TW200636866A - Method and apparatus for setting the temperature of heat processing plate, program and computer-readable recording medium recorded with program - Google Patents

Method and apparatus for setting the temperature of heat processing plate, program and computer-readable recording medium recorded with program

Info

Publication number
TW200636866A
TW200636866A TW095104325A TW95104325A TW200636866A TW 200636866 A TW200636866 A TW 200636866A TW 095104325 A TW095104325 A TW 095104325A TW 95104325 A TW95104325 A TW 95104325A TW 200636866 A TW200636866 A TW 200636866A
Authority
TW
Taiwan
Prior art keywords
heat processing
temperature
program
processing plate
temperature correction
Prior art date
Application number
TW095104325A
Other languages
Chinese (zh)
Inventor
Mitsuteru Yano
Shinichi Shinozuka
Hiroshi Tomita
Ryoichi Uemura
Masahide Tadokoro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200636866A publication Critical patent/TW200636866A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Control Of Resistance Heating (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

The temperature of a heat processing plate is set so as to form a resist pattern with a wire width that is uniform within a wafer. The heat processing plate of a Post Exposure Baking(PEB) device is divided into a plurality of heat processing regions, of each of which the temperature may be set respectively. In each heat processing region of the heat processing plate, a temperature correction value, for regulating the temperature within the wafer that is carried on the heat processing plate, is set respectively. The temperature correction value of each heat processing region of the heat processing plate is set based on a temperature correction table that shows optimal temperature correction values corresponding to respective warping amount and warping shape of the heat processed wafer. According to the temperature correction table, optimal temperature correction values are determined so that the finally formed wire widths corresponding to respective warping amount and warping shape of the wafer are uniform within the wafer.
TW095104325A 2005-02-15 2006-02-09 Method and apparatus for setting the temperature of heat processing plate, program and computer-readable recording medium recorded with program TW200636866A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005038015A JP2006228820A (en) 2005-02-15 2005-02-15 Temperature setting method and temperature setting device for heat treatment plate, program, and computer-readable recording medium recorded with program

Publications (1)

Publication Number Publication Date
TW200636866A true TW200636866A (en) 2006-10-16

Family

ID=36916346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104325A TW200636866A (en) 2005-02-15 2006-02-09 Method and apparatus for setting the temperature of heat processing plate, program and computer-readable recording medium recorded with program

Country Status (3)

Country Link
JP (1) JP2006228820A (en)
TW (1) TW200636866A (en)
WO (1) WO2006087938A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111785626A (en) * 2019-04-04 2020-10-16 长鑫存储技术有限公司 Heating method and heating device
CN111900076A (en) * 2020-06-28 2020-11-06 中国科学院微电子研究所 Temperature control method for wafer baking

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699283B2 (en) 2006-05-23 2011-06-08 東京エレクトロン株式会社 Heat treatment plate temperature control method, program, and heat treatment plate temperature control device
JP4970882B2 (en) 2006-09-25 2012-07-11 東京エレクトロン株式会社 Substrate measurement method, program, computer-readable recording medium storing the program, and substrate measurement system
JP2008116354A (en) * 2006-11-06 2008-05-22 Nec Electronics Corp Warpage measurement system, film formation system, and warpage measurement method
JP4899879B2 (en) * 2007-01-17 2012-03-21 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and storage medium
KR101299838B1 (en) * 2007-10-02 2013-08-23 도쿄엘렉트론가부시키가이샤 Temperature setting method of thermal processing plate, computer-readable recording medium, and temperature setting apparatus of thermal processing plate
JP5995892B2 (en) * 2014-03-14 2016-09-21 東京エレクトロン株式会社 Method for heat-treating a substrate, heat treatment apparatus and computer-readable recording medium
JP6745588B2 (en) * 2015-06-16 2020-08-26 株式会社ノリタケカンパニーリミテド Baking equipment
KR102304247B1 (en) * 2016-06-27 2021-09-17 도쿄엘렉트론가부시키가이샤 Substrate processing apparatus and substrate processing method and storage medium
CN113785242A (en) 2019-05-01 2021-12-10 Asml荷兰有限公司 Object positioner, method for correcting the shape of an object, lithographic apparatus, object inspection apparatus, device manufacturing method
JP7449799B2 (en) * 2020-07-09 2024-03-14 東京エレクトロン株式会社 Temperature adjustment method and inspection device for mounting table

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3325833B2 (en) * 1998-05-20 2002-09-17 東京エレクトロン株式会社 Heat treatment equipment
JP3335905B2 (en) * 1998-05-20 2002-10-21 東京エレクトロン株式会社 Heat treatment equipment
JP2000349018A (en) * 1999-06-08 2000-12-15 Nec Corp Bake furnace for photoresist
JP4021139B2 (en) * 1999-09-30 2007-12-12 東京エレクトロン株式会社 Heat treatment apparatus and heat treatment method
JP3708786B2 (en) * 2000-03-27 2005-10-19 株式会社東芝 Resist pattern forming method and semiconductor manufacturing system
JP3702175B2 (en) * 2000-12-19 2005-10-05 東京エレクトロン株式会社 Heat treatment apparatus and method, and pattern formation method
JP2003209050A (en) * 2002-01-17 2003-07-25 Tokyo Electron Ltd Substrate treatment method and substrate treatment apparatus
JP2004235469A (en) * 2003-01-30 2004-08-19 Tokyo Electron Ltd Heat treatment method and heat treatment apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111785626A (en) * 2019-04-04 2020-10-16 长鑫存储技术有限公司 Heating method and heating device
CN111900076A (en) * 2020-06-28 2020-11-06 中国科学院微电子研究所 Temperature control method for wafer baking

Also Published As

Publication number Publication date
JP2006228820A (en) 2006-08-31
WO2006087938A1 (en) 2006-08-24

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