TW200631782A - Structure and method of thermal stress compensation - Google Patents
Structure and method of thermal stress compensationInfo
- Publication number
- TW200631782A TW200631782A TW094107086A TW94107086A TW200631782A TW 200631782 A TW200631782 A TW 200631782A TW 094107086 A TW094107086 A TW 094107086A TW 94107086 A TW94107086 A TW 94107086A TW 200631782 A TW200631782 A TW 200631782A
- Authority
- TW
- Taiwan
- Prior art keywords
- thermal stress
- stress compensation
- substrate
- film
- thermal expansion
- Prior art date
Links
- 230000008646 thermal stress Effects 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K5/00—Measuring temperature based on the expansion or contraction of a material
- G01K5/48—Measuring temperature based on the expansion or contraction of a material the material being a solid
- G01K5/56—Measuring temperature based on the expansion or contraction of a material the material being a solid constrained so that expansion or contraction causes a deformation of the solid
- G01K5/62—Measuring temperature based on the expansion or contraction of a material the material being a solid constrained so that expansion or contraction causes a deformation of the solid the solid body being formed of compounded strips or plates, e.g. bimetallic strip
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K5/00—Measuring temperature based on the expansion or contraction of a material
- G01K5/48—Measuring temperature based on the expansion or contraction of a material the material being a solid
- G01K5/56—Measuring temperature based on the expansion or contraction of a material the material being a solid constrained so that expansion or contraction causes a deformation of the solid
- G01K5/62—Measuring temperature based on the expansion or contraction of a material the material being a solid constrained so that expansion or contraction causes a deformation of the solid the solid body being formed of compounded strips or plates, e.g. bimetallic strip
- G01K5/64—Details of the compounds system
- G01K5/68—Shape of the system
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0161—Controlling physical properties of the material
- B81C2201/0163—Controlling internal stress of deposited layers
- B81C2201/0167—Controlling internal stress of deposited layers by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094107086A TWI249470B (en) | 2005-03-09 | 2005-03-09 | Structure and method of thermal stress compensation |
US11/163,895 US20060204776A1 (en) | 2005-03-09 | 2005-11-03 | Structure and method of thermal stress compensation |
JP2005374983A JP2006281766A (ja) | 2005-03-09 | 2005-12-27 | 熱応力補償の構造体及び方法 |
US12/247,215 US20090029048A1 (en) | 2005-03-09 | 2008-10-07 | Method of thermal stress compensation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094107086A TWI249470B (en) | 2005-03-09 | 2005-03-09 | Structure and method of thermal stress compensation |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI249470B TWI249470B (en) | 2006-02-21 |
TW200631782A true TW200631782A (en) | 2006-09-16 |
Family
ID=36971326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094107086A TWI249470B (en) | 2005-03-09 | 2005-03-09 | Structure and method of thermal stress compensation |
Country Status (3)
Country | Link |
---|---|
US (2) | US20060204776A1 (zh) |
JP (1) | JP2006281766A (zh) |
TW (1) | TWI249470B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI464834B (zh) * | 2011-05-11 | 2014-12-11 | Taiwan Semiconductor Mfg Co Ltd | 封裝體及控制封裝體翹曲的方法 |
CN109389903A (zh) * | 2017-08-04 | 2019-02-26 | 京东方科技集团股份有限公司 | 柔性基板及其加工方法、加工系统 |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI249470B (en) * | 2005-03-09 | 2006-02-21 | Univ Nat Central | Structure and method of thermal stress compensation |
US9616223B2 (en) * | 2005-12-30 | 2017-04-11 | Medtronic, Inc. | Media-exposed interconnects for transducers |
US7470599B2 (en) * | 2006-04-14 | 2008-12-30 | Applied Materials, Inc. | Dual-side epitaxy processes for production of nitride semiconductor structures |
US7593189B2 (en) * | 2006-06-30 | 2009-09-22 | Seagate Technology Llc | Head gimbal assembly to reduce slider distortion due to thermal stress |
US7732888B2 (en) * | 2007-04-16 | 2010-06-08 | Qimonda Ag | Integrated circuit, method for manufacturing an integrated circuit, memory cell array, memory module, and device |
US8461681B2 (en) * | 2007-04-27 | 2013-06-11 | Medtronic, Inc. | Layered structure for corrosion resistant interconnect contacts |
JP2008281351A (ja) * | 2007-05-08 | 2008-11-20 | Denso Corp | 電子装置 |
JP5221066B2 (ja) * | 2007-06-26 | 2013-06-26 | リコー光学株式会社 | 膜積層基板および液晶パネル用対向基板および液晶パネル |
DE102007035858A1 (de) * | 2007-07-31 | 2009-02-05 | Qimonda Ag | Integrierte Schaltung, Verfahren zum Herstellen einer integrierten Schaltung, Speicherzellenarray, Speichermodul sowie Vorrichtung |
WO2010061364A2 (en) * | 2008-11-26 | 2010-06-03 | Freescale Semiconductor, Inc. | Electromechanical transducer device and method of forming a electromechanical transducer device |
US8736145B2 (en) * | 2008-11-26 | 2014-05-27 | Freescale Semiconductor, Inc. | Electromechanical transducer device and method of forming a electromechanical transducer device |
WO2011001293A2 (en) | 2009-06-29 | 2011-01-06 | Freescale Semiconductor, Inc. | Method of forming an electromechanical transducer device |
US20170031525A1 (en) | 2010-05-14 | 2017-02-02 | Racing Optics, Inc. | Touch screen shield |
EP2758826A1 (de) * | 2011-09-20 | 2014-07-30 | JENOPTIK Optical Systems GmbH | Optisches bauelement für den ir-bereich mit spannungskompensierter beschichtung |
US20140117559A1 (en) * | 2012-03-30 | 2014-05-01 | Paul A. Zimmerman | Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs) |
JP6304936B2 (ja) * | 2013-04-23 | 2018-04-04 | 三菱電機株式会社 | 液晶表示装置 |
JP6108609B2 (ja) * | 2013-04-25 | 2017-04-05 | クアーズテック株式会社 | 窒化物半導体基板 |
US9548284B2 (en) * | 2013-12-18 | 2017-01-17 | Intel Corporation | Reduced expansion thermal compression bonding process bond head |
US9295297B2 (en) | 2014-06-17 | 2016-03-29 | Racing Optics, Inc. | Adhesive mountable stack of removable layers |
US20180206334A1 (en) * | 2017-01-16 | 2018-07-19 | Innolux Corporation | Metal-laminated structure and high-frequency device comprising the same |
CA3128223A1 (en) | 2019-02-01 | 2020-08-06 | Racing Optics, Inc. | Thermoform windshield stack with integrated formable mold |
US11846788B2 (en) | 2019-02-01 | 2023-12-19 | Racing Optics, Inc. | Thermoform windshield stack with integrated formable mold |
US11364715B2 (en) | 2019-05-21 | 2022-06-21 | Racing Optics, Inc. | Polymer safety glazing for vehicles |
US11648723B2 (en) | 2019-12-03 | 2023-05-16 | Racing Optics, Inc. | Method and apparatus for reducing non-normal incidence distortion in glazing films |
US11289394B2 (en) | 2019-12-23 | 2022-03-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure |
US11548356B2 (en) | 2020-03-10 | 2023-01-10 | Racing Optics, Inc. | Protective barrier for safety glazing |
CN114804006A (zh) * | 2021-01-29 | 2022-07-29 | 华为技术有限公司 | 封装结构、基板、封装方法 |
US11490667B1 (en) | 2021-06-08 | 2022-11-08 | Racing Optics, Inc. | Low haze UV blocking removable lens stack |
US11307329B1 (en) | 2021-07-27 | 2022-04-19 | Racing Optics, Inc. | Low reflectance removable lens stack |
US11709296B2 (en) | 2021-07-27 | 2023-07-25 | Racing Optics, Inc. | Low reflectance removable lens stack |
US11933943B2 (en) | 2022-06-06 | 2024-03-19 | Laminated Film Llc | Stack of sterile peelable lenses with low creep |
CN114759126B (zh) * | 2022-06-13 | 2022-09-20 | 江苏第三代半导体研究院有限公司 | 基于氮化物单晶衬底的半导体器件结构及其制备方法 |
US11808952B1 (en) | 2022-09-26 | 2023-11-07 | Racing Optics, Inc. | Low static optical removable lens stack |
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US4481237A (en) * | 1981-12-14 | 1984-11-06 | United Technologies Corporation | Method of applying ceramic coatings on a metallic substrate |
US5028566A (en) * | 1987-04-10 | 1991-07-02 | Air Products And Chemicals, Inc. | Method of forming silicon dioxide glass films |
EP0445319B1 (en) * | 1990-03-05 | 1995-11-08 | International Business Machines Corporation | Process for fabricating silicon carbide films with a predetermined stress |
US5310512A (en) * | 1990-11-15 | 1994-05-10 | Norton Company | Method for producing synthetic diamond structures |
JPH07207494A (ja) * | 1993-10-15 | 1995-08-08 | Applied Materials Inc | 改良したアルミナコーティング |
KR19990077274A (ko) * | 1996-01-16 | 1999-10-25 | 알프레드 엘. 미첼슨 | 불투열 광학 디바이스 |
US6531193B2 (en) * | 1997-07-07 | 2003-03-11 | The Penn State Research Foundation | Low temperature, high quality silicon dioxide thin films deposited using tetramethylsilane (TMS) for stress control and coverage applications |
AU6237399A (en) * | 1998-05-19 | 1999-12-30 | Corning Incorporated | Negative thermal expansion materials including method of preparation and uses therefor |
TW477782B (en) * | 1998-09-29 | 2002-03-01 | Ngk Insulators Ltd | Structural body and method of producing the same |
US6164993A (en) * | 1999-02-12 | 2000-12-26 | Micron Technology, Inc. | Zero insertion force sockets using negative thermal expansion materials |
KR100352985B1 (ko) * | 1999-04-30 | 2002-09-18 | 한국과학기술연구원 | 균열이 없고 평탄한 다이아몬드막 합성 방법 |
JP3928331B2 (ja) * | 2000-05-09 | 2007-06-13 | 住友電気工業株式会社 | 光導波路デバイスおよびその製造方法 |
US7417315B2 (en) * | 2002-12-05 | 2008-08-26 | International Business Machines Corporation | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
TWI249470B (en) * | 2005-03-09 | 2006-02-21 | Univ Nat Central | Structure and method of thermal stress compensation |
-
2005
- 2005-03-09 TW TW094107086A patent/TWI249470B/zh not_active IP Right Cessation
- 2005-11-03 US US11/163,895 patent/US20060204776A1/en not_active Abandoned
- 2005-12-27 JP JP2005374983A patent/JP2006281766A/ja active Pending
-
2008
- 2008-10-07 US US12/247,215 patent/US20090029048A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI464834B (zh) * | 2011-05-11 | 2014-12-11 | Taiwan Semiconductor Mfg Co Ltd | 封裝體及控制封裝體翹曲的方法 |
CN109389903A (zh) * | 2017-08-04 | 2019-02-26 | 京东方科技集团股份有限公司 | 柔性基板及其加工方法、加工系统 |
US11430351B2 (en) | 2017-08-04 | 2022-08-30 | Boe Technology Group Co., Ltd. | Processing method and processing system of a flexible substrate |
Also Published As
Publication number | Publication date |
---|---|
TWI249470B (en) | 2006-02-21 |
US20090029048A1 (en) | 2009-01-29 |
US20060204776A1 (en) | 2006-09-14 |
JP2006281766A (ja) | 2006-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |