TW200636093A - Method for plating printed circuit board - Google Patents

Method for plating printed circuit board

Info

Publication number
TW200636093A
TW200636093A TW094147353A TW94147353A TW200636093A TW 200636093 A TW200636093 A TW 200636093A TW 094147353 A TW094147353 A TW 094147353A TW 94147353 A TW94147353 A TW 94147353A TW 200636093 A TW200636093 A TW 200636093A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
plating
rack
panel
Prior art date
Application number
TW094147353A
Other languages
English (en)
Chinese (zh)
Other versions
TWI307371B (ja
Inventor
Tetsuya Takahashi
Masakazu Suzuki
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200636093A publication Critical patent/TW200636093A/zh
Application granted granted Critical
Publication of TWI307371B publication Critical patent/TWI307371B/zh

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW094147353A 2005-04-14 2005-12-29 Method for plating printed circuit board TW200636093A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005117242A JP4700396B2 (ja) 2005-04-14 2005-04-14 プリント基板のめっき方法

Publications (2)

Publication Number Publication Date
TW200636093A true TW200636093A (en) 2006-10-16
TWI307371B TWI307371B (ja) 2009-03-11

Family

ID=37077198

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147353A TW200636093A (en) 2005-04-14 2005-12-29 Method for plating printed circuit board

Country Status (3)

Country Link
JP (1) JP4700396B2 (ja)
CN (1) CN1847465A (ja)
TW (1) TW200636093A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101343771B (zh) * 2007-07-13 2010-10-06 富葵精密组件(深圳)有限公司 电镀装置
CN101437365B (zh) * 2007-11-15 2011-05-11 富葵精密组件(深圳)有限公司 固持装置及固持方法
CN101466206B (zh) * 2007-12-19 2010-11-17 比亚迪股份有限公司 一种印刷线路板的导通孔电镀的方法
JP5406065B2 (ja) * 2010-02-03 2014-02-05 日本メクトロン株式会社 多層プリント配線板の製造方法及び基板保持具、並びに遮蔽板
CN102560609A (zh) * 2010-12-24 2012-07-11 北大方正集团有限公司 电镀挂具及其制备方法
CN102839411A (zh) * 2012-09-17 2012-12-26 高德（无锡）电子有限公司 一种pcb行业垂直线电镀用超薄板电镀挂具
TWI720798B (zh) * 2019-01-31 2021-03-01 日商Ａｌｍｅｘ Ｐｅ股份有限公司 工件保持治具及表面處理裝置
TWI723755B (zh) * 2019-01-31 2021-04-01 日商Ａｌｍｅｘ Ｐｅ股份有限公司 工件保持治具及表面處理裝置
TWI728668B (zh) * 2019-01-31 2021-05-21 日商Ａｌｍｅｘ Ｐｅ股份有限公司 工件保持治具及表面處理裝置
CN110328624B (zh) * 2019-07-26 2020-07-31 郑州磨料磨具磨削研究所有限公司 一种用于异形电镀砂轮的沉积卡具及其使用方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2682878B2 (ja) * 1989-11-27 1997-11-26 上村工業株式会社 シールド付き電気めっき装置
JPH08296092A (ja) * 1995-04-28 1996-11-12 Hitachi Cable Ltd プリント基板のメッキ用ハンガー
JP3285572B2 (ja) * 2000-06-09 2002-05-27 栄電子工業株式会社 分割電極部分を有する給電ローラを用いた連続めっき方法並びに装置
JP4765207B2 (ja) * 2001-06-26 2011-09-07 パナソニック株式会社 全面電気メッキ装置およびそれによって全面メッキリードフレームを製造する方法

Also Published As

Publication number Publication date
JP4700396B2 (ja) 2011-06-15
TWI307371B (ja) 2009-03-11
JP2006291337A (ja) 2006-10-26
CN1847465A (zh) 2006-10-18

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees