TW200631120A - Electrostatic chuck for vacuum bonding system - Google Patents

Electrostatic chuck for vacuum bonding system

Info

Publication number
TW200631120A
TW200631120A TW094137736A TW94137736A TW200631120A TW 200631120 A TW200631120 A TW 200631120A TW 094137736 A TW094137736 A TW 094137736A TW 94137736 A TW94137736 A TW 94137736A TW 200631120 A TW200631120 A TW 200631120A
Authority
TW
Taiwan
Prior art keywords
esc
thickness
electrostatic chuck
adsorption
glass substrate
Prior art date
Application number
TW094137736A
Other languages
English (en)
Inventor
Yoshikazu Ohtani
Takeshi Shima
Original Assignee
Shinetsu Eng Co Ltd
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Eng Co Ltd, Tomoegawa Paper Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200631120A publication Critical patent/TW200631120A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0294—Vehicle bodies
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
TW094137736A 2004-10-29 2005-10-28 Electrostatic chuck for vacuum bonding system TW200631120A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004316174A JP2008027927A (ja) 2004-10-29 2004-10-29 真空貼り合わせ装置用静電チャック

Publications (1)

Publication Number Publication Date
TW200631120A true TW200631120A (en) 2006-09-01

Family

ID=36406952

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137736A TW200631120A (en) 2004-10-29 2005-10-28 Electrostatic chuck for vacuum bonding system

Country Status (3)

Country Link
JP (1) JP2008027927A (zh)
TW (1) TW200631120A (zh)
WO (1) WO2006054406A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4976911B2 (ja) * 2007-04-27 2012-07-18 新光電気工業株式会社 静電チャック
JP2009200393A (ja) * 2008-02-25 2009-09-03 Nhk Spring Co Ltd 静電チャック及びその製造方法
JP5500076B2 (ja) * 2008-10-23 2014-05-21 旭硝子株式会社 ガラス基板積層装置及び積層ガラス基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0635870A1 (en) * 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック

Also Published As

Publication number Publication date
WO2006054406A1 (ja) 2006-05-26
JP2008027927A (ja) 2008-02-07

Similar Documents

Publication Publication Date Title
CN1258812C (zh) 半导体晶片举升装置以及实施方法
US9673028B2 (en) Arc management with voltage reversal and improved recovery
WO2004030012A3 (en) Improved bellows shield in a plasma processing system,and method of manufacture of such bellows shield
MY167045A (en) Sealed elastomer bonded si electrodes and the like for reduced particle contamination in dielectric etch
CN101983255B (zh) 包括电弧检测系统的溅射系统和方法
WO2004095502A3 (en) Plasma processing system and method
JP2009533551A (ja) 真空処理装置、バイアス電源および真空処理装置の操作方法
EP1158568A3 (en) Plasma assisted semiconductor substrate processing chamber
WO2007105166A3 (en) Semiconductor device for radiation detection
MXPA04008313A (es) Pantallas opticas de panel plano mejoradas.
WO2006074462A3 (en) Electrostatic discharge protection for embedded components
SE0302045D0 (sv) Work piece processing by pulsed electric discharges in solid-gas plasmas
TW200631120A (en) Electrostatic chuck for vacuum bonding system
KR101421483B1 (ko) 직류 전원 장치
TW200603907A (en) Method for protecting substrate
WO2006127326A3 (en) Field emission device with adjustable cathode-to-anode separation
WO2006099512A3 (en) Antireflective coating for semiconductor devices and method for the same
WO2006084143A8 (en) Wafer-scanning ion implanter having fast beam deflection apparatus for beam glitch recovery
US20200058511A1 (en) Method for releasing sample and plasma processing apparatus using same
KR101988055B1 (ko) 저압 물리적 기상 증착(ｐｖｄ) 프로세스를 위한 개선된 플라즈마 점화 성능
WO2006053240A3 (en) Local esd power rail clamp which implements switchable i/o decoupling capacitance function
EP1124240A3 (en) Vacuum switch
WO2011064958A1 (ja) 電源装置
US20080150662A1 (en) Magnetic restraining system
TW200505256A (en) Electroluminescent device with improved light decoupling