TW200633566A - Method for setting temperature of heat treatment plate, apparatus for setting temperature of heat treatment plate, program, and program-recorded computer-readable recording medium - Google Patents
Method for setting temperature of heat treatment plate, apparatus for setting temperature of heat treatment plate, program, and program-recorded computer-readable recording mediumInfo
- Publication number
- TW200633566A TW200633566A TW095104238A TW95104238A TW200633566A TW 200633566 A TW200633566 A TW 200633566A TW 095104238 A TW095104238 A TW 095104238A TW 95104238 A TW95104238 A TW 95104238A TW 200633566 A TW200633566 A TW 200633566A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat treatment
- treatment plate
- program
- setting temperature
- temperature
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005035933A JP2006222354A (ja) | 2005-02-14 | 2005-02-14 | 熱処理板の温度設定方法,熱処理板の温度設定装置,プログラム及びプログラムを記録したコンピュータ読み取り可能な記録媒体 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200633566A true TW200633566A (en) | 2006-09-16 |
Family
ID=36793099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095104238A TW200633566A (en) | 2005-02-14 | 2006-02-08 | Method for setting temperature of heat treatment plate, apparatus for setting temperature of heat treatment plate, program, and program-recorded computer-readable recording medium |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006222354A (zh) |
TW (1) | TW200633566A (zh) |
WO (1) | WO2006085527A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401547B (zh) * | 2008-04-25 | 2013-07-11 | Tokyo Electron Ltd | A substrate processing method, and a substrate processing system |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4970882B2 (ja) | 2006-09-25 | 2012-07-11 | 東京エレクトロン株式会社 | 基板の測定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び基板の測定システム |
JP4891139B2 (ja) | 2007-04-20 | 2012-03-07 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体 |
JP4969304B2 (ja) | 2007-04-20 | 2012-07-04 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法、熱処理板の温度設定装置及びコンピュータ読み取り可能な記憶媒体 |
JP5065082B2 (ja) | 2008-02-25 | 2012-10-31 | 東京エレクトロン株式会社 | 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム |
JP5208800B2 (ja) * | 2009-02-17 | 2013-06-12 | 東京エレクトロン株式会社 | 基板処理システム及び基板搬送方法 |
JP5174098B2 (ja) * | 2010-08-09 | 2013-04-03 | 東京エレクトロン株式会社 | 熱処理方法及びその熱処理方法を実行させるためのプログラムを記録した記録媒体並びに熱処理装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000349018A (ja) * | 1999-06-08 | 2000-12-15 | Nec Corp | フォトレジスト用ベーク炉 |
JP4021139B2 (ja) * | 1999-09-30 | 2007-12-12 | 東京エレクトロン株式会社 | 加熱処理装置及び加熱処理方法 |
JP3702175B2 (ja) * | 2000-12-19 | 2005-10-05 | 東京エレクトロン株式会社 | 熱処理装置及びその方法、並びにパターン形成方法 |
JP2003209050A (ja) * | 2002-01-17 | 2003-07-25 | Tokyo Electron Ltd | 基板処理方法及び基板処理装置 |
JP2004235469A (ja) * | 2003-01-30 | 2004-08-19 | Tokyo Electron Ltd | 熱的処理方法および熱的処理装置 |
-
2005
- 2005-02-14 JP JP2005035933A patent/JP2006222354A/ja active Pending
-
2006
- 2006-02-07 WO PCT/JP2006/302060 patent/WO2006085527A1/ja not_active Application Discontinuation
- 2006-02-08 TW TW095104238A patent/TW200633566A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401547B (zh) * | 2008-04-25 | 2013-07-11 | Tokyo Electron Ltd | A substrate processing method, and a substrate processing system |
Also Published As
Publication number | Publication date |
---|---|
JP2006222354A (ja) | 2006-08-24 |
WO2006085527A1 (ja) | 2006-08-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200636806A (en) | Method and apparatus of setting temperature of heat treating board, program and computer readable recording medium recording program | |
TW200633566A (en) | Method for setting temperature of heat treatment plate, apparatus for setting temperature of heat treatment plate, program, and program-recorded computer-readable recording medium | |
TW200636866A (en) | Method and apparatus for setting the temperature of heat processing plate, program and computer-readable recording medium recorded with program | |
EP1548809B8 (en) | Heat treatment method and heat treatment apparatus | |
EP1959299A3 (en) | Pattern replication with intermediate stamp | |
TW200618663A (en) | Heater, wafer heating apparatus and method for manufacturing heater | |
TW200504858A (en) | Printing method and printing apparatus | |
ATE336470T1 (de) | Vorrichtung und verfahren zum erwärmen von glasplatten in einem mit rollen versehenen temperofen | |
HK1070985A1 (en) | Method for thermally treating substrates | |
SG158101A1 (en) | Method and apparatus for controlling spatial temperature distribution | |
TW200609376A (en) | Pecvd susceptor support construction | |
ATE500607T1 (de) | Verfahren und vorrichtung zum thermischen behandeln von substraten | |
TW200627513A (en) | Control process, temperature control process, temperature regulator, heat treatment, program and recordable medium | |
TW200709278A (en) | Method and apparatus to control semiconductor film deposition characteristics | |
TW200723370A (en) | Multi-zone resistive heater | |
TW200728488A (en) | Apparatus temperature control and pattern compensation | |
TW200606021A (en) | Forming method, unit and material for pattern films, and product gained by said method | |
TW200729298A (en) | Heating system of batch type reaction chamber and method thereof | |
WO2008008585A3 (en) | Multizone heater for furnace | |
ATE338846T1 (de) | Verfahren zur temperaturkontrolle einer materialbahn und entsprechende vorrichtung | |
ATE434508T1 (de) | Automatische druck- und temperatursteuervorrichtung und verfahren zum vulkanisieren von reifenanordnungen | |
TW200802530A (en) | Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program | |
TW200737288A (en) | Heating apparatus | |
JP2022117092A5 (zh) | ||
DE502005004439D1 (de) | Vorrichtung zum Wärmebehandeln einer Beschichtung von Flachoffset-Druckplatten |