TW200637719A - Method and apparatus for improving alloy mechanical properties - Google Patents

Method and apparatus for improving alloy mechanical properties

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Publication number
TW200637719A
TW200637719A TW094112344A TW94112344A TW200637719A TW 200637719 A TW200637719 A TW 200637719A TW 094112344 A TW094112344 A TW 094112344A TW 94112344 A TW94112344 A TW 94112344A TW 200637719 A TW200637719 A TW 200637719A
Authority
TW
Taiwan
Prior art keywords
channels
mold
extruded
punches
extrusion
Prior art date
Application number
TW094112344A
Other languages
Chinese (zh)
Other versions
TWI273023B (en
Inventor
Sheng-Lon Lee
Yeon-Sheng Yang
Jing-Chie Lin
Feng-Lai Hsueh
Cheng-Yu Chou
Original Assignee
Sheng-Lon Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sheng-Lon Lee filed Critical Sheng-Lon Lee
Priority to TW94112344A priority Critical patent/TWI273023B/en
Publication of TW200637719A publication Critical patent/TW200637719A/en
Application granted granted Critical
Publication of TWI273023B publication Critical patent/TWI273023B/en

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  • Extrusion Of Metal (AREA)

Abstract

The present invention relates to a large deformation apparatus, a method for applying large deformation, and products thereof for metallic materials that comprises a extrusion mold, and a extrusion system, wherein the extrusion mold comprise a mold body, more than 3 holes that pass through the mold body forming channels and insect in its inside, wherein the channels area can be different cause of process needs, but at least two channels in the same direction have the same area for extruding the alloy materials out of the mold; the extrusion system comprises punches provided to channels that can slide in the channels and extend from the end surface of the mold body to the intersection of the channels; said metallic materials can be put in any channel and then extruded by punches deforming the alloy materials separating in the channels in turn, then extruded out the mold by punches, the said metallic materials can be extruded at room temperature, high temperature, and semi-solid state of ally material.
TW94112344A 2005-04-18 2005-04-18 Method and apparatus for improving alloy mechanical properties TWI273023B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94112344A TWI273023B (en) 2005-04-18 2005-04-18 Method and apparatus for improving alloy mechanical properties

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94112344A TWI273023B (en) 2005-04-18 2005-04-18 Method and apparatus for improving alloy mechanical properties

Publications (2)

Publication Number Publication Date
TW200637719A true TW200637719A (en) 2006-11-01
TWI273023B TWI273023B (en) 2007-02-11

Family

ID=38621330

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94112344A TWI273023B (en) 2005-04-18 2005-04-18 Method and apparatus for improving alloy mechanical properties

Country Status (1)

Country Link
TW (1) TWI273023B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810015B (en) * 2022-08-10 2023-07-21 財團法人金屬工業研究發展中心 Equal channel angular extrusion device and method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109759471B (en) * 2018-12-18 2020-04-07 长沙仲腾金属材料科技有限公司 Equal-channel extrusion die and method for preparing ultrafine crystal block material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810015B (en) * 2022-08-10 2023-07-21 財團法人金屬工業研究發展中心 Equal channel angular extrusion device and method

Also Published As

Publication number Publication date
TWI273023B (en) 2007-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees