TW200629453A - Vacuum processing apparatus - Google Patents

Vacuum processing apparatus

Info

Publication number
TW200629453A
TW200629453A TW095102929A TW95102929A TW200629453A TW 200629453 A TW200629453 A TW 200629453A TW 095102929 A TW095102929 A TW 095102929A TW 95102929 A TW95102929 A TW 95102929A TW 200629453 A TW200629453 A TW 200629453A
Authority
TW
Taiwan
Prior art keywords
processing apparatus
vacuum processing
vacuum
upper cover
chamber body
Prior art date
Application number
TW095102929A
Other languages
English (en)
Other versions
TWI304241B (en
Inventor
Young-Jong Lee
Jun-Young Choi
Hyoung-Kyu Son
Jeong-Bin Lee
Gyeong-Hoon Kim
Hyung-Soo Kim
Myung-Woo Han
Original Assignee
Advanced Display Proc Eng Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050010481A external-priority patent/KR100661752B1/ko
Priority claimed from KR1020050097664A external-priority patent/KR100752934B1/ko
Priority claimed from KR1020050097621A external-priority patent/KR100773263B1/ko
Priority claimed from KR1020050097667A external-priority patent/KR100740451B1/ko
Priority claimed from KR1020050097652A external-priority patent/KR100740452B1/ko
Priority claimed from KR1020050097625A external-priority patent/KR100757693B1/ko
Priority claimed from KR1020050097642A external-priority patent/KR100757692B1/ko
Priority claimed from KR1020050097646A external-priority patent/KR100740453B1/ko
Application filed by Advanced Display Proc Eng Co filed Critical Advanced Display Proc Eng Co
Publication of TW200629453A publication Critical patent/TW200629453A/zh
Application granted granted Critical
Publication of TWI304241B publication Critical patent/TWI304241B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53687—Means to assemble or disassemble by rotation of work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
TW095102929A 2005-02-04 2006-01-25 Vacuum processing apparatus TWI304241B (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
KR1020050010481A KR100661752B1 (ko) 2005-02-04 2005-02-04 운반용 호이스트 지그
KR1020050097664A KR100752934B1 (ko) 2005-10-17 2005-10-17 진공처리장치
KR1020050097621A KR100773263B1 (ko) 2005-10-17 2005-10-17 진공처리장치
KR1020050097667A KR100740451B1 (ko) 2005-10-17 2005-10-17 진공처리장치
KR1020050097652A KR100740452B1 (ko) 2005-10-17 2005-10-17 진공처리장치
KR1020050097625A KR100757693B1 (ko) 2005-10-17 2005-10-17 진공처리장치
KR1020050097642A KR100757692B1 (ko) 2005-10-17 2005-10-17 진공처리장치
KR1020050097646A KR100740453B1 (ko) 2005-10-17 2005-10-17 진공처리장치

Publications (2)

Publication Number Publication Date
TW200629453A true TW200629453A (en) 2006-08-16
TWI304241B TWI304241B (en) 2008-12-11

Family

ID=36930736

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102929A TWI304241B (en) 2005-02-04 2006-01-25 Vacuum processing apparatus

Country Status (2)

Country Link
US (5) US20060191118A1 (zh)
TW (1) TWI304241B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107805794A (zh) * 2017-11-16 2018-03-16 温州卡耐夫电器有限公司 用于真空镀铝机的除水蒸汽结构
CN112735979A (zh) * 2020-12-24 2021-04-30 北京北方华创微电子装备有限公司 半导体工艺腔室

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI274978B (en) * 2004-02-25 2007-03-01 Advanced Display Proc Eng Co Apparatus for manufacturing flat-panel display
TWI304241B (en) * 2005-02-04 2008-12-11 Advanced Display Proc Eng Co Vacuum processing apparatus
US9441295B2 (en) 2010-05-14 2016-09-13 Solarcity Corporation Multi-channel gas-delivery system
US9240513B2 (en) * 2010-05-14 2016-01-19 Solarcity Corporation Dynamic support system for quartz process chamber
JP5451895B2 (ja) * 2010-10-07 2014-03-26 キヤノンアネルバ株式会社 基板処理装置
CN102737954A (zh) * 2011-04-07 2012-10-17 陈群 一种用于减少电子元件制造工具机体的方法及设备
JP2013229373A (ja) * 2012-04-24 2013-11-07 Tokyo Electron Ltd 基板処理装置及びそのメンテナンス方法
US9016675B2 (en) * 2012-07-06 2015-04-28 Asm Technology Singapore Pte Ltd Apparatus and method for supporting a workpiece during processing
CN104570164B (zh) * 2013-10-12 2016-08-10 江苏格林视通光学有限公司 一种新型镀膜机内用镜片托架
DE102014011877B4 (de) * 2014-08-11 2021-08-05 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zur Energieeinsparung und gleichzeitigen Erhöhung der Durchlaufgeschwindigkeit bei Vakuum-Beschichtungsanlagen
JP2017518626A (ja) 2015-02-17 2017-07-06 ソーラーシティ コーポレーション 太陽電池の製造歩留まりを向上させる方法及びシステム
US20160359080A1 (en) 2015-06-07 2016-12-08 Solarcity Corporation System, method and apparatus for chemical vapor deposition
US9748434B1 (en) 2016-05-24 2017-08-29 Tesla, Inc. Systems, method and apparatus for curing conductive paste
US9954136B2 (en) 2016-08-03 2018-04-24 Tesla, Inc. Cassette optimized for an inline annealing system
US10115856B2 (en) 2016-10-31 2018-10-30 Tesla, Inc. System and method for curing conductive paste using induction heating

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US2415259A (en) 1944-06-14 1947-02-04 Weather Seal Inc Adjustable jig
US3549190A (en) * 1968-07-03 1970-12-22 Robert H Caldwell Cable reel sling
US4542928A (en) * 1983-04-21 1985-09-24 Fowler Jr Aubrey A Crane/hoist forklift-type lifting apparatus
US5163726A (en) 1991-10-15 1992-11-17 Bromma, Inc. Spreader bar and overheight attachment with automatic latching mechanism
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
JP3527450B2 (ja) * 1999-12-22 2004-05-17 東京エレクトロン株式会社 処理装置
US6719851B1 (en) * 2000-09-26 2004-04-13 Applied Materials, Inc. Lid assembly for opening a process chamber lid and uses therefor
US6889627B1 (en) * 2001-08-08 2005-05-10 Lam Research Corporation Symmetrical semiconductor reactor
JP4908738B2 (ja) * 2002-01-17 2012-04-04 サンデュー・テクノロジーズ・エルエルシー Ａｌｄ方法
US6866746B2 (en) 2002-01-26 2005-03-15 Applied Materials, Inc. Clamshell and small volume chamber with fixed substrate support
US6954585B2 (en) * 2002-12-03 2005-10-11 Tokyo Electron Limited Substrate processing method and apparatus
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
ATE468421T1 (de) * 2003-06-27 2010-06-15 Sundew Technologies Llc Vorrichtung und verfahren zur steuerung des dampfdrucks einer chemikalienquelle
EP1661161A2 (en) * 2003-08-07 2006-05-31 Sundew Technologies, LLC Perimeter partition-valve with protected seals
US7335277B2 (en) * 2003-09-08 2008-02-26 Hitachi High-Technologies Corporation Vacuum processing apparatus
JP4654200B2 (ja) * 2003-11-17 2011-03-16 ダウ・コーニング・コーポレイション 硬化されたシリコーン樹脂基材のエンボス加工方法
TWI274978B (en) * 2004-02-25 2007-03-01 Advanced Display Proc Eng Co Apparatus for manufacturing flat-panel display
EP1771598B1 (en) * 2004-06-28 2009-09-30 Cambridge Nanotech Inc. Atomic layer deposition (ald) system and method
US20060071384A1 (en) * 2004-10-06 2006-04-06 Advanced Display Process Engineering Co. Ltd. Apparatus for manufacturing flat-panel display
TWI304241B (en) * 2005-02-04 2008-12-11 Advanced Display Proc Eng Co Vacuum processing apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107805794A (zh) * 2017-11-16 2018-03-16 温州卡耐夫电器有限公司 用于真空镀铝机的除水蒸汽结构
CN107805794B (zh) * 2017-11-16 2024-03-15 温州卡耐夫电器有限公司 用于真空镀铝机的除水蒸汽结构
CN112735979A (zh) * 2020-12-24 2021-04-30 北京北方华创微电子装备有限公司 半导体工艺腔室

Also Published As

Publication number Publication date
US20100089531A1 (en) 2010-04-15
US8187384B2 (en) 2012-05-29
US20060191118A1 (en) 2006-08-31
US8349082B2 (en) 2013-01-08
US8075691B2 (en) 2011-12-13
TWI304241B (en) 2008-12-11
US20100086381A1 (en) 2010-04-08
US20100086382A1 (en) 2010-04-08
US8152926B2 (en) 2012-04-10
US20100086383A1 (en) 2010-04-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees