are disposed in the thickness direction of the substrate (in the vertical direction in the drawing) are arranged at a predetermined interval and are placed in a direction intersecting the thickness direction of the substrate (middle direction) ). The first RPC 31 is formed by bonding the RPC boards 31b and 31c to the two sides of the central RPC board 3 1 a by the bonding material, and the RPC 32 is to stick the RPC boards 32b and 32c by bonding materials such as adhesive materials. Both sides of the central RPC board 32a. The layer of the first surface of the thickness FPC of each of the above RPCs has a relationship with the -17-(15) 1308038 in the composite of the upper and the upper body. Then, RPC 31a and RPC 32a, RPC 31b and RPC 3 2b, RPC 3 1c and RPC 3 2c have the same thickness. The first RPC 31 and the second RPC 32 are inter-substrate connections between the plurality of RPCs each having a stratification. On the upper and lower sides of the first RPC 31 and the second RPC 32, the RPCs of the bridges are disposed to adhere to the first FPC 1 1 a and the second FPC 1 lb. In the first FPC 11a and the second FPC lib, the same reference numerals are given to the same parts as those of the FPC shown in Fig. 1, and the same portions as those in the first embodiment are denoted by the same reference numerals, and their description is omitted. Of course, each of the FPCs described above may be an FPC having a shape different from that of the first embodiment. Therefore, the first RPC 3 1 and the second RPC 32 are respectively corresponding to the first and second R PC la and lb of the first embodiment, and the circuit wiring composite substrate of the fourth embodiment is basically the first The circuit wiring composite substrate of the embodiment may have a similar configuration. Further, in the present embodiment, the surfaces of the overlapping portion Xal of the first FPC 11a and the first RPC 31, and the surfaces of the overlapping portion Xb 2 of the second FPC lib and the second RPC 32 are exposed. Further wiring layer patterns may be formed on the exposed surfaces, and at least one surface selected from the overlapping portions Xal, Xa2, Xb1, and Xb2 may be formed as such an exposed surface. In order to ensure the above-mentioned selective "exposed surface, and as in the overlapping portion Xa2 of the first FPC 11a and the second RPC 32, the position of the overlapping portion Xbl of the second FPC lib with the first RPC 31, etc., -18 - ( 16) 1308038 In addition to the functions required by the circuit, the fourth RPC 33 is additionally attached, and the fifth RpC 34 is also possible. Also, in the FPC lib, in the middle of the first and second RPC 31, that is, The sixth RPC 34 and the seventh RPC 36 may be stacked on both sides of the deformable portion Yb. The sixth and seventh RPCs 35 and 36 may have the circuit function and the description of the first R PC 31 described above. For example, an electrical relay function between the circuit functions of the RPC 3 2 may be one of the above-described RPCs 35 and 36, and may be stacked on only a part of the above-described deformable component Yb. However, most of the above RPCs or FPCs are combined. When the composite circuit is mounted on a circuit board, it can be divided into various unit bodies in advance, and these unit units can be combined and assembled. Specific examples will be described below. (Assembling method example 1) Step 1: Prepare the first FPC 11a described above , the above RPC 31b, 32b and four RP A first unit body composed of a composite substrate produced by C 33. Second step: preparing a second unit body composed of a composite substrate produced by the second FPC lib, the above RPC 31c' 32c, and the fifth to seventh RPCs 34 to 36 Step 3: The first and second unit bodies are stacked on top of each other on the same plane at a predetermined interval by juxtaposing the above-mentioned RPC 31a and 32a 3 2 to the upper and further lines -19-(17) 1308038 As a configuration of Fig. 3, a circuit board composite substrate is mounted. (Assembling method example 2): First step: preparing a third unit body composed of the composite substrate produced by the first FPC 11a and the fourth RPC 33 Step 2: Prepare a fourth unit body composed of the composite substrate produced by the second FPC lib 'the fifth to seventh RPCs 34 to 36. Step 3: Prepare the first RPC 31 (RPC 31a) The laminated structure of 31b and 3 1c is the fifth unit body, and the second RPC 32 (the laminated structure of RPC 3 1a , 3 2b, and 3 2c) is used as the sixth unit body. Step 4: In the same The fifth unit body is juxtaposed at a predetermined interval on the plane (the above One RPC 31) and a sixth unit body (second RPC 32), and the third and fourth unit bodies are stacked on top of each other to form a circuit wiring composite substrate as in the configuration of Fig. 3. An FPC 11a, the RPC 32b and the fourth RPC 33 above the second RPC 32 are used as a unit, or the above -20-(18) (18) 1308038 second FPC lib, the RPC below the first RPC 31 31c' fifth to seventh RPCs 34 to 36 are unit units. A combination of the constitution of the unit body suitable for the rationalization of the assembly line and the reduction of the processing cost can be selected. Further, the order of the above steps can be arbitrarily selected. The circuit wiring composite substrate ’ of the present embodiment has the same effects as those of the above-described embodiments, and can be connected between substrates in various forms. In the drawings of the present embodiment, the structure of the interlayer conduction circuit for the laminated structure of FPC or RPC is omitted. The only interlayer conduction circuit is similar to the sixth and seventh embodiments described below. form. The structure of each of the above RPC insulating substrates, wiring layers, or the like, or the adhesion between the RPCs and the FPCs, etc., can be obtained by a usual technique. Therefore, the illustrations and descriptions here are simplified. In the circuit wiring composite substrate according to the fifth embodiment of the fifth embodiment, the plurality of unit cells of the circuit wiring composite substrate according to the first embodiment of the first embodiment are moved to the left and right in the drawing so that one unit body The first RPC la is in an overlapping positional relationship with the second RPC lb of the other unit body, and partially overlaps. In the circuit wiring composite substrate of the present embodiment, the plurality of unit cells shown in the circuit wiring composite substrate according to the second embodiment are moved to the left and right in the drawing so that the first RPC la of one unit body and the other The second RPC lb of the unit body becomes an overlapping positional relationship, and the partial - 21 - (19) 1308038 overlap can also be used.
又，將有關於上述第一及第二實施形態的各電 複合基板的單位體，同樣地，藉由局部地重疊’來 實施形態的多層層積構造的電路配線複合基板也可J 亦即，將有關於上述第1及第2實施形態的各 線複合基板分別作爲各單位體，而將從此些單位體 被選擇的複數單位體朝左右移動’藉由組合、重疊 得到各種形態的電路配線複合基板。此種實施形態 有與上述各實施形態的場合同樣的效果。 (層間導電路） 以下，針對於上述層間導電路，參照第4圖及 詳細地加以說明。第4圖是擴大表示於圖示於第1 1實施形態所致的電路配線複合基板的第二RpC 1 上述層間導電路等的部分者。在第4圖中’與第1 部分賦予同一符號而省圖其說明。 在第一 FPC 11a重疊對於第二RPC lb的部分 露出面上，與配線層13a不同地’圖中以點圖案所 其他配線層圖案具有精細圖案所形成’該配線圖案 例如四角框狀地配置的複數凸軌部41，被連接於各 41的複數配線層42及被連接於—部分的配線層42 層間連接端43。 在對應於上述層間連接端4 3的位置形成有貫 的第一FPC 11a，第二 RPC lb 及第二 FPC lib 的 路配線 構成本 IL ° 電路配 任意地 ，而可 ，是具 第5圖 圖的第 b設置 圖相同 Xa2的 表示的 是包含 凸軌部 的複數 通重疊 貫通孔 -22- (20) 1308038 ΤΗ。在各貫通孔ΤΗ內面藉由施以如銅等的良導電 的電鍍形成有電路配線複合基板44 ° 在上述複數凸軌部4 1，藉由面朝下接合法電性 及固定有例如從個別的半導體1C晶片’具封裝的 導體、或是1C元件等電子電路元件所延伸的導線 針腳）。 又，在上述第一 FPC 1 1 a的重疊部分Xa2的露 代替上述電子電路元件，也可設置表示於第4實施 附加或輔助性的其他的第四RPC 3 3 (參照第3圖 時候，形成於上述重疊部Xa2的配線層圖案是作成 與上述第四RPC 33的配線層的連接形態的圖案形居 如上述地，第一FPC 1 1 a或第二FPC 1 lb的 RPC 1 lb的上述各 RPC的重疊部分 Xal、Xa2、 Xb2，是可裝設上述電子電路元件或附加性或輔助 等的電子零件’而可使用作爲形成此種配線層圖案 領域。 在上述第1至第5實施形態中，RPC對於上述 重疊部的至少一部份，是也可使用作爲此種配線層 形成領域。 又，上述層間導電路44，是三維地互相電性地 別局部地重疊於第二RPC lb的兩面的第一 FPC ] 二RPC 1 b及第二FPC 1 1 b的各基板配線層。 第5圖是擴大表示對應於圖示於第2圖的第二 態的電路配線複合基板的第二r p C 1 b的部分設置 性金屬 地連接 個別半 端子（ 出面， 形態的 )。這 因應於 上述各 Xbl及 性 RPC 所用的 FPC的 圖案可 連接分 la，第 實施形 上述層 -23 - (21) 1308038 間導電路等的部分者。與第2圖相同部分賦予同一符號而 省略其說明。 亦即本實施形態的電路配線複合基板，是於第二 RPC lb的一方的一面（在第7圖中爲上面）僅重疊第一 FPC 1 U的一部分所形成，而第二RPC ib的另一方的一 面（在圖中爲下面），是成爲露出面。 又’上述層間導電路44是電性地連接形成於第一 F P C 1 1 a的重疊部分X a 2的外表面的配線層圖案的層間連 接端43與形成於第二RPC lb的上述露出面的電路配線層 3b的層間連接端部分。 依照本實施形態的電路配線複合基板，重疊有RPC與 FPC的總厚，成爲比表示於第4圖者還薄。又，上述重疊 部分Xa2的外表面可使用作爲用以形成裝設電子零件所用 的配線圖案的領域，且形成有精細圖案。而且，如在上述 第二實施形態所述地，利用第一 RPC的露出面的存在，具 有增加第一 RPC la的厚度選擇的自由度等的效果。 又’上述層間導電路是以表示於第4圖或第5圖的貫 通孔方式所形成，或是代替此方式而以連絡窗方式所形成 ’或組合兩方式所形成也可以。例如，連接上述第二R P c 1 b的電路配線層與上述第一 FPC 1 1的電路配線層時，則 僅在此些基板的重疊部Xa2的上述第一 FPC 1 1 a形成貫通 孔，而利用連絡窗方式設置上述各基板的各電路配線層互 相間的上述層間導電路也可以。 -24- (22) 1308038 第6實施形態 以下，針對於依第6實施形態的電路配線複合基板參 照第6圖加以說明。本實施形態的電路配線複合基板是對 於表示於第1實施形態的電路配線複合基板，追加其他 FPC而加以重疊者。在與第1圖相同部分賦予同一符號而 省略其說明。 亦即，配置於第一及第二RPC la ’ lb的一方的一面 (在圖中爲上面）的第一FPC 11a，是具有如兩枚的FPC 單板llal與FPC單板lla2的層積的構造。上述FPC單 板llal是與第一實施形態的第一 FPC同樣地具有電路配 線層1 3 a的一層配線構造，FPC單板1 1 a2也同樣地具有 電路配線層13c的一配線層構造。因此第一 FPC 11a是於 厚度方向由上述電路配線層13a與13c產生的多層配線構 造。 又，配置於上述各RPC la、lb的另一方的一面（圖 中爲下面）的第二FPC lib，是具有如兩枚的FPC單板 lib與FPC單板Ilb2的層積構造。上述FPC單板llbl是 與第一實施形態的第二FPC同樣地具有電路配線層1 3b的 一層配線構造，FPC單板1 lb2也同樣地具有電路配線層 13d的一層配線構造。因此第二FPC lib是於厚度方向由 上述電路配線層1 3 b與1 3 d產生的多層配線構造。 如此地，上述第一及第二FPC是如第一實施形態的 FPC地並不被限定於一層配線構造，而是由上述FPC 1 lal 與FPC Ila2的積層或上述FPC單板llbl與FPC llb2的 25 - (23) 1308038 積層產生的複數層（多層）配線構造也可以。在 ，表示著全面性地層積著複數FP C，惟作爲具有 部分與未層積的部分的構造也可實施本發明。又 路配線層13c至13d的配線間距或圖案形狀，是 系統的要件而可任意地決定，或互相地不相同也 如此，被配置於上述上面及下面的第一，第 是在至少一部分，均具有複數層（例如兩層）的 構造。FPC的層數是因應於在電子機器系統所處 ，可適當地增減，當然，上述FPC爲兩層而下層 層者或上面FPC爲4層而下側面FPC爲3層者 各種組合。 上述多層層積構造的·各FPC的重疊層數是依 機器筐體之際所要求的可變形部分的長度及寬度 ，有關於電子機器系統的資訊量的配線層的條數 地選定。藉此，可因應於各種機器系統的要求。 施形態的電路配線複合基板是可發揮與上述實施 的效果。In addition, the circuit wiring composite substrate in which the unit body of each of the electric composite substrates according to the first and second embodiments described above is partially overlapped by the above-described embodiment can also be used. In each of the above-described first and second embodiments, each of the line composite substrates is used as a unit cell, and a plurality of unit units selected from the unit bodies are moved to the left and right, and a circuit wiring composite substrate of various forms is obtained by combining and overlapping. . Such an embodiment has the same effects as those of the above embodiments. (Interlayer Conductor Circuit) Hereinafter, the above-described interlayer conductive circuit will be described with reference to Fig. 4 and in detail. In the fourth embodiment, the second RpC 1 of the circuit wiring composite substrate according to the first embodiment is enlarged. In the fourth drawing, the same reference numerals are given to the first part, and the description thereof is omitted. When the first FPC 11a overlaps the partially exposed surface of the second RPC lb, unlike the wiring layer 13a, the other wiring layer patterns in the dot pattern have a fine pattern formed in the drawing. The wiring pattern is disposed, for example, in a quadrangular frame shape. The plurality of convex rail portions 41 are connected to the plurality of wiring layers 42 of the respective 41s and the interlayer connection ends 43 of the wiring layers 42 connected to the portions. A first FPC 11a is formed at a position corresponding to the interlayer connection end 43, and a line of the second RPC lb and the second FPC lib is configured to be arbitrarily arranged in the IL ° circuit, but may have a fifth diagram The b-th set map is the same as Xa2, and is a multi-pass through-hole -22-(20) 1308038 包含 including a convex portion. A circuit wiring composite substrate 44 is formed on the inner surface of each of the through-holes by plating with a good electrical conductivity such as copper. The plurality of convex rail portions 4 1 are electrically connected and fixed by, for example, a face-down bonding method. Individual semiconductor 1C wafers have a packaged conductor or a wire pin extending from an electronic circuit component such as a 1C component. Further, in place of the electronic circuit element, the overlapping portion Xa2 of the first FPC 1 1 a may be provided with another fourth RPC 3 3 added or assisted in the fourth embodiment (see FIG. 3 for formation). The wiring layer pattern on the overlapping portion Xa2 is a pattern formed in a connection form with the wiring layer of the fourth RPC 33 as described above, and the above-described respective RPC 1 lb of the first FPC 1 1 a or the second FPC 1 lb The overlapping portions Xal, Xa2, and Xb2 of the RPC are electronic components that can be mounted with the above-described electronic circuit components or additional or auxiliary, and can be used as a field for forming such a wiring layer pattern. In the first to fifth embodiments described above The RPC may be used as at least a part of the overlapping portion as the wiring layer forming region. Further, the interlayer conducting circuit 44 is electrically and partially overlapped with each other on both sides of the second RPC lb. The first FPC] the second RPC 1 b and the second FPC 1 1 b of each of the substrate wiring layers. Fig. 5 is an enlarged view showing the second rp C corresponding to the circuit wiring composite substrate of the second state shown in Fig. 2; Partially set metal connection of 1 b The individual half-terminals (outside, in the form). This is because the pattern of the FPC used in each of the above Xbl and the RPC can be connected, and the first layer of the above-mentioned layer -23 - (21) 1308038 is connected to the circuit. In the second embodiment, the circuit wiring composite substrate of the present embodiment has only one first FPC 1 U overlapped on one side (the upper side in FIG. 7) of the second RPC lb. A part of the second RPC ib is formed (the lower side in the figure) is an exposed surface. Further, the above-mentioned interlayer conduction circuit 44 is electrically connected to the overlap formed in the first FPC 1 1 a The interlayer connection end 43 of the wiring layer pattern on the outer surface of the portion X a 2 and the interlayer connection end portion formed on the exposed wiring surface 3b of the second RPC lb. The circuit wiring composite substrate according to the present embodiment is overlapped The total thickness of the RPC and the FPC is thinner than that shown in Fig. 4. Further, the outer surface of the overlapping portion Xa2 can be used as a field for forming a wiring pattern for mounting an electronic component, and is formed with Further, as described in the second embodiment, the presence of the exposed surface of the first RPC has an effect of increasing the degree of freedom in selecting the thickness of the first RPC la, etc. Further, the above-mentioned interlayer conduction circuit is It may be formed by the through-hole method of FIG. 4 or FIG. 5, or may be formed by a contact window method or a combination of two methods instead of this. For example, a circuit connecting the second RP c 1 b may be used. When the wiring layer and the circuit wiring layer of the first FPC 1 1 are formed, the first FPC 1 1 a of the overlapping portion Xa2 of the substrate is formed with a through hole, and each circuit wiring of each of the substrates is provided by a connection window. The above interlayer conduction circuit between the layers may also be used. -24- (22) 1308038 EMBODIMENT OF THE INVENTION Hereinafter, the circuit wiring composite substrate according to the sixth embodiment will be described with reference to Fig. 6. The circuit wiring composite substrate according to the first embodiment is a circuit board composite substrate according to the first embodiment, and is superimposed by adding another FPC. The same portions as those in Fig. 1 are denoted by the same reference numerals, and their description will be omitted. That is, the first FPC 11a disposed on one side (the upper side in the figure) of the first and second RPC la ' lb is a laminate having two FPC boards 11a and FPC boards 11a2. structure. The FPC board 11a has a wiring structure having a circuit wiring layer 13a similarly to the first FPC of the first embodiment, and the FPC board 11a2 similarly has a wiring layer structure of the circuit wiring layer 13c. Therefore, the first FPC 11a is a multilayer wiring structure which is produced by the above-described circuit wiring layers 13a and 13c in the thickness direction. Further, the second FPC lib disposed on the other side (the lower side in the figure) of each of the above RPCs la and lb is a laminated structure having two FPC boards lib and FPC boards 11b2. The FPC board 11b has a wiring structure having the circuit wiring layer 13b similarly to the second FPC of the first embodiment, and the FPC board 1b2 also has a wiring structure of the circuit wiring layer 13d. Therefore, the second FPC lib is a multilayer wiring structure which is produced by the above-described circuit wiring layers 1 3 b and 1 3 d in the thickness direction. As described above, the first and second FPCs are not limited to one layer wiring structure as in the FPC of the first embodiment, but are laminated by the FPC 1 lal and the FPC Ila2 or the FPC boards 11b and 11B1 25 - (23) 1308038 A multi-layer (multi-layer) wiring structure produced by lamination may be used. Here, it is indicated that the complex FP C is accumulated in a comprehensive formation, but the present invention can also be implemented as a structure having a partial and an uncomposited portion. The wiring pitch or pattern shape of the further wiring layers 13c to 13d is arbitrarily determined by the requirements of the system, or is different from each other, and is disposed at least in the upper and lower surfaces, at least in part. A construction having a plurality of layers (for example, two layers). The number of layers of the FPC is appropriately increased or decreased depending on the location of the electronic machine system. Of course, the FPC is two layers and the lower layer or the upper FPC is four layers and the lower side FPC is three layers. In the multilayer laminated structure, the number of overlapping layers of each FPC is the length and width of the deformable portion required for the casing of the machine, and the number of wiring layers for the information amount of the electronic device system is selected. This can be adapted to the requirements of various machine systems. The circuit wiring composite substrate of the embodiment can exhibit the effects of the above-described effects.
又，在第6圖中，省略了對於FPC或RPC 構造的層間導電路的構造’惟在所期望的位置’ 形成表示於第4圖或第5圖的層間導電路44。又 第一、第二FPC的多層層積構造是也可適用在上 施形態。 又，若適當地組合上述第1至第6實施形態 路配線複合基板，則可將複合基板整體厚度作成 第6圖中 被層積的 .，上述電 因應對於 可以。 二 FPC， 多層層積 理的資訊 FPC 爲 1 等，可作 :據收納於 ，可撓性 而可適當 當然本實 形態同樣 等的層積 可同樣地 ，如上述 述任何實 來構成電 薄形化， -26 - (24) (24)1308038 對基板最外層的電子零件安裝所用的精細圖案電路形成’ 電路設計上的自由度及對機器筐體的組裝性’貫通孔加工 時間的縮短，鑽頭的長壽命化’電鍍時間的縮短，製程上 的低成本化等的效果發揮至最大界限。 參照本發明的幾種適用的實施形態來說明本發明，惟 本發明是並不被限定於上述實施形態者。依據上述揭示內 容，具有本技術領域的通常技術者，藉由實施形態的修正 或變形而可實施本發明。 【圖式簡單說明】 第1圖是表示本發明的第1實施形態的電路配線複合 基板的局部縱剖立體圖。 第2圖是表示本發明的第2實施形態的電路配線複合 基板的縱剖面圖。 第3圖是表示本發明的第4實施形態的電路配線複合 基板的縱剖面圖。 第4圖是表示用以說明本發明的層間導電路的具體例 的電路配線複合基板的主要部分擴大立體圖。 第5圖是表示用以說明本發明的層間導電路的具體例 的電路配線複合基板的主要部分擴大立體圖。 第6圖是表示本發明的第6實施形態的電路配線複合 基板的局部縱剖立體圖。 【主要元件之符號說明】 •27- (25) (25)1308038 la :第一剛性配線基板（RPC ) lb :第二剛性配線基板（RPC ) 2a、2b :剛性絕緣基板 3 a、3 b :電路配線層 4 :層間導通路 1 la :第一撓性配線基板（FPC ) 1 1 b :第二撓性配線基板（FPC ) 1 2 a :第一撓性絕緣基板 1 2 b :第二撓性絕緣基板 1 3 a、1 3 b :配線層Further, in Fig. 6, the structure of the interlayer conduction circuit for the FPC or RPC structure is omitted, but the interlayer conduction circuit 44 shown in Fig. 4 or Fig. 5 is formed at a desired position. Further, the multilayer laminated structure of the first and second FPCs is also applicable to the above embodiment. Further, when the road wiring composite substrates of the first to sixth embodiments described above are combined as appropriate, the thickness of the entire composite substrate can be laminated in Fig. 6, and the above-mentioned electrical energy can be used. In the case of the FPC, the information FPC of the multi-layered layer is 1 or the like, and it is possible to use a layer which is similar to the actual form and the like, and can be similarly formed as described above. , -26 - (24) (24)1308038 The fine pattern circuit used for the mounting of the electronic components on the outermost layer of the substrate forms 'degree of freedom in circuit design and assembly of the machine housing'. The longevity of the 'the plating time is shortened, and the effect of reducing the cost of the process is maximized. The invention will be described with reference to a few embodiments of the invention, but the invention is not limited to the embodiments described above. The present invention can be implemented by a person skilled in the art in light of the above-described disclosures. [Brief Description of the Drawings] Fig. 1 is a partial longitudinal sectional perspective view showing a circuit wiring composite substrate according to a first embodiment of the present invention. Fig. 2 is a longitudinal sectional view showing a circuit wiring composite substrate according to a second embodiment of the present invention. Fig. 3 is a longitudinal sectional view showing a circuit wiring composite substrate according to a fourth embodiment of the present invention. Fig. 4 is an enlarged perspective view showing a main part of a circuit wiring composite substrate for explaining a specific example of the interlayer conduction circuit of the present invention. Fig. 5 is an enlarged perspective view showing a main part of a circuit wiring composite substrate for explaining a specific example of the interlayer conduction circuit of the present invention. Figure 6 is a partial longitudinal sectional perspective view showing a circuit wiring composite substrate according to a sixth embodiment of the present invention. [Description of Symbols of Main Components] • 27- (25) (25) 1308038 la : First rigid wiring board (RPC) lb : Second rigid wiring board (RPC) 2a, 2b: rigid insulating board 3 a, 3 b : Circuit wiring layer 4: interlayer conduction path 1 la : first flexible wiring substrate (FPC) 1 1 b : second flexible wiring substrate (FPC) 1 2 a : first flexible insulating substrate 1 2 b : second flexible Insulating substrate 1 3 a, 1 3 b : wiring layer
3 1:第一RPC 31a 〜31c: RPC 單板3 1: First RPC 31a ~ 31c: RPC board
32 :第二 RPC 32a 〜32c: RPC 單板32: Second RPC 32a ~ 32c: RPC board
33 ：第 4RPC33: 4th RPC
34 ：第 5RPC34: 5th RPC
35 ：第 6RPC35: 6RPC
36 ：第 7RPC 4 1 :凸軌部 4 2 :配線層 43 :層間連接端 44 :層間導電路 TH :貫通孔 -2836 : 7RPC 4 1 : convex rail portion 4 2 : wiring layer 43 : interlayer connection terminal 44 : interlayer conduction circuit TH : through hole -28